32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144
参数名称 | 属性值 |
零件包装代码 | BGA |
包装说明 | LBGA, BGA144,12X12,40 |
针数 | 144 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.3 |
具有ADC | YES |
地址总线宽度 | |
位大小 | 32 |
最大时钟频率 | 50 MHz |
DAC 通道 | YES |
DMA 通道 | YES |
外部数据总线宽度 | |
JESD-30 代码 | S-PBGA-B144 |
长度 | 13 mm |
I/O 线路数量 | 100 |
端子数量 | 144 |
最高工作温度 | 105 °C |
最低工作温度 | -40 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LBGA |
封装等效代码 | BGA144,12X12,40 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE |
电源 | 1.8/3.3 V |
认证状态 | Not Qualified |
RAM(字节) | 131072 |
ROM(单词) | 524288 |
ROM可编程性 | FLASH |
座面最大高度 | 1.7 mm |
速度 | 100 MHz |
最大供电电压 | 3.6 V |
最小供电电压 | 1.71 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
宽度 | 13 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
Base Number Matches | 1 |
MK40N512VMD100 | MK40X128VLQ100 | MK40X128VLQ100R | MK40N512VMD100R | MK40X256VLQ100R | ALC-3.3S | MK40X256VMD100R | MK40X128VMD100 | MK40X128VMD100R | |
---|---|---|---|---|---|---|---|---|---|
描述 | 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 | 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144 | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144 | 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 | 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144 | A C -D C Power Module | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 | 32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 | 32-BIT, FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144 |
零件包装代码 | BGA | QFP | QFP | BGA | QFP | - | BGA | BGA | BGA |
包装说明 | LBGA, BGA144,12X12,40 | LFQFP, QFP144,.87SQ,20 | LFQFP, QFP144,.87SQ,20 | LBGA, BGA144,12X12,40 | LFQFP, QFP144,.87SQ,20 | - | LBGA, BGA144,12X12,40 | LBGA, BGA144,12X12,40 | LBGA, BGA144,12X12,40 |
针数 | 144 | 144 | 144 | 144 | 144 | - | 144 | 144 | 144 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | - | unknown | unknown | unknown |
ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | - | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
具有ADC | YES | YES | YES | YES | YES | - | YES | YES | YES |
位大小 | 32 | 32 | 32 | 32 | 32 | - | 32 | 32 | 32 |
最大时钟频率 | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | - | 50 MHz | 50 MHz | 50 MHz |
DAC 通道 | YES | YES | YES | YES | YES | - | YES | YES | YES |
DMA 通道 | YES | YES | YES | YES | YES | - | YES | YES | YES |
JESD-30 代码 | S-PBGA-B144 | S-PQFP-G144 | S-PQFP-G144 | S-PBGA-B144 | S-PQFP-G144 | - | S-PBGA-B144 | S-PBGA-B144 | S-PBGA-B144 |
长度 | 13 mm | 20 mm | 20 mm | 13 mm | 20 mm | - | 13 mm | 13 mm | 13 mm |
I/O 线路数量 | 100 | 100 | 100 | 100 | 100 | - | 100 | 100 | 100 |
端子数量 | 144 | 144 | 144 | 144 | 144 | - | 144 | 144 | 144 |
最高工作温度 | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | - | 105 °C | 105 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
PWM 通道 | YES | YES | YES | YES | YES | - | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LBGA | LFQFP | LFQFP | LBGA | LFQFP | - | LBGA | LBGA | LBGA |
封装等效代码 | BGA144,12X12,40 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | BGA144,12X12,40 | QFP144,.87SQ,20 | - | BGA144,12X12,40 | BGA144,12X12,40 | BGA144,12X12,40 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | - | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
电源 | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | - | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 131072 | 32768 | 32768 | 131072 | 65536 | - | 65536 | 32768 | 32768 |
ROM(单词) | 524288 | 131072 | 131072 | 524288 | 262144 | - | 262144 | 131072 | 131072 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | - | FLASH | FLASH | FLASH |
座面最大高度 | 1.7 mm | 1.6 mm | 1.6 mm | 1.7 mm | 1.6 mm | - | 1.7 mm | 1.7 mm | 1.7 mm |
速度 | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | - | 100 MHz | 100 MHz | 100 MHz |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 1.71 V | 1.71 V | 1.71 V | 1.71 V | 1.71 V | - | 1.71 V | 1.71 V | 1.71 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | - | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | GULL WING | GULL WING | BALL | GULL WING | - | BALL | BALL | BALL |
端子节距 | 1 mm | 0.5 mm | 0.5 mm | 1 mm | 0.5 mm | - | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | QUAD | QUAD | BOTTOM | QUAD | - | BOTTOM | BOTTOM | BOTTOM |
宽度 | 13 mm | 20 mm | 20 mm | 13 mm | 20 mm | - | 13 mm | 13 mm | 13 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
厂商名称 | - | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
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