out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can
reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such ap-
plications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.
- www.issi.com
Rev. A
04/08/2011
1
IS42VM81600E / IS42VM16800E / IS42VM32400E
IS45VM81600E / IS45VM16800E / IS45VM32400E
ISSI’s 128Mb SDRAM is a high speed CMOS, dynamic random-access memory designed to operate in 1.8V V
DD
/
V
DDQ
memory systems containing 134,271,728 bits. Internally configured as a quad-bank DRAM with a synchronous
interface. The 128Mb SDRAM includes an AUTO REFRESH MODE, and a power-saving, power-down mode. All
signals are registered on the positive edge of the clock signal, CLK. All inputs and outputs are LVCMOS (V
DD
= 1.8V)
compatible. The 128Mb SDRAM has the ability to synchronously burst data at a high data rate with automatic column-
address generation, the ability to interleave between internal banks to hide precharge time and the capability to
randomly change column addresses on each clock cycle during burst access.
A self-timed row precharge initiated at the end of the burst sequence is available with the AUTO PRECHARGE
function enabled. Precharge one bank while accessing one of the other three banks will hide the precharge cycles
and provide seamless, high-speed, random-access operation. SDRAM read and write accesses are burst oriented
starting at a selected location and continuing for a programmed number of locations in a programmed sequence. The
registration of an Active command begins accesses, followed by a Read or Write command. The ACTIVE command
in conjunction with address bits registered are used to select the bank and row to be accessed (BA0, BA1 select the
bank; A0-A11 (x8, x16 and x32) select the row). The READ or WRITE commands in conjunction with address bits
registered are used to select the starting column location for the burst access. Programmable READ or WRITE burst
lengths consist of 1, 2, 4 and 8 locations, or full page, with a burst terminate option.
General Description
Functional Block Diagram (8Mx16)
CLK
CKE
CS
RAS
CAS
WE
DQML
DQMH
16
2
COMMAND
DECODER
&
CLOCK
GENERATOR
DATA IN
BUFFER
16
MODE
REGISTER
12
REFRESH
CONTROLLER
DQ 0-15
SELF
REFRESH
CONTROLLER
A10
A11
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
BA0
BA1
12
16
DATA OUT
BUFFER
V
DD
/V
DDQ
V
ss
/V
ss
Q
16
REFRESH
COUNTER
4096
4096
4096
4096
ROW DECODER
MULTIPLEXER
12
MEMORY CELL
ARRAY
ROW
ADDRESS
LATCH
12
ROW
ADDRESS
BUFFER
BANK 0
SENSE AMP I/O GATE
COLUMN
ADDRESS LATCH
9
512
(x 16)
BANK CONTROL LOGIC
BURST COUNTER
COLUMN
ADDRESS BUFFER
COLUMN DECODER
9
2
Integrated Silicon Solution, Inc.
- www.issi.com
Rev. A
04/08/2011
IS42VM81600E / IS42VM16800E / IS42VM32400E
IS45VM81600E / IS45VM16800E / IS45VM32400E
PIN CONFIGURATIONS
54 pin TSOP - Type II for x8
V
DD
DQ0
V
DD
Q
NC
DQ1
V
SS
Q
NC
DQ2
V
DD
Q
NC
DQ3
V
SS
Q
NC
V
DD
NC
WE
CAS
RAS
CS
BA0
BA1
A10
A0
A1
A2
A3
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
V
SS
DQ7
V
SS
Q
NC
DQ6
V
DD
Q
NC
DQ5
V
SS
Q
NC
DQ4
V
DD
Q
NC
V
SS
NC
DQM
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
V
SS
PIN DESCRIPTIONS: 16Mx8
A0-A11
A0-A9
BA0, BA1
DQ0 to DQ7
CLK
CKE
CS
RAS
CAS
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
WE
DQM
V
dd
Vss
V
ddq
Vss
q
NC
Write Enable
Data Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
Integrated Silicon Solution, Inc.
- www.issi.com
Rev. A
04/08/2011
3
IS42VM81600E / IS42VM16800E / IS42VM32400E
IS45VM81600E / IS45VM16800E / IS45VM32400E
PIN CONFIGURATIONS
54 pin TSOP - Type II for x16
V
DD
DQ0
V
DD
Q
DQ1
DQ2
V
SS
Q
DQ3
DQ4
V
DD
Q
DQ5
DQ6
V
SS
Q
DQ7
V
DD
DQML
WE
CAS
RAS
CS
BA0
BA1
A10
A0
A1
A2
A3
V
DD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
V
SS
DQ15
V
SS
Q
DQ14
DQ13
V
DD
Q
DQ12
DQ11
V
SS
Q
DQ10
DQ9
V
DD
Q
DQ8
V
SS
NC
DQMH
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
V
SS
PIN DESCRIPTIONS: 8Mx16
A0-A11
A0-A8
BA0, BA1
DQ0 to DQ15
CLK
CKE
CS
RAS
CAS
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
WE
DQML
DQMH
V
dd
Vss
V
ddq
Vss
q
NC
Write Enable
x16 Lower Byte, Input/Output Mask
x16 Upper Byte, Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
4
Integrated Silicon Solution, Inc.
- www.issi.com
Rev. A
04/08/2011
IS42VM81600E / IS42VM16800E / IS42VM32400E
IS45VM81600E / IS45VM16800E / IS45VM32400E
PIN CONFIGURATION
54-ball fBGA for x16 (Top View) (8.00 mm x 8.00 mm Body, 0.8 mm Ball Pitch)
SMT贴片机是表面贴装技术（Surface Mount Technology）中的重要设备，它的性能状态对电子制造的质量和效率有着决定性的影响。因此，对SMT贴片机的主要指标性能进行定期检测非常重要。以下是一些主要的检测项目： 定位精度：定位精度是SMT贴片机的核心性能指标，它直接影响到贴片的准确性。通常，我们通过重复测量贴片机在X、Y轴上的移动误差来检测其定位精度。 贴片速度：贴片速度...[详细]
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