SMDA05CN-5 THRU SMDA15CN-5
PROTECTION PRODUCTS
Description
The SMDAxxCN-5 series of transient voltage suppres-
sors are designed to protect components which are
connected to data and transmission lines from voltage
surges caused by electrostatic discharge (ESD), electri-
cal fast transients (EFT), and lightning.
TVS diodes are characterized by their high surge
capability, low operating and clamping voltages, and
fast response time. This makes them ideal for use as
board level protection of sensitive semiconductor
components. The SMDAxxCN-5 is designed to provide
transient suppression on multiple data lines and I/O
ports. The low profile SO-8 design allows the user to
protect up to five data and I/O lines with one package.
The SMDAxxCN-5 TVS diode array will meet the surge
requirements of IEC 61000-4-2 (Formerly IEC 801-2),
Level 4, “Human Body Model” for air and contact
discharge.
Bidirectional TVS Array
for Protection of Five Lines
Features
300 watts peak pulse power (tp = 8/20µs)
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 12A (8/20µs)
Protects up to 5 bidirectional lines
Low operating voltage
Low clamping voltage
Solid-state silicon avalanche technology
Mechanical Characteristics
JEDEC SO-8 package
Molding compound flammability rating: UL 94V-0
Marking : Part number, date code, logo
Packaging : Tube or Tape and Reel per EIA 481
Applications
RS-232 Data Lines
RS-423 Data Lines
LAN/WAN Equipment
Servers
Notebook and Desktop PC
Set Top Box
Peripherals
Circuit Diagram
Schematic and PIN Configuration
SO-8 (Top View)
Revision 08/15/06
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SMDA05CN-5 THRU SMDA15CN-5
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Peak Pulse Power (tp = 8/20µs)
Peak Pulse Current (tp = 8/20µs)
Lead Soldering Temperature
Operating Temperature
Storage Temperature
Symbol
P
p k
I
P P
T
L
T
J
T
STG
Value
300
20
260 (10 sec.)
-55 to +125
-55 to +150
Units
Watts
A
°C
°C
°C
Electrical Characteristics (T=25
o
C)
SMDA05CN-5
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamp ing Voltage
Clamp ing Voltage
Maximum Peak Pulse Current
Junction Cap acitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
I
P P
C
j
I
t
= 1mA
V
RWM
= 5V, T=25°C
I
PP
= 1A, tp = 8/20µs
I
PP
= 10A, tp = 8/20µs
tp = 8/20µs
Between I/O Pins and
Ground
V
R
= 0V, f = 1MHz
6
10
9.8
11
20
350
Conditions
Minimum
Typical
Maximum
5
Units
V
V
µA
V
V
A
pF
SMDA15CN-5
Parameter
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
Clamp ing Voltage
Clamp ing Voltage
Maximum Peak Pulse Current
Junction Cap acitance
Symbol
V
RWM
V
BR
I
R
V
C
V
C
I
P P
C
j
I
t
= 1mA
V
RWM
= 15V, T=25°C
I
PP
= 1A, tp = 8/20µs
I
PP
= 10A, tp = 8/20µs
tp = 8/20µs
Between I/O Pins and
Ground
V
R
= 0V, f = 1MHz
16.7
1
24
30
10
75
Conditions
Minimum
Typical
Maximum
15
Units
V
V
µA
V
V
A
pF
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SMDA05CN-5 THRU SMDA15CN-5
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
10
Peak Pulse Power - P
Pk
(kW)
Power Derating Curve
110
100
90
% of Rated Power or I
PP
80
70
60
50
40
30
20
10
1
0.1
0.01
0.1
1
10
Pulse Duration - tp (µs)
100
1000
0
0
25
50
75
100
125
o
150
175
Ambient Temperature - T
A
( C)
Pulse Waveform
110
100
90
80
Percent of I
PP
70
60
50
40
30
20
10
0
0
5
10
15
Time (µs)
20
25
30
0
35
Clamping Voltage vs. Peak Pulse Current
Waveform
Parameters:
tr = 8
µ
s
td = 20
µ
s
30
Clamping Voltage - V
C
(V)
25
20
15
10
5
SMDA05CN-5
SMDA15CN-5
Waveform
Parameters:
tr = 8µs
td = 20µs
e
-t
td = I
PP
/2
0
2
4
6
8
10
12
14
16
18
20
22
24
Peak Pulse Current - I
PP
(A)
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SMDA05CN-5 THRU SMDA15CN-5
PROTECTION PRODUCTS
Applications Information
Device Connection Options for Protection of Four or
Five Data Lines
The SMDAxxCN-5 can be configured to protect either
four or five bidirectional data lines. The options for
connecting the devices are as follows:
1. Bidirectional protection of four I/O lines is achieved
by connecting pins 1, 2, 3, and 4 to the data lines.
Pins 5, 6, 7, and 8 are connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces. In this
configuration, the device can withstand the maxi-
mum specified transient impulse on four lines
simultaneously.
2. Bidirectional protection of five I/O lines is achieved
by connecting pins 1, 2, 3, 4, and 5 to the data
lines. Pins 6, 7, and 8 are connected to ground.
The ground connection should be made directly to
the circuit board ground plane for best results. In
this configuration, the device can withstand the
maximum rated transient impulse on any two lines
simultaneously.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
To Protected IC
Protection for Four Bidirectional Lines
From Connector
To Protected IC
Protection for Five Bidirectional Lines
From Connector
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
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SMDA05CN-5 THRU SMDA15CN-5
PROTECTION PRODUCTS
Outline Drawing - SO-8
A
N
2X E/2
E1 E
1
ccc C
2X N/2 TIPS
2
e/2
B
D
aaa C
SEATING
PLANE
A2 A
C
bxN
bbb
A1
C A-B D
SIDE VIEW
GAGE
PLANE
0.25
e
D
h
h
H
DIMENSIONS
INCHES
MILLIMETERS
DIM
MIN NOM MAX MIN NOM MAX
c
A
A1
A2
b
c
D
E1
E
e
h
L
L1
N
01
aaa
bbb
ccc
-
.053
.069
-
.010
.004
-
.065
.049
-
.012
.020
-
.010
.007
.189 .193 .197
.150 .154 .157
.236 BSC
.050 BSC
-
.010
.020
.016 .028 .041
(.041)
8
-
8°
0°
.004
.010
.008
-
1.35
1.75
-
0.10
0.25
-
1.25
1.65
-
0.31
0.51
-
0.17
0.25
4.80 4.90 5.00
3.80 3.90 4.00
6.00 BSC
1.27 BSC
-
0.25
0.50
0.40 0.72 1.04
(1.04)
8
-
0°
8°
0.10
0.25
0.20
L
(L1)
DETAIL
01
A
SEE DETAIL
A
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MS-012, VARIATION AA.
Land Pattern - SO-8
X
DIM
(C)
G
Z
C
G
P
X
Y
Z
DIMENSIONS
INCHES
MILLIMETERS
(.205)
.118
.050
.024
.087
.291
(5.20)
3.00
1.27
0.60
2.20
7.40
Y
P
NOTES:
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2. REFERENCE IPC-SM-782A, RLP NO. 300A.
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