Flash, 512KX8, 150ns, PDSO32, PLASTIC, SOP-32
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | SOIC |
| 包装说明 | PLASTIC, SOP-32 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 150 ns |
| 其他特性 | BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| JESD-30 代码 | R-PDSO-G32 |
| JESD-609代码 | e0 |
| 长度 | 20.45 mm |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 部门数/规模 | 32 |
| 端子数量 | 32 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 512KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP32,.56 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 编程电压 | 12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.05 mm |
| 部门规模 | 16K |
| 最大待机电流 | 0.00002 A |
| 最大压摆率 | 0.1 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 切换位 | NO |
| 类型 | NOR TYPE |
| Base Number Matches | 1 |
| HN28F4001FP-15 | HN28F4001T-15 | HN28F4001P-20 | HN28F4001FP-12 | HN28F4001R-12 | HN28F4001FP-20 | HN28F4001R-15 | HN28F4001T-20 | HN28F4001R-20 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Flash, 512KX8, 150ns, PDSO32, PLASTIC, SOP-32 | Flash, 512KX8, 150ns, PDSO32, PLASTIC, TSOP1-32 | Flash, 512KX8, 200ns, PDIP32, PLASTIC, DIP-32 | Flash, 512KX8, 120ns, PDSO32, PLASTIC, SOP-32 | Flash, 512KX8, 120ns, PDSO32, PLASTIC, REVERSE, TSOP1-32 | Flash, 512KX8, 200ns, PDSO32, PLASTIC, SOP-32 | Flash, 512KX8, 150ns, PDSO32, PLASTIC, REVERSE, TSOP1-32 | Flash, 512KX8, 200ns, PDSO32, PLASTIC, TSOP1-32 | Flash, 512KX8, 200ns, PDSO32, PLASTIC, REVERSE, TSOP1-32 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SOIC | TSOP1 | DIP | SOIC | TSOP1 | SOIC | TSOP1 | TSOP1 | TSOP1 |
| 包装说明 | PLASTIC, SOP-32 | PLASTIC, TSOP1-32 | DIP, DIP32,.6 | PLASTIC, SOP-32 | PLASTIC, REVERSE, TSOP1-32 | SOP, SOP32,.56 | PLASTIC, REVERSE, TSOP1-32 | PLASTIC, TSOP1-32 | PLASTIC, REVERSE, TSOP1-32 |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 150 ns | 150 ns | 200 ns | 120 ns | 120 ns | 200 ns | 150 ns | 200 ns | 200 ns |
| 命令用户界面 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 20.45 mm | 18.4 mm | 41.9 mm | 20.45 mm | 18.4 mm | 20.45 mm | 18.4 mm | 18.4 mm | 18.4 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 部门数/规模 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | TSOP1 | DIP | SOP | TSOP1-R | SOP | TSOP1-R | LSSOP | TSOP1-R |
| 封装等效代码 | SOP32,.56 | TSSOP32,.8,20 | DIP32,.6 | SOP32,.56 | TSSOP32,.8,20 | SOP32,.56 | TSSOP32,.8,20 | TSSOP32,.8,20 | TSSOP32,.8,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.05 mm | 1.2 mm | 5.08 mm | 3.05 mm | 1.2 mm | 3.05 mm | 1.2 mm | 1.27 mm | 1.2 mm |
| 部门规模 | 16K | 16K | 16K | 16K | 16K | 16K | 16K | 16K | 16K |
| 最大待机电流 | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A | 0.00002 A |
| 最大压摆率 | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 0.5 mm | 2.54 mm | 1.27 mm | 0.5 mm | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 切换位 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 其他特性 | BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE | BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE | - | BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE | BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE | - | BULK ERASE; BLOCK ERASE; AUTOMATIC WRITE; BYTE PROGRAMMABLE | - | - |
| 厂商名称 | - | Hitachi （Renesas ） | - | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） |
| 宽度 | - | 8 mm | 15.24 mm | - | 8 mm | - | 8 mm | 8 mm | 8 mm |
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