Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 包装说明 | , 0603 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 电容 | 0.1 µF |
| 电容器类型 | CERAMIC CAPACITOR |
| 介电材料 | CERAMIC |
| 高度 | 0.8 mm |
| JESD-609代码 | e3 |
| 长度 | 1.6 mm |
| 安装特点 | SURFACE MOUNT |
| 多层 | Yes |
| 负容差 | 10% |
| 端子数量 | 2 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装形状 | RECTANGULAR PACKAGE |
| 封装形式 | SMT |
| 包装方法 | BULK |
| 正容差 | 10% |
| 额定（直流）电压（URdc） | 25 V |
| 尺寸代码 | 0603 |
| 表面贴装 | YES |
| 温度特性代码 | X7R |
| 温度系数 | 15% ppm/°C |
| 端子面层 | Matte Tin (Sn) - with Nickel (Ni) barrie |
| 端子形状 | WRAPAROUND |
| 宽度 | 0.8 mm |
| Base Number Matches | 1 |
| 器件名 | 厂商 | 描述 |
|---|---|---|
| CM105X7R104K25AL | Kyocera(京瓷) | CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 0.1 uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT |
| CM105X7R104K25AH | Kyocera(京瓷) | CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 0.1 uF, SURFACE MOUNT, 0603, CHIP, ROHS COMPLIANT |
| 0603J0250104KXT | Syfer | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| 0603B104K250SB | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| 0603B104K250NT | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| 0603B104K250N | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| 0603B104K250CT | Walsin_Technology_Corporation | CAP CER 0.1UF 25V X7R 0603 |
| C0603X104K3RACTM | KEMET(基美) | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT |
| C0603X104K3RALTM | KEMET(基美) | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| 0603B104K250S | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| 0603Y0250104KXT | Syfer | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| TMK107B7104KAHT | Taiyo Yuden | Capacitor, Ceramic, Chip, General Purpose, 0.1uF, 25V, ±10%, X7R, 0603 (1608 mm), 0.031"T, -55º ~ +125ºC, 7" Reel/4mm pitch |
| 0603B104K250NB | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| 0603B104K250CB | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| CM105X7R104K25AN | Kyocera(京瓷) | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP, ROHS COMPLIANT |
| 0603B104K250C | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| 0603B104K250ST | Fenghua (HK) Electronics Ltd | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| C1608X7R1E104KB | TDK(株式会社) | Ceramic Capacitor, Multilayer, Ceramic, 25V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.1uF, Surface Mount, 0603, CHIP |
| CC0603KRX7R8BB104 | YAGEO(国巨) | |
| CL10B104KA8NNND | SAMSUNG(三星) | Capacitor, Ceramic, Chip, General Purpose, 0.1uF, 25V, ±10%, X7R, 0603 (1608 mm), 0.031"T, -55º ~ +125ºC, 7" Reel |
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