
IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LLCC,44PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 包装说明 | QCCN, LCC44,.28SQ,20 |
| Reach Compliance Code | compliant |
| 位大小 | 8 |
| CPU系列 | COP800 |
| JESD-30 代码 | S-PQCC-N44 |
| JESD-609代码 | e3 |
| 湿度敏感等级 | 3 |
| 端子数量 | 44 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCN |
| 封装等效代码 | LCC44,.28SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 256 |
| ROM(单词) | 8192 |
| ROM可编程性 | FLASH |
| 速度 | 20 MHz |
| 最大压摆率 | 11.5 mA |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| COP8CCE9HLQ9/NOPB | COP8CCE9HVA9/NOPB | COP8CCE9HLQ7/NOPB | COP8CCE9IMT7AWZ | COP8CCE9IMT7CQL | COP8CCE9IMT7CQL/NOPB | COP8CCE9IMT7XXX | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LLCC,44PIN,PLASTIC | 8-BIT, FLASH, 20 MHz, MICROCONTROLLER, PQCC44 | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,LLCC,44PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,TSSOP,48PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,TSSOP,48PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,TSSOP,48PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,COP800 CPU,CMOS,TSSOP,48PIN,PLASTIC |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 不符合 | 符合 | 不符合 |
| 包装说明 | QCCN, LCC44,.28SQ,20 | QCCJ, LDCC44,.7SQ | QCCN, LCC44,.28SQ,20 | TSSOP, TSSOP48,.3,20 | TSSOP, TSSOP48,.3,20 | TSSOP, TSSOP48,.3,20 | TSSOP, TSSOP48,.3,20 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | unknown | compliant |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | COP800 | COP800 | COP800 | COP800 | COP800 | COP800 | COP800 |
| JESD-30 代码 | S-PQCC-N44 | S-PQCC-J44 | S-PQCC-N44 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
| 湿度敏感等级 | 3 | 3 | 3 | 2 | 2 | 2 | 2 |
| 端子数量 | 44 | 44 | 44 | 48 | 48 | 48 | 48 |
| 最高工作温度 | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCN | QCCJ | QCCN | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | LCC44,.28SQ,20 | LDCC44,.7SQ | LCC44,.28SQ,20 | TSSOP48,.3,20 | TSSOP48,.3,20 | TSSOP48,.3,20 | TSSOP48,.3,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 3/5 V | 3/5 V | 5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
| ROM(单词) | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
| ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 速度 | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| 最大压摆率 | 11.5 mA | 11.5 mA | 12.4 mA | 14.5 mA | 14.5 mA | 14.5 mA | 14.5 mA |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | NO LEAD | J BEND | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
| JESD-609代码 | e3 | e3 | e3 | e0 | e0 | - | e0 |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) |
| 厂商名称 | - | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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