Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
参数名称 | 属性值 |
零件包装代码 | TSOP1 |
包装说明 | TSOP1, |
针数 | 48 |
Reach Compliance Code | compliant |
ECCN代码 | 3A991.B.1.A |
最长访问时间 | 30 ns |
其他特性 | CONTAINS ADDITIONAL 64M BIT NAND FLASH |
JESD-30 代码 | R-PDSO-G48 |
长度 | 18.4 mm |
内存密度 | 2147483648 bit |
内存集成电路类型 | FLASH |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 48 |
字数 | 268435456 words |
字数代码 | 256000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256MX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP1 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
编程电压 | 1.8 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 1.95 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | DUAL |
宽度 | 12 mm |
Base Number Matches | 1 |
K9F2G08Q0M-YCB00 | K9F2G08Q0M-PIB00 | K9F2G16Q0M-YCB00 | K9F2G16Q0M-PIB00 | K9F2G16Q0M-PCB00 | K9F2G08Q0M-PCB00 | K9F2G08Q0M-YIB00 | K9F2G16Q0M-YIB00 | |
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描述 | Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 |
零件包装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
包装说明 | TSOP1, | 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | TSOP1, | TSOP1, | 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 | 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 |
针数 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
最长访问时间 | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns | 30 ns |
其他特性 | CONTAINS ADDITIONAL 64M BIT NAND FLASH | CONTAINS ADDITIONAL 64M BIT NAND FLASH | CONTAINS ADDITIONAL 64M BIT NAND FLASH | CONTAINS ADDITIONAL 64M BIT NAND FLASH | CONTAINS ADDITIONAL 64M BIT NAND FLASH | CONTAINS ADDITIONAL 64M BIT NAND FLASH | CONTAINS ADDITIONAL 64M BIT NAND FLASH | CONTAINS ADDITIONAL 64M BIT NAND FLASH |
JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
长度 | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm | 18.4 mm |
内存密度 | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 8 | 8 | 16 | 16 | 16 | 8 | 8 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
字数 | 268435456 words | 268435456 words | 134217728 words | 134217728 words | 134217728 words | 268435456 words | 268435456 words | 134217728 words |
字数代码 | 256000000 | 256000000 | 128000000 | 128000000 | 128000000 | 256000000 | 256000000 | 128000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C |
组织 | 256MX8 | 256MX8 | 128MX16 | 128MX16 | 128MX16 | 256MX8 | 256MX8 | 128MX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm |
厂商名称 | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
类型 | - | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE | SLC NAND TYPE |
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