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IS61LF25636A-6.5B2

产品描述Cache SRAM, 256KX36, 6.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119
产品类别存储    存储   
文件大小202KB,共32页
制造商Integrated Silicon Solution ( ISSI )
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IS61LF25636A-6.5B2概述

Cache SRAM, 256KX36, 6.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119

IS61LF25636A-6.5B2规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码BGA
包装说明14 X 22 MM, PLASTIC, BGA-119
针数119
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间6.5 ns
其他特性FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK)133 MHz
I/O 类型COMMON
JESD-30 代码R-PBGA-B119
JESD-609代码e0
长度22 mm
内存密度9437184 bit
内存集成电路类型CACHE SRAM
内存宽度36
湿度敏感等级3
功能数量1
端子数量119
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX36
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA119,7X17,50
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源2.5/3.3,3.3 V
认证状态Not Qualified
座面最大高度3.5 mm
最大待机电流0.045 A
最小待机电流3.14 V
最大压摆率0.185 mA
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm
Base Number Matches1

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IS61LF25636A
IS61LF51218A
IS61VF25636A
IS61VF51218A
ISSI
MAY 2005
®
256K x 36, 512K x 18
9 Mb SYNCHRONOUS FLOW-THROUGH
STATIC RAM
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth expan-
sion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Single cycle deselect
• Snooze MODE for reduced-power standby
• JTAG Boundary Scan for PBGA package
• Power Supply
LF: V
DD
3.3V + 5%, V
DDQ
3.3V/2.5V + 5%
VF: V
DD
2.5V + 5%, V
DDQ
2.5V + 5%
• JEDEC 100-Pin TQFP, 119-pin PBGA, and
165-pin PBGA packages
• Lead-free available
DESCRIPTION
The
ISSI
IS61LF/VF25636A and IS61LF/VF51218A are
high-speed, low-power synchronous static RAMs designed
to provide burstable, high-performance memory for commu-
nication and networking applications. The IS61LF/
VF25636A is organized as 262,144 words by 36 bits. The
IS61LF/VF51218A is organized as 524,288 words by 18
bits. Fabricated with
ISSI
's advanced CMOS technology,
the device integrates a 2-bit burst counter, high-speed
SRAM core, and high-drive capability outputs into a single
monolithic circuit. All synchronous inputs pass through
registers controlled by a positive-edge-triggered single
clock input.
Write cycles are internally self-timed and are initiated by
the rising edge of the clock input. Write cycles can be one
to four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written.
Byte write operation is performed by using byte write
enable (BWE) input combined with one or more individual
byte write signals (BWx). In addition, Global Write (GW) is
available for writing all bytes at one time, regardless of the
byte write controls.
Bursts can be initiated with either
ADSP
(Address Status
Processor) or
ADSC
(Address Status Cache Controller)
input pins. Subsequent burst addresses can be generated
internally and controlled by the
ADV
(burst address ad-
vance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW.
Interleave burst is achieved when this pin is tied HIGH or
left floating.
FAST ACCESS TIME
Symbol
t
KQ
t
KC
Parameter
Clock Access Time
Cycle Time
Frequency
-6.5
6.5
7.5
133
-7.5
7.5
8.5
117
Units
ns
ns
MHz
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. A
05/04/05
1

 
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