Power Field-Effect Transistor, 10A I(D), 400V, 0.55ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, METAL PACKAGE-6
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
包装说明 | FLATPACK, R-MDFP-F6 |
针数 | 6 |
Reach Compliance Code | compliant |
其他特性 | HIGH RELIABILITY |
外壳连接 | ISOLATED |
配置 | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
最小漏源击穿电压 | 400 V |
最大漏极电流 (ID) | 10 A |
最大漏源导通电阻 | 0.55 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码 | R-MDFP-F6 |
JESD-609代码 | e0 |
元件数量 | 2 |
端子数量 | 6 |
工作模式 | ENHANCEMENT MODE |
最高工作温度 | 150 °C |
封装主体材料 | METAL |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | 235 |
极性/信道类型 | N-CHANNEL |
最大脉冲漏极电流 (IDM) | 40 A |
认证状态 | Not Qualified |
表面贴装 | YES |
端子面层 | TIN LEAD |
端子形式 | FLAT |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
Base Number Matches | 1 |
OM6240SMV | OM6241SDT | OM6241SMV | OM6238SDT | OM6239SDT | OM6235SMV | |
---|---|---|---|---|---|---|
描述 | Power Field-Effect Transistor, 10A I(D), 400V, 0.55ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, METAL PACKAGE-6 | Power Field-Effect Transistor, 8A I(D), 500V, 0.85ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, METAL PACKAGE-6 | Power Field-Effect Transistor, 8A I(D), 500V, 0.85ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, METAL PACKAGE-6 | Power Field-Effect Transistor, 14A I(D), 100V, 0.095ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, METAL PACKAGE-6 | Power Field-Effect Transistor, 14A I(D), 200V, 0.18ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, METAL PACKAGE-6 | Power Field-Effect Transistor, 9A I(D), 200V, 0.4ohm, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, METAL PACKAGE-6 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | FLATPACK, R-MDFP-F6 | FLATPACK, R-MDFP-F6 | FLATPACK, R-MDFP-F6 | FLATPACK, R-MDFP-F6 | FLATPACK, R-MDFP-F6 | FLATPACK, R-MDFP-F6 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
其他特性 | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY |
外壳连接 | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED |
配置 | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE |
最小漏源击穿电压 | 400 V | 500 V | 500 V | 100 V | 200 V | 200 V |
最大漏极电流 (ID) | 10 A | 8 A | 8 A | 14 A | 14 A | 9 A |
最大漏源导通电阻 | 0.55 Ω | 0.85 Ω | 0.85 Ω | 0.095 Ω | 0.18 Ω | 0.4 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JESD-30 代码 | R-MDFP-F6 | R-MDFP-F6 | R-MDFP-F6 | R-MDFP-F6 | R-MDFP-F6 | R-MDFP-F6 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
元件数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 6 | 6 | 6 | 6 | 6 | 6 |
工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
封装主体材料 | METAL | METAL | METAL | METAL | METAL | METAL |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
峰值回流温度(摄氏度) | 235 | NOT SPECIFIED | 235 | 235 | 235 | 235 |
极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
最大脉冲漏极电流 (IDM) | 40 A | 32 A | 32 A | 56 A | 56 A | 36 A |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | YES | YES | YES | YES |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | 30 | 30 | 30 |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
针数 | 6 | 6 | - | 6 | 6 | 6 |
Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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