TECHNICAL DATA
IN74ACT34
Hex Noninverter Buffer
High-Speed Silicon-Gate CMOS
The IN74ACT34 is identical in pinout to the LS/ALS34, HC/HCT34.
The IN74ACT34 may be used as a level converter for interfacing TTL or
NMOS outputs to High Speed CMOS inputs.
•
•
•
•
•
TTL/NMOS Compatible Input Levels
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 4.5 to 5.5 V
Low Input Current: 1.0
μA;
0.1
μA
@ 25°C
Outputs Source/Sink 24 mA
ORDERING INFORMATION
IN74ACT34N Plastic
IN74ACT34D SOIC
T
A
= -40° to 85° C for all packages
LOGIC DIAGRAM
PIN ASSIGNMENT
FUNCTION TABLE
Inputs
PIN 14 =V
CC
PIN 7 = GND
A
L
H
Output
Y
L
H
Rev. 00
IN74ACT34
MAXIMUM RATINGS
*
Symbol
V
CC
V
IN
V
OUT
I
IN
I
OUT
I
CC
P
D
Tstg
T
L
*
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Sink/Source Current, per Pin
DC Supply Current, V
CC
and GND Pins
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
Value
-0.5 to +7.0
-0.5 to V
CC
+0.5
-0.5 to V
CC
+0.5
±20
±50
±50
750
500
-65 to +150
260
Unit
V
V
V
mA
mA
mA
mW
°C
°C
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
V
CC
V
IN
, V
OUT
T
J
T
A
I
OH
I
OL
t
r
, t
f
*
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Junction Temperature (PDIP)
Operating Temperature, All Package Types
Output Current - High
Output Current - Low
Input Rise and Fall Time
*
(except Schmitt Inputs)
V
CC
=4.5 V
V
CC
=5.5 V
Min
4.5
0
-40
Max
5.5
V
CC
140
+85
-24
24
Unit
V
V
°C
°C
mA
mA
ns/V
0
0
10
8.0
V
IN
from 0.8 V to 2.0 V
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, V
IN
and V
OUT
should be constrained to the range GND≤(V
IN
or
V
OUT
)≤V
CC
.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V
CC
). Unused
outputs must be left open.
Rev. 00
IN74ACT34
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
V
CC
Symbol
V
IH
V
IL
V
OH
Parameter
Minimum High-
Level Input Voltage
Maximum Low -
Level Input Voltage
Minimum High-
Level Output Voltage
Test Conditions
V
OUT
=V
CC
- 0.1 V
V
OUT
=0.1 V
I
OUT
≤
-50
μA
V
IN
=V
IH
I
OH
=-24 mA
I
OH
=-24 mA
V
OL
Maximum Low-
Level Output Voltage
I
OUT
≤
50
μA
V
IN
=V
IL
I
OL
=24 mA
I
OL
=24 mA
I
IN
ΔI
CCT
I
OLD
I
OHD
I
CC
Maximum Input
Leakage Current
Additional Max
I
CC
/Input
+Minimum Dynamic
Output Current
+Minimum Dynamic
Output Current
Maximum Quiescent
Supply Current
(per Package)
V
IN
=V
CC
or GND
V
IN
=V
CC
- 2.1 V
V
OLD
=1.65 V Max
V
OHD
=3.85 V Min
V
IN
=V
CC
or GND
*
*
Guaranteed Limits
25
°C
2.0
2.0
0.8
0.8
4.4
5.4
3.86
4.86
0.1
0.1
0.36
0.36
±0.1
-40°C to
85°C
2.0
2.0
0.8
0.8
4.4
5.4
3.76
4.76
0.1
0.1
0.44
0.44
±1.0
1.5
75
-75
4.0
40
μA
mA
mA
mA
μA
V
Unit
V
V
V
V
4.5
5.5
4.5
5.5
4.5
5.5
4.5
5.5
4.5
5.5
4.5
5.5
5.5
5.5
5.5
5.5
5.5
*
All outputs loaded; thresholds on input associated with output under test.
+Maximum test duration 2.0 ms, one output loaded at a time.
Rev. 00
IN74ACT34
AC ELECTRICAL CHARACTERISTICS
(V
CC
=5.0 V
±
10%, C
L
=50pF,Input t
r
=t
f
=3.0 ns)
Guaranteed Limits
Symbol
Parameter
25
°C
Min
t
PLH
t
PHL
C
IN
Propagation Delay, Input A to Output Y
(Figure 1)
Propagation Delay, Input A to Output Y
(Figure 1)
Maximum Input Capacitance
1.5
1.5
4.5
Max
8.5
9.5
-40°C to
85°C
Min
1.0
1.0
4.5
Max
9.0
10.0
ns
ns
pF
Unit
Typical @25°C,V
CC
=5.0 V
C
PD
Power Dissipation Capacitance
35
pF
Figure 1. Switching Waveforms
Rev. 00
IN74ACT34
N SUFFIX PLASTIC DIP
(MS - 001AA)
A
14
8
B
1
7
Dimension, mm
Symbol
A
B
C
MIN
18.67
6.1
MAX
19.69
7.11
5.33
0.36
1.14
2.54
7.62
0°
2.92
7.62
0.2
0.38
10°
3.81
8.26
0.36
0.56
1.78
F
L
D
F
C
-T-
SEATING
N
G
D
0.25 (0.010) M T
K
PLANE
G
H
H
J
M
J
K
L
M
N
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
D SUFFIX SOIC
(MS - 012AB)
Dimension, mm
8
A
14
Symbol
A
MIN
8.55
3.8
1.35
0.33
0.4
1.27
5.27
0°
0.1
0.19
5.8
0.25
MAX
8.75
4
1.75
0.51
1.27
H
B
P
B
C
1
G
7
C
R x 45
D
F
G
-T-
D
0.25 (0.010) M T C M
K
SEATING
PLANE
H
J
F
M
J
K
M
P
R
8°
0.25
0.25
6.2
0.5
NOTES:
1. Dimensions A and B do not include mold flash or protrusion.
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
for A; for B
‑
0.25 mm (0.010) per side.
Rev. 00
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