Bright View Electronics
SPECIFICATIONS FOR BRIGHT VIEW ELECTRONICS
TOP VIEW LED
MODEL :
BTX5630XTALNX
Bright View Electronics Co., Ltd.
5F, No. 192 Lien Chen Road, Chung-Ho City, Taipei County, Taiwan
Tel: 886-2-22409292
Fax: 886-2-22423355
http://www.bvled.com.tw
Date:2012/03/26
Preliminary - 3
Bright View Electronics
Content
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Description …………………………………………………………………1
■
Features ……………………………………………………………………1
1
■
Applications …………………………………………………………………
2
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Package Dimensions ………………………………………………………
■
Recommended Soldering Pad Design ………………………………… 2
■
Part Numbering System ………………………………………………… 2
3
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Absolute Maximum Ratings ………………………………………………
■
Optical Characteristics ……………………………………………………3
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Electrical Characteristics …………………………………………………4
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Luminous Intensity Bin Limits ……………………………………………4
■
Forward Voltage Bin Limits ………………………………………………4
■
Chromaticity Bin Limits- Natural White ………………………………… 5
6
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Chromaticity Diagram* CIE 1931 …………………………………………
7
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Chromaticity Bin Limits- Warm White ……………………………………
8
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Chromaticity Diagram* CIE 1931 …………………………………………
9
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Characteristics Data- BT85630XTALNX …………………………………
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Characteristics Data- BTS5630XTALNX ……………………………… 10
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Radiation Characteristic ………………………………………………… 11
12
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Package Carrier Tape Dimensions ………………………………………
■
Package Reel Dimensions ……………………………………………… 12
13
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Reliability Test Items and Conditions ……………………………………
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Criteria For Judging Damage …………………………………………… 13
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Cautions ……………………………………………………………………14
(1) Moisture Proof Package ………………………………………14
(2) Storage Conditions …………………………………………… 14
(3) Heat Generation …………………………………………………
14
(4) Cleaning …………………………………………………………14
15
(5) Soldering …………………………………………………………
(6) ESD protection …………………………………………………16
(7) Handling of Silica Gel LEDs ……………………………………
16
(8) Other …………………………………………………………… 17
Date:2012/03/26
Preliminary - 3
Bright View Electronics
■
Description
BTX5630XTALNX
The PLCC4 type BTX5630XTALNX TOP VIEW LED, with its light weight , enables smaller
board size, higher packing density, reduced storage space and miniature applications.
• Dice Material
• Light Color
• Colloid Color
：
InGaN
：
White
：
Yellow
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Features
•
•
•
•
•
•
•
•
•
1 chip package
Compatible with automatic placement equipment
Compatible with reflow soldering process
Long operating life
Low forward voltage operated
Instant light
Pb -free/ RoHS compliant
Electricall neutral thermal path
Encapsulating Resin : Silicone Resin
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Applications
•
•
•
•
•
•
•
General lighting
Amusement equipment
Lighting for small size device
Information boards
Light bar
Decoration
Marker lights
Date: 2012/03/26
Page: 1 of 17
Preliminary - 3
Bright View Electronics
■
Absolute Maximum Ratings (T
A
= 25°C)
Parameter
Power Dissipation
Continuous Forward Current
Operating Temperature Range
Storage Temperature Range
Reflow Soldering Condition 260℃ for 10 seconds
* 1/10 Duty Cycle , 0.1 ms Pulse Width
Symbol
P
D
I
F
T
opr
T
stg
T
sld
Max. Rating
0.5
150
－40
to
＋
85
－40
to
＋
85
2
Unit
W
mA
C
C
times
o
o
■
Optical Characteristics (T
A
= 25°C, I
F
=120mA)
Typ. Color
Part Nomber
Temperature, T (°K)
Typ. Chromaticity
Coordinates
x
y
Min.
CRI
Typ.
Luminous
Flux
Φ
(lm)
Min.
Max.
View Angle
2θ
1/2
(degree)
Typ.
BTS5630WTALNE
BT85630WTALNE
BTS5630MTALNE
BT85630MTALNE
4700~7000
4700~7000
2350~4700
2350~4700
-
-
-
-
-
-
-
-
70
80
70
80
-
-
-
-
30
30
30
30
50
50
50
50
120
120
120
120
Note: Luminous Intensity measurement allowance is 10%.
Note: Please contact our sales department for more information.
Date: 2012/03/26
Page: 3 of 17
Preliminary - 3
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