FIFO, 1KX9, 25ns, Asynchronous, CMOS, PDSO56, TSSOP-56
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP-56 |
| 针数 | 56 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 25 ns |
| 其他特性 | RETRANSMIT |
| 最大时钟频率 (fCLK) | 28.5 MHz |
| 周期时间 | 35 ns |
| JESD-30 代码 | R-PDSO-G56 |
| JESD-609代码 | e0 |
| 长度 | 14 mm |
| 内存密度 | 9216 bit |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 9 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 56 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1KX9 |
| 输出特性 | 3-STATE |
| 可输出 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP56,.3,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大压摆率 | 0.125 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 6.1 mm |
| Base Number Matches | 1 |
| IDT7281L25PA | IDT7281L20PA | IDT7280L20PA | IDT7282L20PA | IDT7282L25PA | IDT7280L25PA | |
|---|---|---|---|---|---|---|
| 描述 | FIFO, 1KX9, 25ns, Asynchronous, CMOS, PDSO56, TSSOP-56 | FIFO, 1KX9, 20ns, Asynchronous, CMOS, PDSO56, TSSOP-56 | FIFO, 512X9, 20ns, Asynchronous, CMOS, PDSO56, TSSOP-56 | FIFO, 2KX9, 20ns, Asynchronous, CMOS, PDSO56, TSSOP-56 | FIFO, 2KX9, 25ns, Asynchronous, CMOS, PDSO56, TSSOP-56 | FIFO, 512X9, 25ns, Asynchronous, CMOS, PDSO56, TSSOP-56 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 包装说明 | TSSOP-56 | TSSOP-56 | TSSOP-56 | TSSOP-56 | TSSOP-56 | TSSOP-56 |
| 针数 | 56 | 56 | 56 | 56 | 56 | 56 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 25 ns | 20 ns | 20 ns | 20 ns | 25 ns | 25 ns |
| 其他特性 | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
| 最大时钟频率 (fCLK) | 28.5 MHz | 33.3 MHz | 33.3 MHz | 33.3 MHz | 28.5 MHz | 28.5 MHz |
| 周期时间 | 35 ns | 30 ns | 30 ns | 30 ns | 35 ns | 35 ns |
| JESD-30 代码 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| 内存密度 | 9216 bit | 9216 bit | 4608 bit | 18432 bit | 18432 bit | 4608 bit |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 56 | 56 | 56 | 56 | 56 | 56 |
| 字数 | 1024 words | 1024 words | 512 words | 2048 words | 2048 words | 512 words |
| 字数代码 | 1000 | 1000 | 512 | 2000 | 2000 | 512 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1KX9 | 1KX9 | 512X9 | 2KX9 | 2KX9 | 512X9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
| 封装等效代码 | TSSOP56,.3,20 | TSSOP56,.3,20 | TSSOP56,.3,20 | TSSOP56,.3,20 | TSSOP56,.3,20 | TSSOP56,.3,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大压摆率 | 0.125 mA | 0.125 mA | 0.125 mA | 0.125 mA | 0.125 mA | 0.125 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 6.1 mm | 6.1 mm | 6.1 mm | 6.1 mm | 6.1 mm | 6.1 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
| 厂商名称 | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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