LWH1000
-
CONTENTS
-
1. Features
2. Outline dimensions
3. Package material
4. Absolute Maximum Ratings
5. Electrical Optical Characteristics
6. Ranks
7. Taping
8. Packing Structure
9. Characteristic Diagrams
10. Precautions to taken
11. Reliability
12. Precautions in use
13. Revision history sheet
Different and Better
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LWH1000
1. Features
•
Package : SMD package1000
•
1.6×0.8×0.4 mm(L×W×H) small size surface mount type
•
Color Coordinates : X = 0.30, Y = 0.30 acc. to CIE 1931, at I
F
=3mA
•
Viewing angle : extremely wide(160˚)
•
Technology : InGaN
•
Soldering methods : IR reflow soldering
•
Taping : 8 mm conductive black carrier tape & antistatic clear cover tape.
5000pcs/reel, Φ180 mm whee
l
2. Outline dimensions
(unit : mm)
Different and Better
2/15
LWH1000
3. Package material
(1) Material construction
Number
1
2
3
4
5
Item
PCB
Die adhesive
LED chip
Au wire
Mold epoxy
Material
C3965
Epoxy
GaN/Sapphire
1.0mil
Clear Epoxy + Phosphor
Different and Better
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LWH1000
4. Absolute Maximum Ratings
Parameter
Power dissipation
Forward Current
*
1
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
*
2
Soldering Temperature
Symbol
P
D
I
F
I
FP
V
R
T
opr
T
stg
T
sol
Value
70
20
100
5
-30∼+85
-40∼+100
240℃ for 5 seconds
Unit
mW
mA
mA
V
℃
℃
*
1
.Duty ratio
≦
1/10, Pulse Width
≦
10msec.
*2.Mounted on PC board FR4(pad size ≥ 16 ㎟)
5. Electrical Optical Characteristics
Characteristic
ESD Check Forward Voltage
Reverse Current
*
6
Half Angle
Symbol
V
F2
I
R
θ1/2
Test Condition
I
F
= 10uA
V
R
=5V
I
F
= 20mA
Min.
2.0
-
-
Typ.
-
-
±80
3.0
10
-
(Ta = 25℃)
Max.
Unit
V
uA
deg
*6.
θ
1/2
is the off-axis angle where the luminous intensity is
1/2
the peak intensity
Different and Better
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LWH1000
6. Ranks
(1) Chromaticity Coordinates ranks
Rank A
x
y
0.28
0.26
0.28
0.30
0.30
0.29
0.30
0.33
0.30
0.29
Rank B
0.30
0.33
0.32
0.32
0.32
0.36
0.32
0.32
Rank C
0.32
0.36
0.34
0.35
0.34
0.39
(Ta=25℃)
C
B
A
Different and Better
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