Datasheet> 器件分类 > 存储> 存储> MT47H64M16HW-25EIT

文档预览

MT47H64M16HW-25EIT: 产品描述DDR DRAM,; 产品类别存储存储; 文件大小12MB，共129页; 制造商Micron Technology; 官网地址http://www.mdtic.com.tw/

下载文档详细参数选型对比全文预览

MT47H64M16HW-25EIT概述

DDR DRAM,

MT47H64M16HW-25EIT规格参数

参数名称	属性值
Reach Compliance Code	unknown
内存集成电路类型	DDR DRAM
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

1Gb: x8, x16 Automotive DDR2 SDRAM

Features

Automotive DDR2 SDRAM

MT47H128M8 – 16 Meg x 8 x 8 banks

MT47H64M16 – 8 Meg x 16 x 8 banks

Features

•

Industrial and automotive temperature compliant

= 1.8V ±0.1V, V

DDQ

= 1.8V ±0.1V

JEDEC-standard 1.8V I/O (SSTL_18-compatible)

Differential data strobe (DQS, DQS#) option

4n-bit prefetch architecture

Duplicate output strobe (RDQS) option for x8

DLL to align DQ and DQS transitions with CK

8 internal banks for concurrent operation

Programmable CAS latency (CL)

Posted CAS additive latency (AL)

WRITE latency = READ latency - 1

Programmable burst lengths (BL): 4 or 8

Adjustable data-output drive strength

32ms, 8192-cycle refresh

On-die termination (ODT)

RoHS-compliant

AEC-Q100

PPAP submisson

8D response time

Options

• Configuration

– 128 Meg x 8 (16 Meg x 8 x 8 banks)

– 64 Meg x 16 (8 Meg x 16 x 8 banks)

• FBGA package (Pb-free) – x8

– 60-ball FBGA (8mm x 10mm)

• FBGA package (Pb-free) – x16

– 84-ball FBGA (8mm x 12.5mm)

• FBGA package (lead solder) – x8

– 60-ball FBGA (8mm x 10mm)

• FBGA package (lead solder) – x16

– 84-ball FBGA (8mm x 12.5mm)

• Timing – cycle time

– 2.5ns @ CL = 5 (DDR2-800)

– 3.0ns @ CL = 5 (DDR2-667)

• Self refresh

– Standard

– Low-power

• Product certification

– Automotive

• Operating temperature

– Industrial (–40°C

≤

+95°C)

– Automotive (–40°C

≤

+105ºC)

• Revision

Note:

Marking

128M8

64M16

HR, RP

-25E

-3

None

1. Not all options listed can be combined to

define an offered product. Use the Part

Catalog Search on

www.micron.com

for

product offerings and availability.

Table 1: Key Timing Parameters

Data Rate (MT/s)

Speed Grade

-25E

-25

-3

CL = 3

400

CL = 4

533

CL = 5

800

667

CL = 6

800

n/a

CL = 7

n/a

(ns)

PDF: 09005aef840eff89

1gbddr2_ait_aat.pdf – Rev. D 11/13 EN

Products and specifications discussed herein are subject to change by Micron without notice.

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x8, x16 Automotive DDR2 SDRAM

Features

Contents

State Diagram .................................................................................................................................................. 8

Functional Description ..................................................................................................................................... 9

Automotive Industrial Temperature ............................................................................................................... 9

Automotive Temperature ............................................................................................................................ 10

General Notes ............................................................................................................................................ 10

Functional Block Diagrams ............................................................................................................................. 11

Ball Assignments and Descriptions ................................................................................................................. 13

Packaging ...................................................................................................................................................... 17

Package Dimensions ................................................................................................................................... 17

FBGA Package Capacitance ......................................................................................................................... 19

Electrical Specifications – Absolute Ratings ..................................................................................................... 20

Temperature and Thermal Impedance ........................................................................................................ 20

Electrical Specifications – I

Parameters ........................................................................................................ 22

Specifications and Conditions ............................................................................................................... 22

DD7

Conditions .......................................................................................................................................... 23

AC Timing Operating Specifications ................................................................................................................ 27

AC and DC Operating Conditions .................................................................................................................... 39

ODT DC Electrical Characteristics ................................................................................................................... 39

Input Electrical Characteristics and Operating Conditions ............................................................................... 40

Output Electrical Characteristics and Operating Conditions ............................................................................. 43

Output Driver Characteristics ......................................................................................................................... 45

Power and Ground Clamp Characteristics ....................................................................................................... 49

AC Overshoot/Undershoot Specification ......................................................................................................... 50

Input Slew Rate Derating ................................................................................................................................ 52

Commands .................................................................................................................................................... 65

Truth Tables ............................................................................................................................................... 65

DESELECT ................................................................................................................................................. 69

NO OPERATION (NOP) ............................................................................................................................... 70

LOAD MODE (LM) ...................................................................................................................................... 70

ACTIVATE .................................................................................................................................................. 70

READ ......................................................................................................................................................... 70

WRITE ....................................................................................................................................................... 70

PRECHARGE .............................................................................................................................................. 71

REFRESH ................................................................................................................................................... 71

SELF REFRESH ........................................................................................................................................... 71

Mode Register (MR) ........................................................................................................................................ 71

Burst Length .............................................................................................................................................. 72

Burst Type .................................................................................................................................................. 73

Operating Mode ......................................................................................................................................... 73

DLL RESET ................................................................................................................................................. 73

Write Recovery ........................................................................................................................................... 74

Power-Down Mode ..................................................................................................................................... 74

CAS Latency (CL) ........................................................................................................................................ 75

Extended Mode Register (EMR) ....................................................................................................................... 76

DLL Enable/Disable ................................................................................................................................... 77

Output Drive Strength ................................................................................................................................ 77

DQS# Enable/Disable ................................................................................................................................. 77

RDQS Enable/Disable ................................................................................................................................. 77

Output Enable/Disable ............................................................................................................................... 77

On-Die Termination (ODT) ......................................................................................................................... 78

PDF: 09005aef840eff89

1gbddr2_ait_aat.pdf – Rev. D 11/13 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x8, x16 Automotive DDR2 SDRAM

Features

Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 78

Posted CAS Additive Latency (AL) ................................................................................................................ 78

Extended Mode Register 2 (EMR2) ................................................................................................................... 80

Extended Mode Register 3 (EMR3) ................................................................................................................... 81

Initialization .................................................................................................................................................. 82

ACTIVATE ...................................................................................................................................................... 85

READ ............................................................................................................................................................. 87

READ with Precharge .................................................................................................................................. 91

READ with Auto Precharge .......................................................................................................................... 93

WRITE ........................................................................................................................................................... 98

PRECHARGE ................................................................................................................................................. 108

REFRESH ...................................................................................................................................................... 109

SELF REFRESH .............................................................................................................................................. 110

Power-Down Mode ........................................................................................................................................ 112

Precharge Power-Down Clock Frequency Change ........................................................................................... 119

Reset ............................................................................................................................................................. 120

CKE Low Anytime ...................................................................................................................................... 120

ODT Timing .................................................................................................................................................. 122

MRS Command to ODT Update Delay ........................................................................................................ 124

Revision History ............................................................................................................................................ 129

Rev. D – 11/13 ............................................................................................................................................ 129

Rev. C – 07/11 ............................................................................................................................................ 129

Rev. B – 06/11 ............................................................................................................................................ 129

Rev. A – 11/10 ............................................................................................................................................ 129

PDF: 09005aef840eff89

1gbddr2_ait_aat.pdf – Rev. D 11/13 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1Gb: x8, x16 Automotive DDR2 SDRAM

Features

List of Tables

Table 1: Key Timing Parameters ....................................................................................................................... 1

Table 2: Addressing ......................................................................................................................................... 2

Table 3: FBGA 84-Ball – x16 and 60-Ball – x8 Descriptions ............................................................................... 15

Table 4: Input Capacitance ............................................................................................................................ 19

Table 5: Absolute Maximum DC Ratings ......................................................................................................... 20

Table 6: Temperature Limits .......................................................................................................................... 21

Table 7: Thermal Impedance ......................................................................................................................... 21

Table 8: General I

Parameters ..................................................................................................................... 22

Table 9: I

DD7

Timing Patterns (8-Bank Interleave READ Operation) ................................................................. 23

Table 10: DDR2 I

Specifications and Conditions (Die Revision H) ................................................................ 24

Table 11: AC Operating Specifications and Conditions .................................................................................... 27

Table 12: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 39

Table 13: ODT DC Electrical Characteristics ................................................................................................... 39

Table 14: Input DC Logic Levels ..................................................................................................................... 40

Table 15: Input AC Logic Levels ...................................................................................................................... 40

Table 16: Differential Input Logic Levels ......................................................................................................... 41

Table 17: Differential AC Output Parameters ................................................................................................... 43

Table 18: Output DC Current Drive ................................................................................................................ 43

Table 19: Output Characteristics .................................................................................................................... 44

Table 20: Full Strength Pull-Down Current (mA) ............................................................................................. 45

Table 21: Full Strength Pull-Up Current (mA) .................................................................................................. 46

Table 22: Reduced Strength Pull-Down Current (mA) ...................................................................................... 47

Table 23: Reduced Strength Pull-Up Current (mA) .......................................................................................... 48

Table 24: Input Clamp Characteristics ............................................................................................................ 49

Table 25: Address and Control Balls ................................................................................................................ 50

Table 26: Clock, Data, Strobe, and Mask Balls ................................................................................................. 50

Table 27: AC Input Test Conditions ................................................................................................................ 50

Table 28: DDR2-400/533 Setup and Hold Time Derating Values (

IS and

IH) .................................................... 53

Table 29: DDR2-667/800/1066 Setup and Hold Time Derating Values (

IS and

IH) ........................................... 54

Table 30: DDR2-400/533

DS,

DH Derating Values with Differential Strobe ...................................................... 57

Table 31: DDR2-667/800/1066

DS,

DH Derating Values with Differential Strobe ............................................. 58

Table 32: Single-Ended DQS Slew Rate Derating Values Using

and

................................................... 59

Table 33: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-667 ...................................... 59

Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-533 ...................................... 60

Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V

REF

) at DDR2-400 ...................................... 60

Table 36: Truth Table – DDR2 Commands ...................................................................................................... 65

Table 37: Truth Table – Current State Bank

– Command to Bank

................................................................ 66

Table 38: Truth Table – Current State Bank

– Command to Bank

............................................................... 68

Table 39: Minimum Delay with Auto Precharge Enabled ................................................................................. 69

Table 40: Burst Definition .............................................................................................................................. 73

Table 41: READ Using Concurrent Auto Precharge .......................................................................................... 93

Table 42: WRITE Using Concurrent Auto Precharge ........................................................................................ 99

Table 43: Truth Table – CKE .......................................................................................................................... 114

PDF: 09005aef840eff89

1gbddr2_ait_aat.pdf – Rev. D 11/13 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

MT47H64M16HW-25EIT相似产品对比

	MT47H64M16HW-25EIT	MT47H128M8CF-25	MT47H128M8CF-25E
描述	DDR DRAM,	DDR DRAM,	DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60, 8 X 10 MM, ROHS COMPLIANT, FBGA-60
Reach Compliance Code	unknown	compliant	compliant
内存集成电路类型	DDR DRAM	DDR DRAM	DDR DRAM
是否Rohs认证	-	符合	符合
厂商名称	-	Micron Technology	Micron Technology
峰值回流温度（摄氏度）	-	NOT SPECIFIED	NOT SPECIFIED
处于峰值回流温度下的最长时间	-	NOT SPECIFIED	NOT SPECIFIED

推荐资源

电池监视器电路图

电磁感应式物件接近告知器电路

具有过流和过热保护系统的10A稳压电源电路

VHF信号源的1kHz调制器

利用光导发射元件检测微小位移的电路

电饭煲电路图03

04省赛电设题目电梯单片机程序: 本帖最后由 paulhyde 于 2014-9-15 04:04 编辑用的NEC（现Renesas）当年国赛发的板子做的管脚功能没有特意注视不清楚的大家提出来我尽量解答检测楼层用的是霍尔开关电机是步进电机 over ......; shaxiaoziningyi 电子竞赛

LED封装质量控制: 对LED封装过程可能出现的问题逐一指出，并提出解决的办法，着重介绍封装位置对LED发光亮度的影响。以期引起LED封装管理人员及工作人员的注意。关键词：质量控制；点胶；点晶；焊线压力；放大 ......; songbo PCB设计

灯用三极管的损坏机理探析: 1、灯用三极管损坏机理研究及深爱灯用三极管的发展过程 2、Hfe、“瞬态冷爆”及深爱抗过饱和电路 3、ts、μe及其他 4、荧光灯电子镇流基本工作原理的初步细探...; 雪人001 模拟电子

DSP F2812编程总结和技巧: 开始的时候学习DSP，就想找本书通读一遍，想把DSP一下子了解明白然后再编程。后来发现太费时间，在实际的工作中，杂事一大堆，根本没有时间把一本书详细的读完。何况在工作中，领导也是看不得你 ......; fish001 DSP 与 ARM 处理器

盛群八位元 A/D 型微控制器HT46RU22: 盛群半導體在A/DTypeMCU系列產品上又加入一員新兵。HT46RU22為Holtek新一代八位元A/D型微控制器。與現有產品HT46R22在規格差異點為，HT46RU22加上了UART(UniversalAsynchronousReceiverTransmit ......; fighting 机器人开发

晒下“费列罗”: 本帖最后由 ddllxxrr 于 2014-2-24 11:11 编辑 {:1_144:}发这个贴子得感谢下SOSO及eric_wang,我拍这个的时候，系统好像故障，芯币扣了，但礼品数量没有减。我当时心里就隔登一下。后来等了一 ......; ddllxxrr 聊聊、笑笑、闹闹

碳纳米管导线扮推手芯片速度创高峰

　　芯片工艺技术进程在2011年前，即可能遭遇瓶颈。相对纳米科技已开始介入处理器、存储器…等芯片工艺，凡小于100纳米(nanometer)的零组件产品，都可以看见它们的身影。　　基本上，芯片中的铜导线有其物理极限，所以芯片商需要借碳纳米管在硅芯片上布线，然而布线空间和晶体管集中度有关。直到史丹佛大学与ToshibaRD推出1GHz碳纳米管互联CMOS电路后，纳米芯片工艺问题才获得缓解。 ...[详细]
2006年中国的RFID产业的回顾与展望

　　我们在2006年的最后一天，盘点一年里RFID产业的发展里程。在“十一五”开局之年，发展政策与规划纷纷出台，引导RFID产业沿着自主、创新、开放和健康的秩序发展，技术创新与应用呈现破茧之势，整个RFID行业正在走出混沌，迎接曙光。　　【RFID射频快报2006年12月31日专稿】我们在2006年的最后一天，盘点一年里RFID产业的发展里程。在“十一五”开局之年，发展政策与规划纷纷出台，引...[详细]
基于Nios II的多生理参数处理系统

　　随着医疗仪器设备向智能化、微型化、系列化、数字化和多功能方向的发展，医疗设备中逻辑控制器件也由采用中、小规模的集成芯片发展到应用现场可编程门阵列FPGA(Field Programmable Gate Array)。使用FPGA器件可以大大缩短医疗设备的研制周期，减少开发成本，同时还可以很方便地对设计进行在线修改，因此FPGA在医疗设备中有很广泛的应用。　　本文主要搭建一个多生理参数测...[详细]
医疗影像存储与传输左右信息化进程

　　医疗信息化需要对数据资产的管理有一个通盘的考虑。　　在在去年本刊举办的“富营”活动中，曾有多数医疗行业CIO表示，目前国内80%的医院已经实施管理信息系统（MIS），系统建设状况相对成熟；而HCIS（临床管理信息化系统）则相对不足。人们普遍关注的电子病历系统、医疗影像存储与传输系统（PACS）系统以及临床决策支持系统，其中绝大部分尚处于部分应用或试用探索阶段，近半数医院仍是空白。　　...[详细]
合众达电子与中国科大再建Xilinx联合实验室

　　7月9日上午，中国科技大学与美国赛灵思(XILINX)联合建设的“中国科技大学—XILINX公司联合实验室”揭牌仪式在中国科技大学信息科学技术学院电子科学与技术系隆重举行。　　联合实验室采用了Xilinx公司SPARTAN-3E系列为主的FPGA教学实验开发系统，另外配备多套开发软件，主要承担了中国科技大学“PLD与数字系统设计”研究生课程和电子科学与技术系“电子系统设计”课程的教学任务...[详细]
合众达电子与中国科大再建Xilinx联合实验室

　　7月9日上午，中国科技大学与美国赛灵思(XILINX)联合建设的“中国科技大学—XILINX公司联合实验室”揭牌仪式在中国科技大学信息科学技术学院电子科学与技术系隆重举行。　　联合实验室采用了Xilinx公司SPARTAN-3E系列为主的FPGA教学实验开发系统，另外配备多套开发软件，主要承担了中国科技大学“PLD与数字系统设计”研究生课程和电子科学与技术系“电子系统设计”课程的教学任务...[详细]
智能超声波洁牙机的设计

　　超声波洁牙机在医疗领域已广泛应用。现国内外所用超声波洁牙机多采用模拟振荡电路。存在如下缺陷：第一，振荡频率容易漂移。在连续工作一段时间后，振荡频率漂移，造成洁牙机工作不正常。第二，由于压电陶瓷片谐振频带范围窄，谐振频率点采用手动搜索，不容易找准。本人设计的超声波沽牙机以单片机为核心，采用电流取样反馈自动扫描搜索谐振点，谐振频率和振荡强度数字锁定，谐振点漂移极小，从而在根本上解决了上述问题。该电...[详细]
芯片实验室及其发展趋势

　　一、前言　　芯片实验室（Lab-on-a-chip）或称微全分析系统（Miniaturized Total Analysis System, µ-TAS）是指把生物和化学等领域中所涉及的样品制备、生物与化学反应、分离检测等基本操作单位集成或基本集成一块几平方厘米的芯片上，用以完成不同的生物或化学反应过程，并对其产物进行分析的一种技术。它是通过分析化学、微机电加工（MEMS）、计算机、电...[详细]
深圳：IC设计基地集聚效应显现

　　深圳基地实施的策略是：建立专业化的开放的公共技术服务平台，提供全面的技术服务。通过建设IC设计专业孵化器，孵小扶强，降低门槛，提高水平，全面服务于整个产业链，为芯片设计、系统厂商、生产制造、市场销售、风险投资等各环节的合作牵线搭桥，达到全面整合、联合、组合和聚合深圳IC设计企业和人才的效果。　　深圳集成电路设计产业化基地管理中心副主任周生明　　深圳IC设计产业化基地全面服务...[详细]
美国国家半导体公司的SolarMagic技术

SolarMagic Raceway 　　画面是我们在"31号停车场"上铺设的SolarMagic赛车道。车道上停放的两辆高尔夫球车都在车顶安装设了先进的光伏太阳能电池板。停在左方的黄色赛车采用传统的太阳能技术，而停在右方的蓝色赛车采用美国国家半导体公司的SolarMagic技术。车道上搭建了几个拱门架，在架下有太阳投射的阴影。两条车道完全相同，拱门架下格子图案的阴影也相同。　　当高尔...[详细]
英特尔推出新的嵌入式新处理器及芯片组

　　英特尔推出了面向嵌入式用户的英特尔® 酷睿™2 双核处理器 T9400和移动式英特尔® GM45 高速芯片组，并提供长达7年的超长生命周期支持。本次推出的处理器和芯片组是全新的英特尔® 迅驰® 2 平台的构成组件，可为移动应用程序带来更耐久的电池使用时间和广泛的无线网络互操作性。　　新推出的英特尔® 酷睿™2 双核处理器 T9400经验证可支持英特尔® 5100 内存控制器中枢(MCH)...[详细]
泰克公司数字视频仪器成网通奥运会首选

中国领先的宽带通信运营商将使用获奖的泰克公司视频测试设备，以传送完美的视频信号。俄勒冈州比佛顿，2008年6月24日，全球领先的测试测量和监测仪器供应商泰克公司今天宣布，中国网通（China Netcom, CNC）决定采用泰克公司的视频测试和测量设备，以确保北京2008奥运会视频信号的高质量传送。中国网通选购的泰克公司视频测试设备有新型的PQA500图像质量分析仪、WFM7...[详细]
内镜超声——创伤最低的检测肺癌手段

　　内镜超声是一种创伤最低的检测肺癌的手段——通过将一个顶部带有摄像头的探头插入食道即可准确、安全的判定肺部肿块的良恶性情况。美国杜克大学医学中心的胃肠病学专家在评估了18例临床内镜超声检查结果后得出结论：内镜超声应被作为评估疑似恶性肿块的常规检查手段。研究者们在报告中称，如果超声内镜检查能在临床上得以广泛使用，则近三分之一的疑似肺癌的病人将无须再进行其它的创伤更大的检查即可判定肿瘤的...[详细]
美国医用超声市场2008和今后几年的走向

　　咨询公司KBC一份最新市场调查报告披露，美国2006年超声设备市场达到创纪录的13.3亿美元，在全球超声市场中，美国占据的份额达到30%左右，由此可见该市场对超声设备厂商的份量。该报告还预测，到2011年，美国这一市场可望增至17.6亿美元，年增长率5.8%。　　2008年，超声整机产品在美的销售收入较上年增长了5.3%，而产品升级服务的业务收入下降23%，使整个市场的增长率降低到2.6...[详细]
中国电源管理芯片市场发展现状与未来趋势

近5年来市场增速首次跌至20%以下　　几乎所有的电子产品都会涉及到电源管理，而电源管理市场也直接受到电子整机产品产量的影响。近5年来，在下游电子产品整机产量高速增长的带动下，中国电源管理芯片市场保持了快速的增长，从2003到2007年，市场复合增长率达到25%，然而2007年市场增长率仅为15%，5年来首次跌至20%之下，在经历了多年的高速发展之后，其市场增长开始明显放缓，赛迪顾问认为...[详细]

器件捷径: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多