IC,SIMPLE-PLD,PAL-TYPE,ECL100,DIP,24PIN,CERAMIC
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP24,.3 |
Reach Compliance Code | unknown |
架构 | PAL-TYPE |
JESD-30 代码 | R-XDIP-T24 |
JESD-609代码 | e0 |
输入次数 | 16 |
输出次数 | 4 |
产品条款数 | 32 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | |
输出函数 | COMBINATORIAL |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP24,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | -4.5 V |
可编程逻辑类型 | OT PLD |
传播延迟 | 4 ns |
表面贴装 | NO |
技术 | ECL100K |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
PAL10016P4AJC/A+ | PAL1016P4AJC/A+ | PAL10016P4AJC/B+ | PAL10016P4AWC/A+ | PAL10016P4AWC/B+ | |
---|---|---|---|---|---|
描述 | IC,SIMPLE-PLD,PAL-TYPE,ECL100,DIP,24PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,ECL10,DIP,24PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,ECL100,DIP,24PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,ECL100,QFL,24PIN,CERAMIC | IC,SIMPLE-PLD,PAL-TYPE,ECL100,QFL,24PIN,CERAMIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | QFF, QFL24,.4SQ | QFF, QFL24,.4SQ |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
JESD-30 代码 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | S-XQFP-F24 | S-XQFP-F24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
输入次数 | 16 | 16 | 16 | 16 | 16 |
输出次数 | 4 | 4 | 4 | 4 | 4 |
产品条款数 | 32 | 32 | 32 | 32 | 32 |
端子数量 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C |
输出函数 | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | QFF | QFF |
封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | QFL24,.4SQ | QFL24,.4SQ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
封装形式 | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
电源 | -4.5 V | -5.2 V | -4.5 V | -4.5 V | -4.5 V |
可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
传播延迟 | 4 ns | 4 ns | 4 ns | 4 ns | 4 ns |
表面贴装 | NO | NO | NO | YES | YES |
技术 | ECL100K | ECL10K | ECL100K | ECL100K | ECL100K |
温度等级 | OTHER | COMMERCIAL | OTHER | OTHER | OTHER |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD |
Base Number Matches | 1 | 1 | 1 | - | - |
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