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IS24C02-2Z

产品描述EEPROM, 256X8, Serial, CMOS, PDSO8, TSSOP-8
产品类别存储    存储   
文件大小54KB,共16页
制造商Integrated Silicon Solution ( ISSI )
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IS24C02-2Z概述

EEPROM, 256X8, Serial, CMOS, PDSO8, TSSOP-8

IS24C02-2Z规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码SOIC
包装说明TSSOP, TSSOP8,.25
针数8
Reach Compliance Codenot_compliant
ECCN代码EAR99
最大时钟频率 (fCLK)0.1 MHz
数据保留时间-最小值100
耐久性1000000 Write/Erase Cycles
I2C控制字节1010DDDR
JESD-30 代码R-PDSO-G8
JESD-609代码e0
长度4.4 mm
内存密度2048 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量8
字数256 words
字数代码256
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256X8
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装等效代码TSSOP8,.25
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
并行/串行SERIAL
峰值回流温度(摄氏度)NOT SPECIFIED
电源2/5 V
认证状态Not Qualified
座面最大高度1.2 mm
串行总线类型I2C
最大待机电流0.000004 A
最大压摆率0.003 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.8 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度3 mm
最长写入周期时间 (tWC)10 ms
写保护HARDWARE
Base Number Matches1

文档预览

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IS24C01 IS24C02
IS24C04 IS24C08 IS24C16
1K-bit/2K-bit/4K-bit/8K-bit/16K-bit
2-WIRE SERIAL CMOS EEPROM
FEATURES
• Low Power CMOS Technology
–Standby Current less than 8 µA (5.5V)
–Read Current (typical) less than 1 mA (5.5V)
–Write Current (typical) less than 3 mA (5.5V)
• Flexible Voltage Operation
–Vcc = 1.8V to 5.5V for –2 version
–Vcc = 2.5V to 5.5V for –3 version
• 400 KHz (I
2
C Protocol) Compatibility
• Hardware Data Protection
–Write Protect Pin
• Sequential Read Feature
• Filtered Inputs for Noise Suppression
• 8-pin PDIP and 8-pin SOIC packages
• 8-pin TSSOP (1K,2K, 4K & 8K only)
• 8-pin MSOP (1K,2K only)
• Self time write cycle with auto clear
5 ms @ 2.5V
• Organization:
–IS24C01 128x8 (one block of 128 bytes)
–IS24C02 256x8 (one block of 256 bytes)
–IS24C04 512x8 (two blocks of 256 bytes)
–IS24C08 1024x8 (four blocks of 256 bytes)
–IS24C16 2048x8 (eight blocks of 256 bytes)
• Page Write Buffer
• Two-Wire Serial Interface
–Bi-directional data transfer protocol
• High Reliability
–Endurance: 1,000,000 Cycles
–Data Retention: 100 Years
• Commercial, Industrial and Automotive tempera-
ture ranges
ISSI
APRIL 2002
®
DESCRIPTION
The IS24CXX (refers to IS24C01, IS24C02, IS24C04,
IS24C08, IS24C16) family is a low-cost and low voltage 2-
wire Serial EEPROM. It is fabricated using ISSI’s advanced
CMOS EEPROM technology and provides a low power and
low voltage operation. The IS24CXX family features a write
protection feature, and is available in 8-pin DIP and 8-pin
SOIC packages.
The IS24C01 is a 1K-bit EEPROM; IS24C02 is a 2K-bit
EEPROM; IS24C04 is a 4K-bit EEPROM; IS24C08 is a 8K-
bit EEPROM; IS24C16 is a 16K-bit EEPROM.
The IS24C01 and IS24C02 are available in 8-pin MSOP
package. The IS24C01, IS24C02, IS24C04, and IS24C08
are available in 8-Pin TSSOP package.
Automotive data is preliminary.
Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. D
06/25/02
1

IS24C02-2Z相似产品对比

IS24C02-2Z IS24C04-2PI
描述 EEPROM, 256X8, Serial, CMOS, PDSO8, TSSOP-8 EEPROM, 512X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
是否无铅 含铅 含铅
是否Rohs认证 不符合 不符合
零件包装代码 SOIC DIP
包装说明 TSSOP, TSSOP8,.25 0.300 INCH, PLASTIC, DIP-8
针数 8 8
Reach Compliance Code not_compliant unknown
ECCN代码 EAR99 EAR99
最大时钟频率 (fCLK) 0.1 MHz 0.1 MHz
数据保留时间-最小值 100 100
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C控制字节 1010DDDR 1010DDMR
JESD-30 代码 R-PDSO-G8 R-PDIP-T8
JESD-609代码 e0 e0
长度 4.4 mm 9.3218 mm
内存密度 2048 bit 4096 bit
内存集成电路类型 EEPROM EEPROM
内存宽度 8 8
功能数量 1 1
端子数量 8 8
字数 256 words 512 words
字数代码 256 512
工作模式 SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C
组织 256X8 512X8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP DIP
封装等效代码 TSSOP8,.25 DIP8,.3
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
并行/串行 SERIAL SERIAL
峰值回流温度(摄氏度) NOT SPECIFIED 240
电源 2/5 V 2/5 V
认证状态 Not Qualified Not Qualified
座面最大高度 1.2 mm 4.572 mm
串行总线类型 I2C I2C
最大待机电流 0.000004 A 0.000004 A
最大压摆率 0.003 mA 0.003 mA
最大供电电压 (Vsup) 5.5 V 5.5 V
最小供电电压 (Vsup) 1.8 V 1.8 V
标称供电电压 (Vsup) 2.5 V 2.5 V
表面贴装 YES NO
技术 CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 GULL WING THROUGH-HOLE
端子节距 0.65 mm 2.54 mm
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED 30
宽度 3 mm 7.62 mm
最长写入周期时间 (tWC) 10 ms 10 ms
写保护 HARDWARE HARDWARE

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