电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1210C103M8GACTM

产品描述CAPACITOR, CERAMIC, MULTILAYER, 10V, C0G, 0.01uF, SURFACE MOUNT, 1210, CHIP, ROHS COMPLIANT
产品类别无源元件    电容器   
文件大小1MB,共9页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准  
下载文档 详细参数 全文预览

C1210C103M8GACTM概述

CAPACITOR, CERAMIC, MULTILAYER, 10V, C0G, 0.01uF, SURFACE MOUNT, 1210, CHIP, ROHS COMPLIANT

C1210C103M8GACTM规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明, 1210
Reach Compliance Codecompliant
ECCN代码EAR99
电容0.01 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度1.1 mm
JESD-609代码e3
长度3.2 mm
安装特点SURFACE MOUNT
多层Yes
负容差20%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法TR, EMBOSSED PLASTIC, 7 INCH
正容差20%
额定(直流)电压(URdc)10 V
尺寸代码1210
表面贴装YES
温度特性代码C0G
温度系数30ppm/Cel ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND
宽度2.5 mm
Base Number Matches1

文档预览

下载PDF文档
CERAMIC CHIP CAPACITORS
FEATURES
• C0G (NP0), X7R, X5R, Z5U and Y5V Dielectrics
• 10, 16, 25, 50, 100 and 200 Volts
• Standard End Metalization: Tin-plate over nickel
barrier
• Available Capacitance Tolerances: ±0.10 pF; ±0.25
pF; ±0.5 pF; ±1%; ±2%; ±5%; ±10%; ±20%; and
+80%-20%
• Tape and reel packaging per EIA481-1. (See page
92 for specific tape and reel information.) Bulk
Cassette packaging (0402, 0603, 0805 only) per
IEC60286-6 and EIAJ 7201.
• RoHS Compliant
CAPACITOR OUTLINE DRAWINGS
W
T
S
ELECTRODES
L
B
TIN PLATE
NICKEL PLATE
CONDUCTIVE
METALLIZATION
DIMENSIONS—MILLIMETERS AND (INCHES)
SIZE CODE
EIA
SIZE
SIZE
CODE
METRIC
(Ref only)
CODE
SIZE CODE
0402*
1005
EIA
METRIC
L - LENGTH
0.6 (.024) ± .03 (.001)
1.0 (.04) ± .05 (.002)
1.6 (.063) ± .15 (.006)
2.0 (.079) ± .20 (.008)
3.2 (.126) ± .20 (.008)
3.2 (.126) ± .20 (.008)
4.5 (.177) ± .30 (.012)
4.5 (.177) ± .30 (.012)
5.6 (.220) ± .40 (.016)
5.6 (.220) ± .40 (.016)
W - WIDTH
0.3 ± (.012) ± .03 (.001)
0.5 (.02) ± .05 (.002)
0.8 (.032) ± .15 (.006)
1.25 (.049) ± .20 (.008)
1.6 (.063) ± .20 (.008)
2.5 (.098) ± .20 (.008)
3.2 (.126) ± .30 (.012)
6.4 (.252) ± .40 (.016)
5.0 (.197) ± .40 (.016)
6.3 (.248) ± .40 (.016)
T
THICKNESS
B - BANDWIDTH
0.15 (.006) ± .05 (.002)
0.20 (.008) -.40 (.016)
0.35 (.014) ± .15 (.006)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.50 (.02) ± .25 (.010)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
0.60 (.024) ± .35 (.014)
S
SEPARATION
minimum
N/A
0.3 (.012)
0.7 (.028)
0.75 (.030)
N/A
N/A
N/A
N/A
N/A
N/A
MOUNTING
TECHNIQUE
Solder Reflow
or
0201*
0603*
0402*
0805*
0603
1206*
0805*
1210*
1206*
1812
2220
2225
1812
0603
1608
1005
2012
1608
3216
2012
3225
3216
4532
4564
5650
5664
4532
4564
5650
5664
1210*
1825*
1825*
2220
2225
3225
See page 78
for thickness
dimensions.
Solder Wave +
or
Solder Reflow
Solder
Reflow
Solder Reflow
* Note: Indicates EIA Preferred Case Sizes (Tightened tolerances apply for 0402, 0603, and 0805 packaged in bulk bassette, see page 96.)
+ For extended value 1210 case size - solder reflow only.
CAPACITOR ORDERING INFORMATION
(Standard Chips - For
C 0805 C 103 K 5 R A C*
CERAMIC
SIZE CODE
SPECIFICATION
C - Standard
CAPACITANCE CODE
Expressed in Picofarads (pF)
First two digits represent significant figures.
Third digit specifies number of zeros. (Use 9
for 1.0 through 9.9pF. Use 8 for 0.5 through 0.99pF)
(Example: 2.2pF = 229 or 0.50 pF = 508)
CAPACITANCE TOLERANCE
B – ±0.10pF J – ±5%
C – ±0.25pF K – ±10%
D – ±0.5pF
M – ±20%
F – ±1%
P – (GMV) – special order only
G – ±2%
Z – +80%, -20%
72
Military see page
87)
END METALLIZATION
C-Standard (Tin-plated nickel barrier)
FAILURE RATE LEVEL
A- Not Applicable
TEMPERATURE CHARACTERISTIC
Designated by Capacitance
Change Over Temperature Range
G – C0G (NP0) (±30 PPM/°C)
R – X7R (±15%) (-55°C + 125°C)
P– X5R (±15%) (-55°C + 85°C)
U – Z5U (+22%, -56%) (+10°C + 85°C)
V – Y5V (+22%, -82%) (-30°C + 85°C)
VOLTAGE
1
- 100V
1
- 100V 3 - 25V
25V
3-
2 - 200V 4 - 16V
16V
2 - 200V
4-
5 - 50V 8 - 10V
5
- 35V 9 - 6.3V
10V
8-
6
- 50V
* Part Number Example: C0805C103K5RAC (14 digits - no spaces)
7 - 4V
7 - 4V
- 6.3V
9
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Ceramic Surface Mount
关于micro usb改成TYPE-C的问题
本帖最后由 haha丶 于 2022-4-6 10:17 编辑 想把开发板上的下载程序的micro USB接口改成TYPE-C 的接口,想问一下是不是把GND,VBUS,DP1,DN1对应连接上就行了,ID端口需要链接吗? 看网上都 ......
haha丶 综合技术交流
基于RL78/G14的视频采集显示系统
使用RL78/G14对摄像头进行配置,摄像头采集到的数据经FPGA处理后输出到VGA显示器上或者TFT屏。FPGA型号为EP1C6Q240,摄像头型号为OV7670. 本设计需要外接FPGA处理板,摄像头直接采用OV7670模块 ......
rowen800 瑞萨MCU/MPU
WindowsXP作为POWERLINK主站的配置过程
WindowsXP作为POWERLINK主站的配置过程...
EPACCN 工业自动化与控制
VHDL的一个小小问题
--有如下语句: ... ... GENERIC(CONSTANT BUS_WIDTH: INTEGER := 15); --总线宽度定义 ... ... po1: INOUT STD_LOGIC_VECTOR(BUS_WIDTH DOWNTO 0); ... ... po1 ...
cgl123456 嵌入式系统
找了一宿都没有与超声波雾化器设计相关的资料
求助啊,,,,!!!!仿真还有程序 哎。。。找了一宿了,,,...
炮灰 51单片机
#####哪位大侠有SHT11(瑞士盛世瑞恩温湿度传感器)的MSP430程序呢???####
最近找这个找疯了,求求哪位大侠帮个忙! 小弟邮箱:zhanliang198109@126.com 先谢谢了!...
lysword 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2682  1852  647  2618  294  46  35  59  48  53 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved