CY7C140-55LC概述

Multi-Port SRAM, 1KX8, 55ns, CMOS, CQCC48, CERAMIC, LCC-48

CY7C140-55LC规格参数

参数名称	属性值
包装说明	QCCN,
Reach Compliance Code	unknown
最长访问时间	55 ns
其他特性	AUTOMATIC POWER-DOWN; INTERRUPT FLAG
JESD-30 代码	S-CQCC-N48
长度	14.224 mm
内存密度	8192 bit
内存集成电路类型	MULTI-PORT SRAM
内存宽度	8
功能数量	1
端子数量	48
字数	1024 words
字数代码	1000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	1KX8
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN
封装形状	SQUARE
封装形式	CHIP CARRIER
并行/串行	PARALLEL
座面最大高度	1.9812 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	NO LEAD
端子节距	1.016 mm
端子位置	QUAD
宽度	14.224 mm
Base Number Matches	1

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CY7C140-55LC相似产品对比

	CY7C140-55LC	CY7C140-25LC	CY7C140-30DC	CY7C140-30DI	CY7C140-45LC	CY7C140-55DC	CY7C140-55DI
描述	Multi-Port SRAM, 1KX8, 55ns, CMOS, CQCC48, CERAMIC, LCC-48	Multi-Port SRAM, 1KX8, 25ns, CMOS, CQCC48, CERAMIC, LCC-48	Multi-Port SRAM, 1KX8, 30ns, CMOS, CDIP48, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-48	Multi-Port SRAM, 1KX8, 30ns, CMOS, CDIP48, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-48	Multi-Port SRAM, 1KX8, 45ns, CMOS, CQCC48, CERAMIC, LCC-48	Multi-Port SRAM, 1KX8, 55ns, CMOS, CDIP48, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-48	Multi-Port SRAM, 1KX8, 55ns, CMOS, CDIP48, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-48
包装说明	QCCN,	QCCN,	DIP,	DIP,	QCCN,	DIP,	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	55 ns	25 ns	30 ns	30 ns	45 ns	55 ns	55 ns
其他特性	AUTOMATIC POWER-DOWN; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; INTERRUPT FLAG	AUTOMATIC POWER-DOWN; INTERRUPT FLAG
JESD-30 代码	S-CQCC-N48	S-CQCC-N48	R-CDIP-T48	R-CDIP-T48	S-CQCC-N48	R-CDIP-T48	R-CDIP-T48
长度	14.224 mm	14.224 mm	60.96 mm	60.96 mm	14.224 mm	60.96 mm	60.96 mm
内存密度	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit
内存集成电路类型	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM
内存宽度	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1
端子数量	48	48	48	48	48	48	48
字数	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
字数代码	1000	1000	1000	1000	1000	1000	1000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	85 °C	70 °C	70 °C	85 °C
组织	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	QCCN	QCCN	DIP	DIP	QCCN	DIP	DIP
封装形状	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
座面最大高度	1.9812 mm	1.9812 mm	5.08 mm	5.08 mm	1.9812 mm	5.08 mm	5.08 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	NO	NO	YES	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
端子形式	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
端子节距	1.016 mm	1.016 mm	2.54 mm	2.54 mm	1.016 mm	2.54 mm	2.54 mm
端子位置	QUAD	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL
宽度	14.224 mm	14.224 mm	15.24 mm	15.24 mm	14.224 mm	15.24 mm	15.24 mm
厂商名称	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics

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