64KX16 UVPROM, 300ns, PQCC44, PLASTIC, LCC-44
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, LDCC44,.7SQ |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 300 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-PQCC-J44 |
| JESD-609代码 | e0 |
| 长度 | 16.51 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX16 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC44,.7SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 最大待机电流 | 0.00002 A |
| 最大压摆率 | 0.02 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 16.51 mm |
| Base Number Matches | 1 |
| NM27LV210V300 | NM27LV210TE300 | NM27LV210T300 | NM27LV210T250 | NM27LV210VE300 | NM27LV210TE250 | NM27LV210T200 | |
|---|---|---|---|---|---|---|---|
| 描述 | 64KX16 UVPROM, 300ns, PQCC44, PLASTIC, LCC-44 | 64KX16 UVPROM, 300ns, PDSO32, TSOP1-32 | 64KX16 UVPROM, 300ns, PDSO32, TSOP1-32 | 64KX16 UVPROM, 250ns, PDSO32, TSOP1-32 | IC 64K X 16 UVPROM, 300 ns, PQCC44, PLASTIC, LCC-44, Programmable ROM | 64KX16 UVPROM, 250ns, PDSO32, TSOP1-32 | IC 64K X 16 UVPROM, 200 ns, PDSO32, TSOP1-32, Programmable ROM |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | LCC | TSOP1 | TSOP1 | TSOP1 | LCC | TSOP1 | TSOP1 |
| 包装说明 | QCCJ, LDCC44,.7SQ | LSSOP, TSOP40(UNSPEC) | LSSOP, TSOP40(UNSPEC) | LSSOP, TSOP40(UNSPEC) | QCCJ, LDCC44,.7SQ | LSSOP, TSOP40(UNSPEC) | LSSOP, TSOP40(UNSPEC) |
| 针数 | 44 | 32 | 32 | 32 | 44 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 300 ns | 300 ns | 300 ns | 250 ns | 300 ns | 250 ns | 200 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-PQCC-J44 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | S-PQCC-J44 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 16.51 mm | 18.4 mm | 18.4 mm | 18.4 mm | 16.51 mm | 18.4 mm | 18.4 mm |
| 内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 32 | 32 | 32 | 44 | 32 | 32 |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 组织 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | LSSOP | LSSOP | LSSOP | QCCJ | LSSOP | LSSOP |
| 封装等效代码 | LDCC44,.7SQ | TSOP40(UNSPEC) | TSOP40(UNSPEC) | TSOP40(UNSPEC) | LDCC44,.7SQ | TSOP40(UNSPEC) | TSOP40(UNSPEC) |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | CHIP CARRIER | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 1.27 mm | 1.27 mm | 1.27 mm | 4.57 mm | 1.27 mm | 1.27 mm |
| 最大待机电流 | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
| 最大压摆率 | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | GULL WING | GULL WING | GULL WING | J BEND | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 16.51 mm | 8 mm | 8 mm | 8 mm | 16.51 mm | 8 mm | 8 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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