OTP ROM, 1MX8, 120ns, CMOS, PDSO32, PLASTIC, TSOP-32
| 参数名称 | 属性值 |
| 零件包装代码 | TSOP |
| 包装说明 | TSOP1, |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 120 ns |
| JESD-30 代码 | R-PDSO-G32 |
| 长度 | 18.4 mm |
| 内存密度 | 8388608 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 8 mm |
| Base Number Matches | 1 |
| AT27C080-12TCT/R | AT27C080-15RCT/R | AT27C080-12RIT/R | AT27C080-12TIT/R | AT27C080-12RCT/R | AT27C080-15TCT/R | AT27C080-10RCT/R | AT27C080-10TCT/R | AT27C080-15TIT/R | AT27C080-15RIT/R | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 1MX8, 120ns, CMOS, PDSO32, PLASTIC, TSOP-32 | OTP ROM, 1MX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOIC-32 | OTP ROM, 1MX8, 120ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOIC-32 | OTP ROM, 1MX8, 120ns, CMOS, PDSO32, PLASTIC, TSOP-32 | OTP ROM, 1MX8, 120ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOIC-32 | OTP ROM, 1MX8, 150ns, CMOS, PDSO32, PLASTIC, TSOP-32 | OTP ROM, 1MX8, 100ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOIC-32 | OTP ROM, 1MX8, 100ns, CMOS, PDSO32, PLASTIC, TSOP-32 | OTP ROM, 1MX8, 150ns, CMOS, PDSO32, PLASTIC, TSOP-32 | OTP ROM, 1MX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOIC-32 |
| 零件包装代码 | TSOP | SOIC | SOIC | TSOP | SOIC | TSOP | SOIC | TSOP | TSOP | SOIC |
| 包装说明 | TSOP1, | SOP, | SOP, | TSOP1, | SOP, | TSOP1, | SOP, | TSOP1, | TSOP1, | SOP, |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 120 ns | 150 ns | 120 ns | 120 ns | 120 ns | 150 ns | 100 ns | 100 ns | 150 ns | 150 ns |
| JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
| 长度 | 18.4 mm | 20.75 mm | 20.75 mm | 18.4 mm | 20.75 mm | 18.4 mm | 20.75 mm | 18.4 mm | 18.4 mm | 20.75 mm |
| 内存密度 | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C |
| 组织 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 | 1MX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | SOP | SOP | TSOP1 | SOP | TSOP1 | SOP | TSOP1 | TSOP1 | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 2.77 mm | 2.77 mm | 1.2 mm | 2.77 mm | 1.2 mm | 2.77 mm | 1.2 mm | 1.2 mm | 2.77 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 1.27 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 8 mm | 11.15 mm | 11.15 mm | 8 mm | 11.15 mm | 8 mm | 11.15 mm | 8 mm | 8 mm | 11.15 mm |
| 厂商名称 | - | Atmel (Microchip) | - | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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