Model: FXO-HC53 SERIES
HCMOS 5 x 3.2mm 3.3V Oscillator
Features
X
TREMELY
Low Jitter
Low Cost
X
PRESS
Delivery
Frequency Resolution to six decimal places
Stabilities to ± 20 PPM
-20 to +70°C or -40 to +85°C operating temperatures
Tri-State, Enable / Disable Feature
Industry Standard Package, Footprint, & Pin-Out
Fully RoHS compliant
Gold over Nickel Termination Finish
Serial ID with Comprehensive Traceability
V
DD
Enable / Disable
Freq: 0.75 MHz to 250MHz
Rev. 11/28/2007
Applications
•
•
•
•
•
•
•
•
•
ANY application requiring an oscillator
SONET
Ethernet
Storage Area Network
Broadband Access
Microprocessors / DSP / FPGA
Industrial Controllers
Test and Measurement Equipment
Fiber Channel
X
PRESS
O
ASICs
GND
FOX
OUTPUT
For more information -- Click on the drawing
Contents
page
Description
The Fox X
PRESS
O Crystal Oscillator is a
breakthrough in configurable Frequency Control
Solutions. X
PRESS
O utilizes a family of
proprietary ASICs, designed and developed by
Fox, with a key focus on noise reduction
technologies.
The 3
rd
order Delta Sigma Modulator reduces
noise to the levels that are comparable to
traditional Bulk Quartz and SAW oscillators.
The ASICs family has ability to select the output
wave forms, input voltages, and temperature
performance features.
With the X
PRESS
lead-time, low cost, low noise,
wide frequency range, excellent ambient
performance, XpressO is an excellent choice
over the conventional technologies.
Finished X
PRESS
O parts are 100% final tested.
Model Selection & Part Number Guide
2
Electrical Characteristic
2
Absolute Maximums
3
Output Wave Characteristics
3
Phase Noise
4
Jitter
4
Pin Assignment
5
Recommended Circuit
5
Mechanical Drawing and Pad Layout
6
Re-Flow
6
Tape and Reel Specification
7
Label
7
Traceability – LOT Number & Serial Identification 8
RoHS Material Declaration
9
SGS Report
10 & 11
Mechanical Test
12
Burn-In Test
12
MTTF / FITS calculations
13
14
Other X
PRESS
O Links
Fox Contact Information
14
Page 1 of 14
FOXElectronics
5570 Enterprise Parkway Fort Myers, Florida 33905 USA +1.239.693.0099 FAX +1.239.693.1554 http://www.foxonline.com
EMEA
Tel/Fax: +44 .1767.312632 |
Asia
Hong Kong Tel: +852.2854.4285 Fax +852.2854.4282
Taiwan
Tel: +886.2.22073427 Fax +886.2.22073486 |
Japan
Tel: +81.3.3374/2079 Fax: +81.3.3374.5221
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FXO-HC53
Series
Model Selection Guide & Fox Part Number
STEP #1:
Customer selects the Model Description and provides to Fox Customer Service
Model Description
FXO – H C 5 3 6 R – 106.25
Frequency (in MHz)
Resolutions to 6 places
past the decimal point
H
= HCMOS
L
= LVDS
P
= LVPECL
C
= Ceramic
Q
= Quartz
5
= 5 x 3.2mm
7
= 7 x 5mm
3
= 3.3 V
2
= 2.5 V
M
= LVDS
(pin 2 E/D)
Q
= LVPECL
(pin 2 E/D)
X
= HCMOS
(comp 2
nd
Output)
0
= ± 100 PPM
5
= ± 50 PPM
6
= ± 25 PPM
8
= ± 20 PPM
(-20 ~ +70°C)
blank
= -20°C to +70°C
R
= -40°C to +85°C
STEP #2:
The Fox Customer Service team provides a customer specific Part Number
for use on their Bill Of Materials (BOM).
Fox Part Number
The 1
st
Field
(The assigned Fox Part Number must be on the BOM – not the above Model Description)
(This will ensure receipt of the proper part)
Product Code #
The 3
rd
Field
767 = FXO–HC5
Fox Internally Generated Number
768 = FXO–HC7
(If any specification changes,
770 = FXO–LC5
the last digits change)
nd
771 = FXO–LC7
The 2 Field
(The same specs for a different customer
773 = FXO–PC5
The Customer’s Frequency
also changes the last digits)
774 = FXO–PC7
This example,
FXO-HC536R-106.25
= HCMOS Output, Ceramic 5 x 3.2mm Package, 3.3V,
±25 PPM Stability, -40 to +85°C Temperature Range, at 106.25 MHz
767–106
.
25–8
Electrical Characteristics
Parameters
Frequency Range
Frequency Stability
1
Temperature Range
Supply Voltage
T
STG
V
DD
Symbol
F
O
T
O
Condition
Maximum Value
(unless otherwise noted)
Input Current
(@ 15pF LOAD)
I
DD
Output Load
Start-Up Time
Output Enable / Disable Time
Moisture Sensitivity Level
Termination Finish
HCMOS
T
S
MSL
Standard operating
Optional operating
Storage
Standard
0.75 ~ 20 MHz
20+ ~ 50 MHz
50+ ~ 130 MHz
130+ ~ 200 MHz
200+ ~ 250 MHz
Standard
Operational To 125MHz
JEDEC J-STD-20
0.750 to 250.000 MHz
100, 50, 25, & 20 ppm
-20°C to +70°C
-40°C to +85°C
-55°C to +125°C
3.3 V ± 5%
30 mA
33 mA
44 mA
53 mA
58 mA
15 pF
30 pF
10 mS
100 nS
1
Au
Note 1 – Stability is inclusive of 25°C tolerance, operating temperature range, input voltage change, load change, aging, shock and vibration.
Page
2 of 14
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FXO-HC53
Series
Absolute Maximum Ratings
(Useful life may be impaired.
Parameters
Input Voltage
Operating Temperature
Storage Temperature
Junction Temperature
ESD Sensitivity
For user guidelines only, not tested)
Symbol
V
DD
T
AMAX
T
STG
HBM
Condition
Maximum Value
(unless otherwise noted)
Human Body Model
–0.5V to +5.0V
–55°C to +105°C
–55°C to +125°C
150°C
>
2.5 kV
Output Wave Characteristics
Parameters
Output LOW Voltage
Output HIGH Voltage
Output Symmetry
(See Drawing Below)
Output Enable
(PIN # 1)
Voltage
Output Disable
(PIN # 1)
Voltage
Cycle Rise Time
(See Drawing Below)
Cycle Fall Time
(See Drawing Below)
V
IH
V
IL
T
R
T
F
0.75 to 150 MHz
150+ to 250 MHz
0.75 to 150 MHz
150+ to 250 MHz
Symbol
V
OL
V
OH
Condition
0.75 to 130 MHz
130+ to 250 MHz
0.75 to 130 MHz
130+ to 250 MHz
@ 50% V
DD
Level
Maximum Value
(unless otherwise noted)
10% V
DD
20% V
DD
90% V
DD
MIN
80% V
DD
MIN
45% ~ 55%
> 70% V
DD
< 30% V
DD
2 nS
(20%~80%)
3 nS
(20%~80%)
2 nS
(80%~20%)
3 nS
(80%~20%)
If 30% to 70% times are used, Rise and Fall times change to ___nS to 150MHz and ___nS 150 to 250MHz
If 10% to 90% times are used, Rise and Fall times change to 3 nS to 150MHz
Still Measuring
Rise Time / Fall Time Measurements
10% to 90%
0V to Vdd
20% to 80%
30% to 70%
10% - 90%
Rise Time
On Time
1/2 Period
90% - 10%
Fall Time
80 - 20
Times
70 - 30
Times
Oscillator Symmetry
Off Time
1/2 Period
50%
0V to Vdd
Period
Ideally, Symmetry should be 50/50 -- Other expressions are 45/55 or 55/45
Page
3 of 14
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FXO-HC53
Series
Phase Noise
0 dBc
-1 0 d B c
-2 0 d B c
-3 0 d B c
-4 0 d B c
-5 0 d B c
-6 0 d B c
-7 0 d B c
-8 0 d B c
-9 0 d B c
-1 0 0 d B c
-1 1 0 d B c
-1 2 0 d B c
-1 3 0 d B c
-1 4 0 d B c
-1 5 0 d B c
-1 6 0 d B c
6 2 .5 M H z
1 5 6 .2 5 M H z
1 0 6 .2 5 M H z
1 0 6 .2 5 M H z
1 5 6 .2 5 M H z
6 2 .5 M H z
P h a s e N o is e G ra p h
(d B c / H z ) v s . o ffs e t fre q u e n c y
D a ta C o lle c te d u s in g H P 3 0 4 8 A
T h re e F re q u e n c ie s fro m J itte r T a b le s
10
100
1k
10k
62.5MHz only graphed to
M
2MHz offset
1 0 M
to equipment limitations
due
100k
1
the
40M
O ffs e t F re q u e n c y
(1 0 H z to 4 0 M H z )
Jitter is frequency dependent. Below are typical values at select frequencies.
Phase Jitter & Time Interval Error (TIE)
Frequency
62.5 MHz
106.25 MHz
125 MHz
156.25 MHz
Phase Jitter
(12kHz to 20MHz)
TIE
(Sigma of Jitter Distribution)
Units
pS RMS
pS RMS
pS RMS
pS RMS
0.93
0.86
0.75
0.77
2.8
3.2
2.7
3.3
Phase Jitter
is integrated from HP3048 Phase Noise Measurement System; measured directly into 50 ohm input; V
DD
= 3.3V.
TIE
was measured on LeCroy LC684 Digital Storage Scope, directly into 50 ohm input, with Amherst M1 software; V
DD
= 3.3V.
Per
MJSQ
spec (Methodologies for Jitter and Signal Quality specifications)
Random & Deterministic Jitter Composition
Frequency
62.5 MHz
106.25 MHz
125 MHz
156.25 MHz
Random (Rj)
(pS RMS)
Deterministic (Dj)
(pS P-P)
Total Jitter (Tj)
(14 x Rj) + Dj
25.1 pS
26.6 pS
25.2 pS
26.6 pS
1.28
1.28
1.20
1.27
6.8
8.4
8.0
8.6
Rj and Dj
, measured on LeCroy LC684 Digital Storage Scope, directly into 50 ohm input, with Amherst M1 software.
Per
MJSQ
spec (Methodologies for Jitter and Signal Quality specifications)
Page
4 of 14
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FXO-HC53
Series
Pin Description and Recommended Circuit
Pin #
1
2
3
4
Test
Points
Name
E/D
GND
Output
V
DD
2
N. C.
1
2
1
Type
Logic
Ground
Output
Power
Hi Z
Function
Enable / Disable Control of Output (0 = Disabled)
Electrical Ground for V
DD
HCMOS Oscillator Output
Power Supply Source Voltage
No Connection (Factory Use ONLY)
NOTES:
Includes pull-up resistor to V
DD
to provide output when the pin (1) is No Connect.
Installation should include A 0.01µF bypass capacitor placed between V
DD
(Pin 4) and GND (Pin 2) to minimize power supply line noise.
E/D
1
N. C.
TP
4
V
DD
E/D
TP
.01 F
#1
NC
N. C
.
#4
NC
V
DD
GND
2
3
Output
GND
#2
#3
OUT
HCMOS LOAD
(15 pF)
Terminations as viewed from the Top
NOTE:
X
PRESS
O HCMOS XOs are designed to.
fit on Industry Standard, 4 pad layouts
Recommended Circuit
Enable / Disable Control
Pin # 1 (state)
OPEN
(No Connection)
“1” Level V
IH
> 70% V
DD
“0” Level V
IL
< 30% V
DD
Output (Pin # 3)
ACTIVE Output
ACTIVE Output
High Impedance
Soldering Reflow Profile
(2 times Maximum at 260°C for 10 seconds MAX)
tp
10 Seconds Max
within 5°C of 260°C peak
260°C
225°C
180°C
Ramp-Up
3°C/s Max
50±10 Seconds
Above 225°C Reflow Area
Ramp Down
Not to exceed 6°C/s
160°C
120 ± 20 Seconds
In Pre-heating Area
25°C
400 Seconds MAX from +25°C to 260°C peak
Page
5 of 14
© 2008 FOX ELECTRONICS | ISO9001:2000 Certified
FPGA/CPLD
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