Power Management and Analog Companions (PMAAC)
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 |
| 针数 | 32 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-XQCC-N32 |
| 长度 | 5 mm |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC32,.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.9 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 2.8 V |
| 标称供电电压 (Vsup) | 3.6 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 5 mm |
| Base Number Matches | 1 |
| AT73C224-B | AT73C224-A | AT73C224-D | AT73C224-C | |
|---|---|---|---|---|
| 描述 | Power Management and Analog Companions (PMAAC) | Power Management and Analog Companions (PMAAC) | Power Management and Analog Companions (PMAAC) | Power Management and Analog Companions (PMAAC) |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | QFN | QFN | QFN | QFN |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 | VQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 |
| 针数 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | compli | compli | compli | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | S-XQCC-N32 | S-XQCC-N32 | S-XQCC-N32 | S-XQCC-N32 |
| 长度 | 5 mm | 5 mm | 5 mm | 5 mm |
| 信道数量 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | VQCCN | HVQCCN | HVQCCN |
| 封装等效代码 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.9 mm | 0.9 mm | 0.9 mm | 0.9 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 2.8 V | 2.8 V | 2.8 V | 2.8 V |
| 标称供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 5 mm | 5 mm | 5 mm | 5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
| Is Samacsys | N | N | N | - |
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