Cache SRAM Module, 64KX36, 5.5ns, CMOS, DIMM-144
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIMM |
| 包装说明 | DIMM-144 |
| 针数 | 144 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 5.5 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-XDMA-N144 |
| JESD-609代码 | e0 |
| 内存密度 | 2359296 bit |
| 内存集成电路类型 | CACHE SRAM MODULE |
| 内存宽度 | 36 |
| 功能数量 | 1 |
| 端子数量 | 144 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX36 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIMM |
| 封装等效代码 | DIMM144,32 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 最小待机电流 | 3.14 V |
| 最大压摆率 | 0.35 mA |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |

| CYM9275PM-100C | CYM9277BPM-133C | CYM9275PM-133C | CYM9278PM-133C | CYM9276APM-100C | CYM9276APM-133C | CYM9277BPM-100C | CYM9278PM-100C | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Cache SRAM Module, 64KX36, 5.5ns, CMOS, DIMM-144 | Cache SRAM Module, 256KX36, 4.5ns, CMOS, DIMM-144 | Cache SRAM Module, 64KX36, 4.5ns, CMOS, DIMM-144 | Cache SRAM Module, 512KX36, 4.5ns, CMOS, DIMM-144 | Cache SRAM Module, 128KX36, 5.5ns, CMOS, DIMM-144 | Cache SRAM Module, 128KX36, 4.5ns, CMOS, DIMM-144 | Cache SRAM Module, 256KX36, 5.5ns, CMOS, DIMM-144 | Cache SRAM Module, 512KX36, 5.5ns, CMOS, DIMM-144 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 包装说明 | DIMM-144 | DIMM-144 | DIMM-144 | DIMM-144 | DIMM-144 | DIMM-144 | DIMM-144 | DIMM-144 |
| 针数 | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 5.5 ns | 4.5 ns | 4.5 ns | 4.5 ns | 5.5 ns | 4.5 ns | 5.5 ns | 5.5 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 2359296 bit | 9437184 bit | 2359296 bit | 18874368 bit | 4718592 bit | 4718592 bit | 9437184 bit | 18874368 bit |
| 内存集成电路类型 | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE |
| 内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 144 | 144 | 144 | 144 | 144 | 144 | 144 | 144 |
| 字数 | 65536 words | 262144 words | 65536 words | 524288 words | 131072 words | 131072 words | 262144 words | 524288 words |
| 字数代码 | 64000 | 256000 | 64000 | 512000 | 128000 | 128000 | 256000 | 512000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 64KX36 | 256KX36 | 64KX36 | 512KX36 | 128KX36 | 128KX36 | 256KX36 | 512KX36 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
| 封装等效代码 | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 | DIMM144,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最小待机电流 | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 最大压摆率 | 0.35 mA | 1 mA | 0.35 mA | 1.2 mA | 0.5 mA | 0.5 mA | 1 mA | 1.2 mA |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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