Pb Free
*Customer:
SPECIFICATION
Preliminary
ITEM
MODEL
Revision Date
CHIP LED DEVICE
SSC-NB104
Std(070426)
[Contents]
1. Features
2. Absolute maximum ratings
3. Electro-optical characteristics
4. Characteristic diagram
5. Soldering profile
6. Outline dimension
7. Packing
8. Reel packing structure
9.
Precaution for use
10.
Rank Division
Customer
Approved by
Approved by
Approved by
Supplier
Drawn by
Checked by
Approved by
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
Seoul
SSC-NB104
Semiconductor
- 1/9 -
1. Features
Package : 1.6×0.8×0.4 mm
Untinted, Diffused flat mold
Wavelength : 472 nm
2. Absolute Maximum Ratings
Parameter
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Symbol
P
d
I
F
I
FM*1
V
R
T
opr
T
stg
Value
64
20
50
5
-30 ~ 85
-40 ~ 100
(Ta=25℃)
Unit
½
㎃
㎃
V
℃
℃
*1 I
FM
conditions: Pulse width Tw≤ 0.1ms and Duty ratio≤ 1/10
3. Electro-Optical Characteristics
Parameter
Forward Voltage
Reverse Current
Luminous Intensity
*2
Wavelength
Spectral Bandwidth
Viewing angle
*3
Symbol
V
F
I
R
I
V
λ
D
(Ta=25℃)
Condition
I
F
=5㎃
V
R
=5V
I
F
=5㎃
I
F
=5㎃
I
F
=5㎃
I
F
=5㎃
Min
2.7
-
11
460
-
-
Typ
3.05
-
35
472
30
120
Max
3.2
10
55
480
-
-
Unit
V
㎂
mcd
㎚
㎚
˚
Δλ
2θ
1/2
*2 The luminous intensity I
V
is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
*3
θ
1/2
is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 5mA within
the maximum ratings shown above. All measurements were made under the standardized environment of SSC.
(Tolerance :
Iv
±10
%,
λ
D
±2
nm, VF
±0.1
V)
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-NB104
- 2/9 -
4. Characteristic Diagrams
Forward Current vs Forward Voltage
400
350
Luminous Intensity vs Forward Current
Forward Current I
F
(mA)
10
Relative Intensity I
V
[%]
300
250
200
150
100
50
1
2.9
3.0
3.1
3.2
3.3
3.4
3.5
0
5
10
15
20
25
30
Forward Voltage V
F
(V)
Forward Current I
F
[mA]
Forward Current Derating Curve
25
Radiation Diagram
20
Forward current I
F
(mA)
15
10
5
0
-25
0
25
50
75
100
Ambient temperature Ta(
℃
)
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-NB104
- 3/9 -
5. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
LED Surface temperature
LED Surface temperature
°C
Operation heating
240
150
~
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
120
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 260℃max. for 10 seconds max.
°C
Operation heating
260
150
~
120
0
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
60 to 120 sec.
10 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280℃, under Soldering iron.
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-NB104
- 4/9 -
6. Outline Dimension
Tolerance:
±0.1,
0.3
0.12
Resin
1.1
1.6
1.2
Polarity Mark
Unit:
㎜
Cathode
0.8
2.4
PCB
0.3
0.8
0.4
±0.05
Anode
0.8
[Recommended Solder Pattern]
7. Packing
1.5
+0.1
-0
±0.05
1.85
±0.05
1.75
2.0
±0.05
±0.1
4.0
±0.1
0.2
±0.05
3.5
(2.75)
4.0
±0.1
0.5
±0.08
0.95
±0.05
8.0
±0.2
0.5
±0.05
180
+0
-3
11.4
9
±0.3
2
±0.2
+0.2
-0
22
13
±0.2
Label
60
Tolerance:
±0.2,
Unit:
㎜
(1) Quantity : 4,000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be
±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off
from the carrier tape at 10˚ angle to be the carrier tape.
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
SSC-QP-0401-06(REV.0)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-NB104
- 5/9 -
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
