Low-Power Embedded Pentium
®
Processor with MMX™ Technology
Datasheet
Product Features
s
s
s
s
s
Support for MMX™ Technology
Low-Power 0.25 Micron Process
Technology
— 1.9 V (166/266 MHz) Core Supply
for PPGA
— 1.8 V (166 MHz) or 2.0 V (266 MHz)
Core Supply for HL-PBGA
— 2.5 V I/O Interface (166/266 MHz)
32-Bit CPU with 64-Bit Data Bus
Fractional Bus Operation
— 166-MHz Core/66-MHz Bus
— 266-MHz Core/66-MHz Bus
Superscalar Architecture
— Enhanced Pipelines
— Two Pipelined Integer Units Capable
of Two Instructions/Clock
— Pipelined MMX Technology
— Pipelined Floating-Point Unit
s
s
s
s
s
s
s
s
s
Separate Code and Data Caches
— 16-Kbyte Code, 16-Kbyte
Write-Back Data
— MESI Cache Protocol
Compatible with Large Software Base
— MS-DOS*, Windows*, OS/2*, UNIX*
4-Mbyte Pages for Increased TLB Hit Rate
IEEE 1149.1 Boundary Scan
Advanced Design Features
— Deeper Write Buffers
— Enhanced Branch Prediction Feature
— Virtual Mode Extensions
Internal Error Detection Features
On-Chip Local APIC Controller
Power Management Features
— System Management Mode
— Clock Control
296-pin PPGA or 352-ball HL-PBGA
The Low-Power Embedded Pentium Processor with MMX Technology in the HL-PBGA
package is also available in extended temperature ranges from -40°C to +115°C. For more
information, see the
Extended Temperature Pentium
®
Processor with MMX™ Technology
datasheet, order number 273232.
Order Number: 273184-003
September, 1999
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual
property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not
intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Low-Power Embedded Pentium
®
Processor with MMX™ Technology may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product o rder.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
548-4725 or by visiting Intel's website at http://www.intel.com.
Copyright © Intel Corporation, 1999
*Third-party brands and names are the property of their respective owners.
Datasheet
Low-Power Embedded Pentium
®
Processor with MMX™ Technology
Contents
1.0
2.0
Introduction
.................................................................................................................. 7
1.1
2.1
2.2
Processor Features ............................................................................................... 7
Pentium
®
Processor Family Architecture .............................................................. 9
Pentium
®
Processor with MMX™ Technology ....................................................12
2.2.1 Full Support for Intel MMX™ Technology ..............................................12
2.2.2 16-Kbyte Code and Data Caches...........................................................13
2.2.3 Improved Branch Prediction ...................................................................13
2.2.4 Enhanced Pipeline .................................................................................13
2.2.5 Deeper Write Buffers..............................................................................13
0.25 Micron Technology ......................................................................................13
Differences from Desktop Processors.................................................................14
PPGA Pinout and Pin Descriptions .....................................................................15
HL-PBGA Pinout and Pin Descriptions ...............................................................19
Design Notes.......................................................................................................23
Pin Quick Reference ...........................................................................................23
Bus Fraction (BF) Selection ................................................................................29
The CPUID Instruction ........................................................................................30
Boundary Scan Chain List...................................................................................32
Pin Reference Tables..........................................................................................33
Pin Grouping According to Function....................................................................35
Mechanical Specifications ...................................................................................36
3.11.1 PPGA Package Mechanical Diagrams...................................................36
3.11.2 HL-PBGA Package Mechanical Diagrams .............................................38
Thermal Specifications ........................................................................................39
3.12.1 Measuring Thermal Values ....................................................................39
3.12.2 Thermal Equations and Data..................................................................39
3.12.3 Airflow Calculations for Maximum and Typical Power............................40
3.12.4 PPGA Package Thermal Resistance Information ..................................41
3.12.5 HL-PBGA Package Thermal Resistance Information.............................42
Absolute Maximum Ratings.................................................................................43
DC Specifications ................................................................................................43
4.2.1 Power Sequencing .................................................................................43
AC Specifications ................................................................................................46
4.3.1 Power and Ground .................................................................................46
4.3.2 Decoupling Recommendations ..............................................................46
4.3.3 Connection Specifications ......................................................................47
4.3.4 AC Timings.............................................................................................47
I/O Buffer Models ................................................................................................55
4.4.1 Buffer Model Parameters .......................................................................56
Signal Quality Specifications ...............................................................................58
4.5.1 Overshoot...............................................................................................58
Architecture Overview
............................................................................................. 8
2.3
3.0
Packaging Information
...........................................................................................14
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
4.0
Electrical Specifications
........................................................................................43
4.1
4.2
4.3
4.4
4.5
Datasheet
3
Low-Power Embedded Pentium
®
Processor with MMX™ Technology
4.6
4.7
4.8
4.5.2 Undershoot............................................................................................. 59
4.5.3 Ringback ................................................................................................ 60
4.5.4 Settling Time .......................................................................................... 61
4.5.5 Measurement Methodology.................................................................... 62
Measuring Maximum Overshoot, Undershoot and Ringback.............................. 63
Measuring Overshoot Threshold Duration .......................................................... 63
Measuring Undershoot Threshold Duration ........................................................ 63
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
Pentium
®
Processor with MMX™ Technology Block Diagram............................ 11
PPGA Package Top Side View ........................................................................... 15
PPGA Package Pin Side View ............................................................................ 16
HL-PBGA Package Top Side View ..................................................................... 19
HL-PBGA Package Pin Side View ...................................................................... 20
EAX Bit Assignments for CPUID......................................................................... 30
EDX Bit Assignments for CPUID......................................................................... 30
PPGA Package Dimensions ............................................................................... 36
HL-PBGA Package Dimensions.......................................................................... 38
Technique for Measuring T
C
............................................................................... 40
Thermal Resistance vs. Heatsink Height, PPGA Packages ............................... 41
Thermal Resistance vs. Airflow for HL-PBGA Package...................................... 42
Clock Waveform.................................................................................................. 52
Valid Delay Timings ............................................................................................ 52
Float Delay Timings ............................................................................................ 52
Setup and Hold Timings...................................................................................... 53
Reset and Configuration Timings........................................................................ 53
Test Timings........................................................................................................ 54
Test Reset Timings ............................................................................................. 54
First Order Input Buffer Model............................................................................. 55
First Order Output Buffer Model.......................................................................... 56
Maximum Overshoot Level, Overshoot Threshold Level and
Overshoot Threshold Duration ............................................................................ 59
Maximum Undershoot Level, Undershoot Threshold Level
and Undershoot Threshold Duration ................................................................... 60
Maximum Ringback Associated with the Signal High State................................ 61
Maximum Ringback Associated with the Signal Low State................................. 61
Settling Time ....................................................................................................... 62
4
Datasheet
Low-Power Embedded Pentium
®
Processor with MMX™ Technology
Tables
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
Signals Removed from the Low-Power Embedded Pentium
®
Processor
with MMX™ Technology .....................................................................................14
Pin Cross Reference by Pin Name (PPGA Package) .......................................17
No Connect, Power Supply and Ground Pin
Cross Reference (PPGA Package) .....................................................................18
Pin Cross Reference by Pin Name (HL-PBGA Package) .................................21
No Connect, Power Supply and Ground Pin
Cross Reference (HL-PBGA Package) ...............................................................22
Quick Pin Reference .........................................................................................23
Bus Frequency Selection ....................................................................................30
EDX Bit Assignment Definitions for CPUID.........................................................31
Output Pins..........................................................................................................33
Input Pins ............................................................................................................34
Input/Output Pins.................................................................................................35
Pin Functional Grouping......................................................................................35
PPGA Package Dimensions................................................................................37
HL-PBGA Package Dimensions..........................................................................38
Thermal Resistances for PPGA Packages..........................................................41
Thermal Resistances for HL-PBGA Packages....................................................42
Absolute Maximum Ratings.................................................................................43
V
CC
and T
CASE
Specifications.............................................................................44
DC Specifications ................................................................................................44
I
CC
Specifications ................................................................................................44
Power Dissipation Requirements for Thermal Design.........................................45
Input and Output Characteristics.........................................................................45
Low-Power Embedded Pentium® Processor
with MMX™ Technology AC Specifications ........................................................48
APIC AC Specifications.......................................................................................51
Notes to Tables 23 and 24...................................................................................51
Parameters Used in the Specification of the First Order Input Buffer Model.......56
Parameters Used in the Specification of the First Order Output Buffer Model....56
Signal to Buffer Type...........................................................................................57
Input, Output and Bidirectional Buffer Model
Parameters for PPGA Package...........................................................................57
Preliminary Input, Output and Bidirectional Buffer Model
Parameters for HL-PBGA Package.....................................................................57
Input Buffer Model Parameters: D (Diodes) ........................................................58
Overshoot Specification Summary ......................................................................58
Undershoot Specification Summary ....................................................................59
Datasheet
5
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