Surface Mount Fuses
RoHS
Pb
Lead-Free SlimLine
™
1206
Slo-Blo
®
Fuse 468 Series
®
®
• Complies with electronic industry environmental standards for
lead reduction.
• Product is compatible with lead-free solders and higher
temperature profiles.
• Time delay feature withstands high in-rush currents and prevents
nuisance openings.
• Package is visually distinct from fast-acting version for easy identification.
• Top side marking allows visual verification of amperage rating.
ELECTRICAL CHARACTERISTICS:
% of Ampere
Rating
100%
200%
300%
800%
Opening
Time @ 25
°
C
4 hours,
Minimum
1 sec.,
Min.;
120 sec.,
Max.
0.05 sec.,
Min.;
1.5 sec.,
Max.
0.0015 sec.,
Min.;
.05 sec.,
Max.
Reference Dimensions:
MARKING CODE VARIES
WITH AMPERAGE RATING
(SEE CHART)
.66
(.026")
1.27
(.050")
Coating
.58
(.023")
AGENCY APPROVALS:
Recognized under the Components
Program of Underwriters Laboratories and Certified by CSA.
AGENCY FILE NUMBERS:
UL E10480, CSA LR 29862.
INTERRUPTING RATINGS:
1.0A - 1.5A
2.0A
3.0A
50 amperes at 63 VAC/VDC
35 amperes at 63 VAC/VDC
50 amperes at 32 VAC/VDC
3.18
(.125")
1.65
(.065")
1.52
(.060")
4.83
(.190")
1.52
(.060")
ENVIRONMENTAL SPECIFICATIONS:
Operating Temperature:
–55°C to 90°C. Consult temperature
rerating chart on page 4. For operation above 90°C contact Littelfuse.
3.81
(.150")
1.52
(.060")
1.14
(.045")
Vibration:
Withstands 10-55 Hz per MIL-STD-202F, Method 201A and
10-2000 Hz at 20 G’s per MIL-STD-202F, Method 204D, Condition D.
2.03
(.080")
WAVE SOLDER
2.03
(.080")
INFARED SOLDER
200°C up to 260°C, maximum.
100
Thermal Shock:
Withstands 5 cycles of -50°C to +125°C.
PHYSICAL SPECIFICATIONS:
Materials:
Body: Epoxy Substrate
Terminations: 100% Tin
Cover Coat: Conformal Coating
10
Soldering Parameters:
Reflow Solder: 260°C, 30 seconds maximum
TIME IN SECONDS
PACKAGING SPECIFICATIONS:
8mm Tape and Reel per
EIA-RS481-1 (IEC 286, part 3); 5,000 per reel, add packaging suffix, NR.
1
PATENTED
ORDERING INFORMATION:
Catalog
Number
0468
001.
0468
01.5
0468
002.
0468
003.
1
2
0.1
Amperage
Rating
(A)
1.0
1.5
2.0
3.0
Marking
Code
TH
TK
TN
TP
Voltage
Rating
(V)
63
63
63
32
Nom. Cold
Resistance
Cold Ohm
1
0.079
0.044
0.0325
0.0195
Nominal
Melting I
2
t
(A
2
sec)
2
0.127
0.288
0.506
1.270
0.01
0.001
0.1
1
10
CURRENT IN AMPERES
100
Measured at 10% of rated current, 25°C.
Measured at rated voltage.
368
w w w. l i t t e l f u s e . c o m
1A
1.5A
2A
3A
Insulation Resistance (After Opening):
Greater than 10,000 Ohms.
Resistance to Soldering Heat:
Withstands 60 seconds above
Average Time Current Curves
FPGA/CPLD
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