HSMx-C265
Surface Mount Chip LEDs
Data Sheet
Description
The HSMx-C265 is a reverse mountable chip-type LED for
lighting the non-component side of a PCB board. In this
reverse mounting configuration, this LED is designed to
emit light through a small cut-out hole in the PC board.
The HSMx-C265 is available in four colors. The small size,
narrow footprint, and low profile make this series of LEDs
excellent for backlighting, status indication, and front panel
illumination application.
Features
•
Reverse mountable
•
Undiffused optics
•
Small 3.4 x 1.25 mm footprint
•
Operating temperature range of –30°C to +85°C
•
Compatible with IR solder reflow
•
Four colors available: red, orange, yellow, and green
•
Available in 8 mm tape on 7" (178 mm) diameter
reels
Applications
•
Keypad backlighting
•
Symbol backlighting
•
LCD backlighting
•
Status indication
Device Selection Guide
Part Number
HSMS-C265
HSMD-C265
HSMY-C265
HSMG-C265
HSMH-C265
Color
High Efficiency Red
Orange
Yellow
Green
AlGaAs Red
Parts Per Reel
3000
3000
3000
3000
3000
Package Dimensions
3.4 (0.134)
LED DIE
CATHODE
MARK
1.25 (0.049)
R 0.25 (0.01)
0.4 (0.016)
WHITE SOLDER MASK
(THICKNESS = 0.15 (0.006)
0.4 (0.016)
GREEN CATHODE MARK
(CUM SOLDER MASK)
UNDIFFUSED
EPOXY
1.1 (0.043)
PC BOARD
1.2
(0.047)
POLARITY
1.1 (0.043)
0.3 (0.012)
0.25 (0.01)
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
SOLDERING
TERMINAL
Notes:
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
1. All dimensions in millimeters (inches).
2. TOLERANCE IS ± 0.1
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise
mm UNLIESS OTHERWISE SPECIFIED.
specified.
3. Polarity of HSMH-C265 will be the opposite of what is shown on above drawing.
HSMx-C260 Pkg Dimen
Absolute Maximum Ratings
T
A
= 25°C
Parameter
DC Forward Current
[1]
Peak Pulsing Current
[2]
Power Dissipation
Reverse Voltage (I
R
= 100 µA)
Led Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
HSMD/G/S/Y-C265
HSMH-C265
Units
mA
mA
mW
V
°C
°C
°C
25
25
100
100
65
65
5
5
95
95
–30 to +85
–30 to +85
–40 to +85
–40 to +85
See IR soldering profile (Figure 6)
Notes:
1. Derate linearly as shown in Figure 4.
2. Pulse condition of 1/10 duty and 0.1 msec. width.
2
Electrical Characteristics
T
A
= 25°C
Part Number
HSMS-C265
HSMD-C265
HSMY-C265
HSMG-C265
HSMH-C265
Forward Voltage
V
F
(Volts)
@ I
F
= 20 mA
Typ.
Max.
2.1
2.2
2.1
2.2
1.8
2.6
2.6
2.6
2.6
2.6
Reverse Breakdown
V
R
(Volts)
@ I
R
= 100 µA
Min.
5
5
5
5
5
Capacitance
C (pF), V
F
= 0,
f = 1 MHz
Typ.
[1]
8
6
7
6
18
Thermal
Resistance
Rθ
J-PIN
(°C/W)
Typ.
250
250
250
250
300
Optical Characteristics
T
A
= 25°C
Part Number
HSMS-C265
HSMD-C265
HSMY-C265
HSMG-C265
HSMH-C265
Color
HER
Orange
Yellow
Green
AlGaAs
Luminous Intensity
I
v
(mcd) @ 20 mA
[1]
Min. Typ.
2.5
2.5
2.5
4.0
6.3
10.0
8.0
8.0
15.0
17.0
Peak Wavelength
λ
peak
(nm)
Typ.
630
605
589
570
660
Dominant Wavelength
λ
d
(nm)
[2]
Typ.
626
604
586
572
639
Viewing Angle
2θ
1/2
Degrees
[3]
Typ.
150
150
150
150
150
Notes:
1. The luminous intensity, I
v
, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the
lamp package.
2. The dominant wavelength,
λ
d
, is derived from the CIE Chromatically Diagram and represent the perceived color of the device.
3.
θ
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1.0
GREEN
RELATIVE INTENSITY
YELLOW
0.5
ORANGE
HER
0
500
550
600
650
700
750
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
HSMx-C260 fig 1
3
100
I
F
– FORWARD CURRENT – mA
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
1.6
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
35
30
25
20
15
10
5
0
0
20
40
60
80
100
Rθ
J-A
= 600°C/W
Rθ
J-A
= 800°C/W
10
HER
GREEN
1.2
0.8
1
YELLOW
0.1
ORANGE
1.5
1.7
1.9
2.1
2.3
V
F
– FORWARD VOLTAGE – V
0.4
0
0
10
20
30
40
I
F
– FORWARD CURRENT – mA
T
A
– AMBIENT TEMPERATURE – °C
Figure 2. Forward current vs. forward
voltage.
HSMX-C190 fig 2
Figure 3. Luminous intensity vs. forward cur-
rent.
HSMx-C260 fig 3
Figure 4. Maximum forward current vs. ambient
temperature.
HSMx-C260 fig 4
1.00
0.90
RELATIVE INTENSITY – %
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
ANGLE
Figure 5. Relative intensity vs. angle.
HSMx-C260 fig 5
2.2 (0.087) DIA. PCB HOLE
10 SEC. MAX.
TEMPERATURE
230°C MAX.
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
4°C/SEC. MAX.
3°C/SEC. MAX.
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
1.25 (0.049)
Figure 6. Recommended reflow soldering profile.
Figure 7. Recommended soldering pad pattern.
HSMx-C260 fig 7
HSMx-C260 fig 6
Note:
1. All dimensions in millimeters (inches).
4
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 8. Reeling orientation.
8.0 ± 1.0 (0.315 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
10.50 ± 1.0 (0.413 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
178.40 ± 1.00
(7.024 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
4.0 ± 0.5
(0.157 ± 0.020)
6
PS
5.0 ± 0.5
(0.197 ± 0.020)
Figure 9. Reel Dimensions.
HSMx-C260 Reel Dimensions
Note:
1. All dimensions in millimeters (inches).
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