8-bit microcontroller with accelerated two-clock 80C51 core 8 kB/16 kB 3 V byte-erasable flash with 10-bit ADC
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | LPCC |
| 包装说明 | PLASTIC, MS-018, SOT187-2, LCC-44 |
| 针数 | 44 |
| Reach Compliance Code | unknow |
| 具有ADC | YES |
| 其他特性 | ALSO OPERATES AT 2.4V SUPPLY |
| 地址总线宽度 | |
| 位大小 | 8 |
| 最大时钟频率 | 18 MHz |
| DAC 通道 | YES |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-PQCC-J44 |
| JESD-609代码 | e3 |
| 长度 | 16.585 mm |
| 湿度敏感等级 | 3 |
| I/O 线路数量 | 40 |
| 端子数量 | 44 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | 245 |
| 认证状态 | Not Qualified |
| ROM可编程性 | FLASH |
| 座面最大高度 | 4.57 mm |
| 速度 | 18 MHz |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin (Sn) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 16.585 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| P89LPC952FA | P89LPC952 | P89LPC954 | P89LPC952FBD | P89LPC954FA | P89LPC954FBD48 | P89LPC954FBD44 | |
|---|---|---|---|---|---|---|---|
| 描述 | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB/16 kB 3 V byte-erasable flash with 10-bit ADC | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB/16 kB 3 V byte-erasable flash with 10-bit ADC | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB/16 kB 3 V byte-erasable flash with 10-bit ADC | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB/16 kB 3 V byte-erasable flash with 10-bit ADC | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB/16 kB 3 V byte-erasable flash with 10-bit ADC | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB/16 kB 3 V byte-erasable flash with 10-bit ADC | 8-bit microcontroller with accelerated two-clock 80C51 core 8 kB/16 kB 3 V byte-erasable flash with 10-bit ADC |
| 是否无铅 | 不含铅 | - | - | 不含铅 | 不含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | 符合 | 符合 | - | 符合 |
| 厂商名称 | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
| 零件包装代码 | LPCC | - | - | QFP | LPCC | - | QFP |
| 包装说明 | PLASTIC, MS-018, SOT187-2, LCC-44 | - | - | 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT389-1, LQFP-44 | PLASTIC, MS-018, SOT187-2, LCC-44 | - | 10 X 10 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT389-1, LQFP-44 |
| 针数 | 44 | - | - | 44 | 44 | - | 44 |
| Reach Compliance Code | unknow | - | - | unknow | compli | - | compli |
| 具有ADC | YES | - | - | YES | YES | - | YES |
| 其他特性 | ALSO OPERATES AT 2.4V SUPPLY | - | - | ALSO OPERATES AT 2.4V SUPPLY | ALSO OPERATES AT 2.4V SUPPLY | - | ALSO OPERATES AT 2.4V SUPPLY |
| 位大小 | 8 | - | - | 8 | 8 | - | 8 |
| 最大时钟频率 | 18 MHz | - | - | 18 MHz | 18 MHz | - | 18 MHz |
| DAC 通道 | YES | - | - | YES | YES | - | YES |
| DMA 通道 | NO | - | - | NO | NO | - | NO |
| JESD-30 代码 | S-PQCC-J44 | - | - | S-PQFP-G44 | S-PQCC-J44 | - | S-PQFP-G44 |
| JESD-609代码 | e3 | - | - | e2 | e3 | - | e3 |
| 长度 | 16.585 mm | - | - | 10 mm | 16.585 mm | - | 10 mm |
| 湿度敏感等级 | 3 | - | - | 1 | 3 | - | 1 |
| I/O 线路数量 | 40 | - | - | 40 | 40 | - | 40 |
| 端子数量 | 44 | - | - | 44 | 44 | - | 44 |
| 最高工作温度 | 85 °C | - | - | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | - | -40 °C |
| PWM 通道 | YES | - | - | YES | YES | - | YES |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | QCCJ | - | - | LQFP | QCCJ | - | LQFP |
| 封装形状 | SQUARE | - | - | SQUARE | SQUARE | - | SQUARE |
| 封装形式 | CHIP CARRIER | - | - | FLATPACK, LOW PROFILE | CHIP CARRIER | - | FLATPACK, LOW PROFILE |
| 峰值回流温度（摄氏度） | 245 | - | - | 260 | 245 | - | 260 |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | - | Not Qualified |
| ROM可编程性 | FLASH | - | - | FLASH | FLASH | - | FLASH |
| 座面最大高度 | 4.57 mm | - | - | 1.6 mm | 4.57 mm | - | 1.6 mm |
| 速度 | 18 MHz | - | - | 18 MHz | 18 MHz | - | 18 MHz |
| 最大供电电压 | 3.6 V | - | - | 3.6 V | 3.6 V | - | 3.6 V |
| 最小供电电压 | 3 V | - | - | 3 V | 3 V | - | 3 V |
| 标称供电电压 | 3.3 V | - | - | 3.3 V | 3.3 V | - | 3.3 V |
| 表面贴装 | YES | - | - | YES | YES | - | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Tin (Sn) | - | - | Tin/Silver (Sn/Ag) | Tin (Sn) | - | Tin (Sn) |
| 端子形式 | J BEND | - | - | GULL WING | J BEND | - | GULL WING |
| 端子节距 | 1.27 mm | - | - | 0.8 mm | 1.27 mm | - | 0.8 mm |
| 端子位置 | QUAD | - | - | QUAD | QUAD | - | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | - | - | 30 | 30 | - | 30 |
| 宽度 | 16.585 mm | - | - | 10 mm | 16.585 mm | - | 10 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | - | - | MICROCONTROLLER | MICROCONTROLLER | - | MICROCONTROLLER |
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