Microcontroller, 8-Bit, MROM, 10MHz, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NEC(日电) |
| 零件包装代码 | DIP |
| 包装说明 | SDIP, |
| 针数 | 64 |
| Reach Compliance Code | compliant |
| 具有ADC | NO |
| 地址总线宽度 | 16 |
| 位大小 | 8 |
| 最大时钟频率 | 10 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-PDIP-T64 |
| JESD-609代码 | e0 |
| I/O 线路数量 | 53 |
| 端子数量 | 64 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SDIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 |
| 认证状态 | Not Qualified |
| ROM可编程性 | MROM |
| 座面最大高度 | 5.08 mm |
| 速度 | 10 MHz |
| 最大供电电压 | 6 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | MOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.778 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 19.05 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| Base Number Matches | 1 |
| UPD78002BCW(A)-XXX | UPD78002BGC(A)-XXX-AB8 | UPD78001BCW(A)-XXX | UPD78001BCW-XXX | UPD78001BGC(A)-XXX-AB8 | |
|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, MROM, 10MHz, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64 | Microcontroller, 8-Bit, MROM, 10MHz, MOS, PQFP64, 14 X 14 MM, PLASTIC, QFP-64 | Microcontroller, 8-Bit, MROM, 10MHz, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64 | Microcontroller, 8-Bit, MROM, MOS, PDIP64, 0.750 INCH, SHRINK, PLASTIC, DIP-64 | Microcontroller, 8-Bit, MROM, 10MHz, MOS, PQFP64, 14 X 14 MM, PLASTIC, QFP-64 |
| 零件包装代码 | DIP | QFP | DIP | DIP | QFP |
| 包装说明 | SDIP, | QFP, | SDIP, | SDIP, | QFP, |
| 针数 | 64 | 64 | 64 | 64 | 64 |
| Reach Compliance Code | compliant | unknown | compliant | compliant | compliant |
| 具有ADC | NO | NO | NO | NO | NO |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 16 |
| 位大小 | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| DAC 通道 | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-PDIP-T64 | S-PQFP-G64 | R-PDIP-T64 | R-PDIP-T64 | S-PQFP-G64 |
| I/O 线路数量 | 53 | 53 | 53 | 53 | 53 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SDIP | QFP | SDIP | SDIP | QFP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE, SHRINK PITCH | FLATPACK | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
| 座面最大高度 | 5.08 mm | 2.85 mm | 5.08 mm | 5.08 mm | 2.85 mm |
| 最大供电电压 | 6 V | 6 V | 6 V | 5.5 V | 6 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 2.7 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 3 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES |
| 技术 | MOS | MOS | MOS | MOS | MOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.778 mm | 0.8 mm | 1.778 mm | 1.778 mm | 0.8 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD |
| 宽度 | 19.05 mm | 14 mm | 19.05 mm | 19.05 mm | 14 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NEC(日电) | NEC(日电) | - | - | NEC(日电) |
| JESD-609代码 | e0 | - | e0 | e0 | e0 |
| 峰值回流温度（摄氏度） | 235 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 速度 | 10 MHz | 10 MHz | 10 MHz | - | 10 MHz |
| 端子面层 | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD |
| 处于峰值回流温度下的最长时间 | 30 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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