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LTC4301LIDD

产品描述Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation
产品类别模拟混合信号IC    驱动程序和接口   
文件大小163KB,共12页
制造商Linear ( ADI )
官网地址http://www.analog.com/cn/index.html
下载文档 详细参数 选型对比 全文预览

LTC4301LIDD概述

Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation

LTC4301LIDD规格参数

参数名称属性值
Brand NameLinear Technology
是否Rohs认证不符合
厂商名称Linear ( ADI )
零件包装代码DFN
包装说明HVSON, SOLCC8,.11,20
针数8
制造商包装代码DD
Reach Compliance Code_compli
ECCN代码EAR99
接口集成电路类型INTERFACE CIRCUIT
JESD-30 代码S-PDSO-N8
JESD-609代码e0
长度3 mm
湿度敏感等级1
功能数量1
端子数量8
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码HVSON
封装等效代码SOLCC8,.11,20
封装形状SQUARE
封装形式SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度)235
电源3/5 V
认证状态Not Qualified
座面最大高度0.8 mm
最大压摆率6.2 mA
最大供电电压5.5 V
最小供电电压2.7 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式NO LEAD
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间20
宽度3 mm

文档预览

下载PDF文档
LTC4301L
Hot Swappable 2-Wire
Bus Buffer with Low Voltage
Level Translation
DESCRIPTIO
The LTC
®
4301L hot swappable, 2-wire bus buffer allows
I/O card insertion into a live backplane without corruption
of the data and clock busses. In addition, the LTC4301L
SDAIN and SCLIN pins are compatible with systems with
pull-up voltages as low as 1V. Control circuitry prevents
the backplane from being connected to the card until a
stop bit or a bus idle is present. When the connection is
made, the LTC4301L provides bidirectional buffering,
keeping the backplane and card capacitances isolated.
When driven low, the CS input pin allows the part to
connect after a stop bit or bus idle occurs. Driving CS high
breaks the connection between SCLIN and SCLOUT and
between SDAIN and SDAOUT. A logic high on READY
indicates that the backplane and card sides are connected
together.
The LTC4301L is offered in 8-pin DFN (3mm
×
3mm) and
MSOP packages.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 7032051.
FEATURES
Level Translates 1V Signals to Standard 3.3V and
5V Logic Rails
Allows Bus Pull-Up Voltages as Low as 1V on
SDAIN and SCLIN
Bidirectional Buffer* for SDA and SCL Lines
Increases Fanout
Prevents SDA and SCL Corruption During Live Board
Insertion and Removal from Backplane
Isolates Input SDA and SCL Line from Output
10kV Human Body Model ESD Protection
Supports Clock Stretching, Arbitration and
Synchronization
High Impedance SDA, SCL Pins for V
CC
= 0V
CS Gates Connection from Input to Output
Compatible with I
2
C
TM
, I
2
C Fast Mode and SMBus
Standards (Up to 400kHz Operation)
Small 8-Pin MSOP and DFN (3mm
×
3mm) Packages
APPLICATIO S
Hot Board Insertion
Servers
Capacitance Buffer/Bus Extender
Desktop Computers
TYPICAL APPLICATIO
1.2V
Input-Output Connection
3.3V
0.01µF
2k
SDA
µP
SCL
2k
SDAIN
SCLIN
CS
GND
GND
4301l TA01a
V
CC
V
CC
SDAOUT
SCLOUT
READY
LTC4301L
10k
10k
SDA
SCL
OUTPUT
SIDE
20pF
0.5V/DIV
INPUT
SIDE
55pF
U
U
U
1µs/DIV
4301 TA01b
4301lfa
1

LTC4301LIDD相似产品对比

LTC4301LIDD LTC4301L LTC4301LCDD LTC4301LCMS8
描述 Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation Hot Swappable 2-Wire Bus Buffer with Low Voltage Level Translation
Brand Name Linear Technology - Linear Technology Linear Technology
是否Rohs认证 不符合 - 不符合 不符合
厂商名称 Linear ( ADI ) - Linear ( ADI ) Linear ( ADI )
零件包装代码 DFN - DFN MSOP
包装说明 HVSON, SOLCC8,.11,20 - HVSON, SOLCC8,.11,20 TSSOP, TSSOP8,.19
针数 8 - 8 8
制造商包装代码 DD - DD MS8
Reach Compliance Code _compli - _compli _compli
接口集成电路类型 INTERFACE CIRCUIT - INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 代码 S-PDSO-N8 - S-PDSO-N8 S-PDSO-G8
JESD-609代码 e0 - e0 e0
长度 3 mm - 3 mm 3 mm
湿度敏感等级 1 - 1 1
功能数量 1 - 1 1
端子数量 8 - 8 8
最高工作温度 85 °C - 70 °C 70 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HVSON - HVSON TSSOP
封装等效代码 SOLCC8,.11,20 - SOLCC8,.11,20 TSSOP8,.19
封装形状 SQUARE - SQUARE SQUARE
封装形式 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE - SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度) 235 - 235 235
电源 3/5 V - 3/5 V 3/5 V
认证状态 Not Qualified - Not Qualified Not Qualified
座面最大高度 0.8 mm - 0.8 mm 1.1 mm
最大压摆率 6.2 mA - 6.2 mA 6.2 mA
最大供电电压 5.5 V - 5.5 V 5.5 V
最小供电电压 2.7 V - 2.7 V 2.7 V
标称供电电压 3.3 V - 3.3 V 3.3 V
表面贴装 YES - YES YES
技术 CMOS - CMOS CMOS
温度等级 INDUSTRIAL - COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 NO LEAD - NO LEAD GULL WING
端子节距 0.5 mm - 0.5 mm 0.65 mm
端子位置 DUAL - DUAL DUAL
处于峰值回流温度下的最长时间 20 - 20 20
宽度 3 mm - 3 mm 3 mm
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