LWH1033N
-
CONTENTS
-
1. Features
2. Package Outline Dimensions
3. Package material
4. Absolute Maximum Ratings
5. Electrical Optical Characteristics
6. Ranks
7. Taping
8. Packing Structure
9. Characteristic Diagrams
10. Reliability
11. Cautions
12. Warranty
13. Others
14. Revision history sheet
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LWH1033N
1. Features
•
Package : SMD Top View Type(3Chips In 1)
•
3.5 × 2.8 × 1.8 mm(L×W×H) small size surface mount type
•
Color Coordinates : x = 0.31, y = 0.32 acc. to CIE 1931, at I
F
=60mA
•
Viewing angle : extremely wide(120˚)
•
Technology : InGaN
•
Soldering methods : I
R
reflow soldering
•
Taping : 8 mm conductive black carrier tape & antistatic clear cover tape.
2,000pcs/reel, Φ180 mm whee
l
2. Outline dimensions
(unit : mm)
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LWH1033N
3. Package material
(1) Material construction
Number
1
2
3
4
5
Item
LED Chip
Gold Wire
Lead Frame
Epoxy or Silicon Resin
Heat-Resistant Polymer
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LWH1033N
4. Absolute Maximum Ratings
Parameter
Power dissipation
Forward Current
*
1
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Reflow Soldering Temperature
Symbol
P
D
I
F
I
FP
V
R
T
opr
T
stg
T
sol
Value
240
60
300
5
-30∼+85
-40∼+100
(Ta = 25℃)
Unit
mW
mA
mA
V
℃
℃
Reflow Soldering : 260℃ for 10 sec.
Hand Soldering : 350℃ for 3 sec.
*
1
.Duty ratio
≦
1/10, Pulse Width
≦
10msec.
* These values are based on 3-die performance.
5. Electrical - Optical Characteristics
Characteristic
Reverse Current
*
2
Half Angle
Symbol
I
R
θ1/2
Test Condition
V
R
=5V
I
F
= 60mA
Min.
-
-
Typ.
-
±60
10
-
(Ta = 25℃)
Max.
Unit
uA
deg
*2.
θ
1/2
is the off-axis angle where the luminous intensity is
1/2
the peak intensity
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LWH1033N
6. Ranks
(1) Chromaticity Coordinates ranks
Rank A
x
y
0.270
0.235
0.270
0.285
0.290
0.265
0.290
0.315
x
y
0.290
0.265
(I
F
=60mA, Ta=25℃)
Rank B
0.290
0.315
0.310
0.295
0.310
0.345
Rank C
x
y
0.310
0.295
0.310
0.345
0.330
0.325
0.330
0.375
* The CIE(1931) standard colorimetric system
*
Chromaticity coordinates Measured : 0.01sr(CIE. LED_
B
)
*
Measurement Uncertainty of the Color Coordinates : ±0.01
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