PCM Codec, MU-Law, 1-Func, CMOS, CDIP22,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP22,.4 |
| Reach Compliance Code | unknown |
| 压伸定律 | MU-LAW |
| 滤波器 | YES |
| 最大增益公差 | 0.3 dB |
| JESD-30 代码 | R-GDIP-T22 |
| JESD-609代码 | e0 |
| 线性编码 | NOT AVAILABLE |
| 负电源额定电压 | -5 V |
| 功能数量 | 1 |
| 端子数量 | 22 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP22,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | +-5 V |
| 认证状态 | Not Qualified |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 电信集成电路类型 | PCM CODEC |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| MV3507DG | MV3506DG | MV3507ADG | MV3509DG | MV3508DG | |
|---|---|---|---|---|---|
| 描述 | PCM Codec, MU-Law, 1-Func, CMOS, CDIP22, | PCM Codec, A-Law, 1-Func, CMOS, CDIP22, | PCM Codec, MU-Law, 1-Func, CMOS, CDIP28, | PCM Codec, MU-Law, 1-Func, CDIP22, | PCM Codec, A-Law, 1-Func, CDIP22, |
| 包装说明 | DIP, DIP22,.4 | DIP, DIP22,.4 | DIP, DIP28,.6 | , | , |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 压伸定律 | MU-LAW | A-LAW | MU-LAW | MU-LAW | A-LAW |
| 滤波器 | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-GDIP-T22 | R-GDIP-T22 | R-GDIP-T28 | R-GDIP-T22 | R-GDIP-T22 |
| 负电源额定电压 | -5 V | -5 V | -5 V | -5 V | -5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 22 | 22 | 28 | 22 | 22 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 电信集成电路类型 | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC | PCM CODEC |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | - |
| 最大增益公差 | 0.3 dB | 0.2 dB | 0.3 dB | - | - |
| JESD-609代码 | e0 | e0 | e0 | - | - |
| 线性编码 | NOT AVAILABLE | NOT AVAILABLE | NOT AVAILABLE | - | - |
| 封装代码 | DIP | DIP | DIP | - | - |
| 封装等效代码 | DIP22,.4 | DIP22,.4 | DIP28,.6 | - | - |
| 电源 | +-5 V | +-5 V | +-5 V | - | - |
| 技术 | CMOS | CMOS | CMOS | - | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | - | - |
| Base Number Matches | 1 | 1 | 1 | - | - |
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