EE PLD, 14ns, 96-Cell, CMOS, PQFP100, TQFP-100
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | TQFP-100 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
其他特性 | YES |
最大时钟频率 | 37 MHz |
系统内可编程 | YES |
JESD-30 代码 | S-PQFP-G100 |
JESD-609代码 | e0 |
JTAG BST | YES |
长度 | 14 mm |
湿度敏感等级 | 3 |
专用输入次数 | 4 |
I/O 线路数量 | 48 |
宏单元数 | 96 |
端子数量 | 100 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 4 DEDICATED INPUTS, 48 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装等效代码 | QFP100,.63SQ,20 |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 240 |
电源 | 5 V |
可编程逻辑类型 | EE PLD |
传播延迟 | 14 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 14 mm |
Base Number Matches | 1 |
M4-96/48-14VI | M4-256/128-14AI | M4-128/64-14VI | M4LV-96/48-14VI | M4-32/32-14JI | M4-32/32-14VI | M4-32/32-14VI48 | M4-64/32-14VI | M4-64/32-14VI48 | M4LV-64/32-14VI48 | |
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描述 | EE PLD, 14ns, 96-Cell, CMOS, PQFP100, TQFP-100 | EE PLD, 14ns, 256-Cell, CMOS, PBGA256, BGA-256 | EE PLD, 14ns, 128-Cell, CMOS, PQFP100, TQFP-100 | EE PLD, 14ns, 96-Cell, CMOS, PQFP100, TQFP-100 | EE PLD, 14ns, 32-Cell, CMOS, PQCC44, | EE PLD, 14ns, 32-Cell, CMOS, PQFP44, | EE PLD, 14ns, 32-Cell, CMOS, PQFP48, TQFP-48 | EE PLD, 14ns, 64-Cell, CMOS, PQFP44, | EE PLD, 14ns, 64-Cell, CMOS, PQFP48, TQFP-48 | EE PLD, 14ns, 64-Cell, CMOS, PQFP48, TQFP-48 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | TQFP-100 | BGA-256 | TQFP-100 | TQFP-100 | PLASTIC, LCC-44 | TQFP-44 | TQFP-48 | TQFP, TQFP44,.47SQ,32 | TQFP-48 | TQFP-48 |
Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | unknown | unknown | unknown | unknown | unknown | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | YES | YES | YES | YES | YES | YES | YES | - | YES | YES |
最大时钟频率 | 37 MHz | 37 MHz | 37 MHz | 37 MHz | 37 MHz | 37 MHz | 37 MHz | - | 37 MHz | 37 MHz |
系统内可编程 | YES | YES | YES | YES | YES | YES | YES | - | YES | YES |
JESD-30 代码 | S-PQFP-G100 | S-PBGA-B256 | S-PQFP-G100 | S-PQFP-G100 | S-PQCC-J44 | S-PQFP-G44 | S-PQFP-G48 | - | S-PQFP-G48 | S-PQFP-G48 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 | - |
JTAG BST | YES | YES | YES | YES | YES | YES | YES | - | YES | YES |
长度 | 14 mm | 27 mm | 14 mm | 14 mm | 16.5862 mm | 10 mm | 7 mm | - | 7 mm | 7 mm |
湿度敏感等级 | 3 | - | 3 | 3 | 3 | 3 | 3 | - | 3 | 3 |
I/O 线路数量 | 48 | 128 | 64 | 48 | 32 | 32 | 32 | - | 32 | 32 |
宏单元数 | 96 | 256 | 128 | 96 | 32 | 32 | 32 | - | 64 | 64 |
端子数量 | 100 | 256 | 100 | 100 | 44 | 44 | 48 | - | 48 | 48 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
组织 | 4 DEDICATED INPUTS, 48 I/O | 14 DEDICATED INPUTS, 128 I/O | 2 DEDICATED INPUTS, 64 I/O | 4 DEDICATED INPUTS, 48 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | - | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | - | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFQFP | LBGA | LFQFP | LFQFP | QCCJ | TQFP | LFQFP | - | LFQFP | LFQFP |
封装等效代码 | QFP100,.63SQ,20 | BGA256,20X20,50 | QFP100,.63SQ,20 | QFP100,.63SQ,20 | LDCC44,.7SQ | TQFP44,.47SQ,32 | QFP48,.35SQ,20 | - | QFP48,.35SQ,20 | QFP48,.35SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | CHIP CARRIER | FLATPACK, THIN PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | - | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 240 | NOT SPECIFIED | 240 | - | 240 | 240 | 240 | - | 240 | - |
电源 | 5 V | 5 V | 5 V | 3.3 V | 5 V | 5 V | 5 V | - | 5 V | 3.3 V |
可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | - | EE PLD | EE PLD |
传播延迟 | 14 ns | 14 ns | 14 ns | 14 ns | 14 ns | 14 ns | 14 ns | - | 14 ns | 14 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.7 mm | 1.6 mm | 1.6 mm | 4.57 mm | 1.2 mm | 1.6 mm | - | 1.6 mm | 1.6 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 3.6 V | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 3.6 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 3 V | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 3 V |
标称供电电压 | 5 V | 5 V | 5 V | 3.3 V | 5 V | 5 V | 5 V | - | 5 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | - | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | - | TIN LEAD | - |
端子形式 | GULL WING | BALL | GULL WING | GULL WING | J BEND | GULL WING | GULL WING | - | GULL WING | GULL WING |
端子节距 | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm | 0.8 mm | 0.5 mm | - | 0.5 mm | 0.5 mm |
端子位置 | QUAD | BOTTOM | QUAD | QUAD | QUAD | QUAD | QUAD | - | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | NOT SPECIFIED | 30 | - | 30 | 30 | 30 | - | 30 | - |
宽度 | 14 mm | 27 mm | 14 mm | 14 mm | 16.5862 mm | 10 mm | 7 mm | - | 7 mm | 7 mm |
零件包装代码 | - | BGA | - | QFP | LCC | - | QFP | QFP | QFP | - |
针数 | - | 256 | - | 100 | 44 | - | 48 | 44 | 48 | - |
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