Standard SRAM, 16KX4, 12ns, CMOS, PDSO24, 0.300 INCH, SOJ-24
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
零件包装代码 | SOJ |
包装说明 | SOJ, SOJ24,.34 |
针数 | 24 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
最长访问时间 | 12 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-J24 |
JESD-609代码 | e0 |
长度 | 15.88 mm |
内存密度 | 65536 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 4 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 24 |
字数 | 16384 words |
字数代码 | 16000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 16KX4 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装等效代码 | SOJ24,.34 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 3.76 mm |
最大待机电流 | 0.00005 A |
最小待机电流 | 2 V |
最大压摆率 | 0.14 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
Base Number Matches | 1 |
KM6466BLJ-12 | KM6466BLJ-25 | KM6466BLP-20 | KM6466BLP-12 | KM6466BLJ-20 | KM6466BLP-15 | KM6466BLP-25 | KM6466BLJ-15 | |
---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 16KX4, 12ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 16KX4, 25ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 16KX4, 20ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 16KX4, 12ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 16KX4, 20ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 | Standard SRAM, 16KX4, 15ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 16KX4, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 16KX4, 15ns, CMOS, PDSO24, 0.300 INCH, SOJ-24 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | SOJ | SOJ | DIP | DIP | SOJ | DIP | DIP | SOJ |
包装说明 | SOJ, SOJ24,.34 | SOJ, SOJ24,.34 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOJ, SOJ24,.34 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOJ, SOJ24,.34 |
针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 12 ns | 25 ns | 20 ns | 12 ns | 20 ns | 15 ns | 25 ns | 15 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-J24 | R-PDSO-J24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-J24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-J24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 15.88 mm | 15.88 mm | 31.625 mm | 31.625 mm | 15.88 mm | 31.625 mm | 31.625 mm | 15.88 mm |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | SOJ | DIP | DIP | SOJ | DIP | DIP | SOJ |
封装等效代码 | SOJ24,.34 | SOJ24,.34 | DIP24,.3 | DIP24,.3 | SOJ24,.34 | DIP24,.3 | DIP24,.3 | SOJ24,.34 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.76 mm | 3.76 mm | 5.08 mm | 5.08 mm | 3.76 mm | 5.08 mm | 5.08 mm | 3.76 mm |
最大待机电流 | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
最大压摆率 | 0.14 mA | 0.11 mA | 0.12 mA | 0.14 mA | 0.12 mA | 0.13 mA | 0.11 mA | 0.13 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | NO | YES | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
厂商名称 | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
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