Edition 2010-03
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2010 Infineon Technologies AG
All Rights Reserved.
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information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
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TC1782
Table of Contents
Table of Contents
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1
1
1.1
1
1.1
1
1
1.1
1.1.1
1.1.2
1.1.3
1.1.4
1.2
1.2.1
1.2.2
1.2.3
1.2.4
1.2.5
1.2.6
1.3
1.3.1
1.3.2
1.3.3
1.3.4
1.3.5
1.3.6
1.3.7
1.3.8
1.3.8.1
1.3.8.2
1.3.8.3
1.3.8.4
1.4
1.4.1
1.4.2
1.4.3
1.4.4
Summary of Features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
System Overview of the TC1782
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Block Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Pinning
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
TC1782 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Identification Registers
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Electrical Parameters
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
Analog to Digital Converters (ADCx) . . . . . . . . . . . . . . . . . . . . . . . . . 1-23
Fast Analog to Digital Converter (FADC) . . . . . . . . . . . . . . . . . . . . . . 1-29
Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-32
Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-33
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-34
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-37
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-37
Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-38
Power, Pad and Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-40
Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-42
ERAY Phase Locked Loop (ERAY_PLL) . . . . . . . . . . . . . . . . . . . . . . 1-44
JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-45
DAP Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-47
Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-49
Micro Link Interface (MLI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . 1-49
Micro Second Channel (MSC) Interface Timing . . . . . . . . . . . . . . 1-51
SSC Master/Slave Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 1-53
ERAY Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-55
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-57
Package Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-57
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-58
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-58
Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-60
V 0.7 Preliminary, 2010-03
Target Data Sheet/ACDC Target Specification I-1
TC1782
1.5
1.5.1
1.5.1.1
1.5.1.2
1.5.1.3
1.5.2
1.5.2.1
1.5.2.2
1.5.2.3
1.5.3
1.5.3.1
1.5.4
1.5.5
1.5.6
Pin Reliability in Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Classes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Influences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Positive Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reliability at Room Temperature . . . . . . . . . . . . . . . . . . . . . . . . . .
Reliability at High Temperatures . . . . . . . . . . . . . . . . . . . . . . . . . .
Reliability Calculation Method . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Negative Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reliability at High Temperatures . . . . . . . . . . . . . . . . . . . . . . . . . .
FADC Input Buffer Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
LVDS / CMOS Combo Pad Reliability . . . . . . . . . . . . . . . . . . . . . . . .
Overload Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-61
1-61
1-61
1-61
1-62
1-63
1-63
1-64
1-65
1-67
1-67
1-70
1-70
1-71
Target Data Sheet/ACDC Target Specification I-2
V 0.7 Preliminary, 2010-03