HSMB-C1xx
Surface Mount ChipLEDs
Data Sheet
HSMB-C112, HSMB-C172, HSMB-C192,
HSMB-C196, HSMB-C152
Description
This series of low current blue ChipLEDs is designed
specifically for low current application. This makes
them very suitable for cellular phone and portable
equipment which runs off a battery. These parts are
according to industry standard footprint. In order to
facilitate automated pick and place operation, these
ChipLEDs are shipped in tape and reel, with 4000 units
per reel for HSMB-C172/192/196 series and 3000
units per reel for the HSMB-C112/152 series. These
parts are compatible with IR soldering.
Features
• Various size and mount options available
• Industry standard footprint
• Operating temperature range of –30˚C to +85˚C
• Compatible with IR solder reflow
• Available in 8 mm tape on 7" diameter reel
Applications
• LCD backlighting
• Keypad backlighting
• Pushbutton backlighting
• Symbol indicator
• Front panel indicator
CAUTION:
HSMB-C1xx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions
during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
LED DIE
CATHODE
LINE
CATHODE
MARK
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
2.0 (0.079 )
3.2 (0.126 )
CLEAR
EPOXY
1.5 (0.059)
PC BOARD
0.5 (0.020)
POLARITY
DIFFUSED
EPOXY
0.3 (0.012)
PC BOARD
1.4
(0.055)
POLARITY
0.8 (0.031)
0.3 (0.012)
CATHODE LINE
0.4 ± 0.15
(0.016 ± 0.006)
CATHODE LINE
1.6 (0.063 )
3.2 (0.126 )
0.8 (0.031)
0.4 ± 0.15
(0.016 ± 0.006)
1.0 (0.039)
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C172
HSMx-C112
CATHODE
MARK
1.6 (0.063)
3.2 (0.126 )
DIFFUSED
EPOXY
0.6 (0.024)
2.0 (0.079)
POLARITY
1.1 (0.043)
PC BOARD
0.5 (0.020)
CATHODE LINE
0.5 ± 0.2
(0.020 ± 0.008)
0.5 ± 0.2
(0.020 ± 0.008)
SOLDERING
TERMINAL
HSMx-C152
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
Package Dimensions
CATHODE
MARK
CATHODE
MARK
0.8 (0.031)
0.8 (0.031)
1.6
(0.063 )
1.0
(0.039)
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
0.8 (0.031)
0.3 (0.012)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
1.6
(0.063 )
POLARITY
1.0
(0.039)
0.3 (0.012)
DIFFUSED EPOXY
PC BOARD
POLARITY
0.6 (0.023)
0.3 (0.012)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C192
HSMx-C196
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
3
Device Selection Guide
Package Dimension (mm)
1.6 (L) x 0.8 (W) x 0.6 (H)
1.6 (L) x 0.8 (W) x 0.8 (H)
2.0 (L) x 1.25 (W) x 0.8 (H)
3.2 (L) x 1.5 (W) x 1.0 (H)
[1]
3.2 (L) x 1.6 (W) x 1.1 (H)
Note:
1. Right angle package.
GaN Blue
HSMB-C196
HSMB-C192
HSMB-C172
HSMB-C112
HSMB-C152
Package Description
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Nondiffused
Untinted, Diffused
Absolute Maximum Ratings at T
A
= 25˚C
Parameter
DC Forward Current
[1]
Power Dissipation
Reverse Voltage (I
R
= 100
µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Note:
1. Derate linearly as shown in Figure 4.
HSMB-C112/172/192/196/152
10
46
5
95
Units
mA
mW
V
˚C
–30 to +85
˚C
–40 to +85
˚C
See reflow soldering profile (Figure 7 & 8)
Electrical Characteristics at T
A
= 25˚C
Forward
Voltage
V
F
(Volts)
@ I
F
= 10 mA
Typ.
Max.
4.0
4.6
4.0
4.6
Reverse
Breakdown
V
R
(Volts)
@ I
R
= 100
µA
Min.
5
5
Capacitance C
(pF), V
F
= 0,
f = 1 MHz
Typ.
43
43
Thermal
Resistance
Rθ
J-PIN
(˚C/W)
Typ.
550
550
Part Number
HSMB-C152/C172/C192/C196
HSMB-C112
V
F
Tolerance:
±
0.1 V
Optical Characteristics at T
A
= 25˚C
Luminous
Intensity
I
v
(mcd)
@ 10 mA
[1]
Min.
Typ.
1.1
3.1
1.1
3.0
1.1
3.0
1.1
3.0
1.1
3.0
Peak
Wavelength
λ
peak
(nm)
Typ.
428
428
428
428
428
Color
Dominant
Wavelength
λ
d[2]
(nm)
Typ.
462
462
462
462
462
Luminous
Efficacy
η
v
(lm/w)
Typ.
55
55
55
55
55
Part Number
HSMB-C112
HSMB-C172
HSMB-C192
HSMB-C196
HSMB-C152
Viewing Angle
2
θ
1/2
Degrees
[3]
Typ.
130
170
170
170
170
Notes:
1.The luminous intensity I
v
is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2.The dominant wavelength
λ
d
is derived from the CIE Chromatically Diagram and represents the perceived color of the device.
3.θ
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4
RELATIVE INTENSITY – %
Bin ID
A
B
C
D
Dom. Wavelength (nm)
Min.
Max.
460
465
465
470
470
475
475
480
80
I
F
– FORWARD CURRENT – mA
Blue Color Bin Limits
[1]
100
100
10
60
40
1
20
Tolerance:
±1
nm
0
400
450
500
550
600
650
700
WAVELENGTH – nm
0.1
3.0
3.2
3.4
3.6
3.8
4.0
4.2
V
F
– FORWARD VOLTAGE – V
Light Intensity (I
v
) Bin Limits
[1]
Intensity (mcd)
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Min.
0.11
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
Max.
0.18
0.29
0.45
0.72
1.10
1.80
2.80
4.50
7.20
11.20
18.00
28.50
45.00
71.50
112.50
180.00
285.00
450.00
715.00
1125.00
1800.00
2850.00
4500.00
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
120
100
80
60
40
20
0
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
12
10
8
6
4
2
0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
5
10
15
20
0 10 20 30 40 50 60 70 80 90 100
T
A
– AMBIENT TEMPERATURE – °C
I
F
– FORWARD CURRENT – mA
Figure 3. Luminous intensity vs. forward
current.
Figure 4. Maximum forward current vs.
ambient temperature.
100
90
RELATIVE INTENSITY – %
80
70
60
50
40
30
20
10
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
Tolerance:
±
15%
Notes:
1. Bin categories are established for
classification of products. Products may
not be available in all categories. Please
contact your Avago srepresentative for
information regarding currently available
bins.
2. The Iv binning specification set-up is for
lowest allowable Iv binning only. There are
no upper Iv bin limits.
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C172, C192, C196, and C152.
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