1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-24 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 最大模拟输入电压 | 5 V |
| 最小模拟输入电压 | -5 V |
| 最长转换时间 | 5200000 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 30.545 mm |
| 最大线性误差 (EL) | 0.024% |
| 湿度敏感等级 | 1 |
| 标称负供电电压 | -12 V |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY, OFFSET BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 245 |
| 座面最大高度 | 4.572 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MAX184BCNG | MAX183BCWG | MAX183BCNG+ | MAX183BCNG | MAX183BEWG | |
|---|---|---|---|---|---|
| 描述 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24, SOP-24 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | 1-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO24, SOP-24 |
| 是否无铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | SOIC | DIP | DIP | SOIC |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-24 | SOP-24 | 0.300 INCH, PLASTIC, DIP-24 | DIP, | SOP-24 |
| 针数 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 最大模拟输入电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 最小模拟输入电压 | -5 V | -5 V | -5 V | -5 V | -5 V |
| 最长转换时间 | 5200000 µs | 3250000 µs | 3250000 µs | 3250000 µs | 3250000 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 |
| JESD-609代码 | e0 | e0 | e3 | e0 | e0 |
| 长度 | 30.545 mm | 15.4 mm | 30.545 mm | 30.545 mm | 15.4 mm |
| 最大线性误差 (EL) | 0.024% | 0.024% | 0.024% | 0.024% | 0.024% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 标称负供电电压 | -12 V | -12 V | -12 V | -12 V | -12 V |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 输出位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 245 | 240 | 260 | 240 | 240 |
| 座面最大高度 | 4.572 mm | 2.65 mm | 4.572 mm | 4.572 mm | 2.65 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | 30 | 20 | 20 |
| 宽度 | 7.62 mm | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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