SPST, 1 Func, 1 Channel, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | CAN ALSO OPERATE WITH 5V AND 12V SUPPLY |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e0 |
| 长度 | 9.585 mm |
| 正常位置 | NC |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 标称断态隔离度 | 72 dB |
| 最大通态电阻 (Ron) | 175 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3/12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.33 mm |
| 最大供电电压 (Vsup) | 16 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 最长断开时间 | 125 ns |
| 最长接通时间 | 400 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| PS302EPA | PS302CUA | PS302ESA | PS303CPA | PS303CUA | PS303EPA | PS303ESA | PS303CSA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | SPST, 1 Func, 1 Channel, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | SPST, 1 Func, 1 Channel, CMOS, PDSO8, MSOP-8 | SPST, 1 Func, 1 Channel, CMOS, PDSO8, 0.150 INCH, SOIC-8 | SPDT, 1 Func, 1 Channel, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | SPDT, 1 Func, 1 Channel, CMOS, PDSO8, MSOP-8 | SPDT, 1 Func, 1 Channel, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | SPDT, 1 Func, 1 Channel, CMOS, PDSO8, 0.150 INCH, SOIC-8 | SPDT, 1 Func, 1 Channel, CMOS, PDSO8, 0.150 INCH, SOIC-8 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | MSOP | SOIC | DIP | MSOP | DIP | SOIC | SOIC |
| 包装说明 | DIP, DIP8,.3 | TSSOP, TSSOP8,.19 | SOP, SOP8,.25 | DIP, DIP8,.3 | TSSOP, TSSOP8,.19 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | CAN ALSO OPERATE WITH 5V AND 12V SUPPLY | CAN ALSO OPERATE WITH 5V AND 12V SUPPLY | CAN ALSO OPERATE WITH 5V AND 12V SUPPLY | CAN ALSO OPERATE WITH 5V AND 12V SUPPLY | CAN ALSO OPERATE WITH 5V AND 12V SUPPLY | CAN ALSO OPERATE WITH 5V AND 12V SUPPLY | CAN ALSO OPERATE WITH 5V AND 12V SUPPLY | CAN ALSO OPERATE WITH 5V AND 12V SUPPLY |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPDT | SPDT | SPDT | SPDT | SPDT |
| JESD-30 代码 | R-PDIP-T8 | S-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | S-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 9.585 mm | 3 mm | 4.9 mm | 9.585 mm | 3 mm | 9.585 mm | 4.9 mm | 4.9 mm |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 标称断态隔离度 | 72 dB | 72 dB | 72 dB | 72 dB | 72 dB | 72 dB | 72 dB | 72 dB |
| 最大通态电阻 (Ron) | 175 Ω | 175 Ω | 175 Ω | 175 Ω | 175 Ω | 175 Ω | 175 Ω | 175 Ω |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | TSSOP | SOP | DIP | TSSOP | DIP | SOP | SOP |
| 封装等效代码 | DIP8,.3 | TSSOP8,.19 | SOP8,.25 | DIP8,.3 | TSSOP8,.19 | DIP8,.3 | SOP8,.25 | SOP8,.25 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 240 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3/12 V | 3.3/12 V | 3.3/12 V | 3.3/12 V | 3.3/12 V | 3.3/12 V | 3.3/12 V | 3.3/12 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.33 mm | 1.1 mm | 1.75 mm | 5.33 mm | 1.1 mm | 5.33 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 16 V | 16 V | 16 V | 16 V | 16 V | 16 V | 16 V | 16 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | YES | YES | NO | YES | NO | YES | YES |
| 最长断开时间 | 125 ns | 125 ns | 125 ns | 125 ns | 125 ns | 125 ns | 125 ns | 125 ns |
| 最长接通时间 | 400 ns | 400 ns | 400 ns | 400 ns | 400 ns | 400 ns | 400 ns | 400 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 0.65 mm | 1.27 mm | 2.54 mm | 0.65 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 3 mm | 3.9 mm | 7.62 mm | 3 mm | 7.62 mm | 3.9 mm | 3.9 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
DIY/开源硬件专区
嵌入式系统
stm32/stm8
FPGA/CPLD
DIY/开源硬件专区
电源技术
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
