IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28, Analog to Digital Converter
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | SIDE BRAZED, CERAMIC, DIP-28 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 1 V |
| 最小模拟输入电压 | -1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | R-CDIP-T28 |
| JESD-609代码 | e0 |
| 标称负供电电压 | -5 V |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 10 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 5.72 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| AD872JD | AD872SE | AD872JE | AD872SD | |
|---|---|---|---|---|
| 描述 | IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28, Analog to Digital Converter | IC 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, CQCC44, LCC-44, Analog to Digital Converter | IC 1-CH 12-BIT FLASH METHOD ADC, PARALLEL ACCESS, CQCC44, LCC-44, Analog to Digital Converter | IC 1-CH 12-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, SIDE BRAZED, CERAMIC, DIP-28, Analog to Digital Converter |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | LCC | LCC | DIP |
| 包装说明 | SIDE BRAZED, CERAMIC, DIP-28 | LCC-44 | LCC-44 | SIDE BRAZED, CERAMIC, DIP-28 |
| 针数 | 28 | 44 | 44 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | unknown |
| ECCN代码 | EAR99 | 3A001.A.2.C | EAR99 | 3A001.A.2.C |
| 最大模拟输入电压 | 1 V | 1 V | 1 V | 1 V |
| 最小模拟输入电压 | -1 V | -1 V | -1 V | -1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | R-CDIP-T28 | S-CQCC-N44 | S-CQCC-N44 | R-CDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 标称负供电电压 | -5 V | -5 V | -5 V | -5 V |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 12 | 12 | 12 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 44 | 44 | 28 |
| 最高工作温度 | 70 °C | 125 °C | 70 °C | 125 °C |
| 输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY | 2\'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | QCCN | DIP |
| 封装等效代码 | DIP28,.6 | LCC44,.65SQ | LCC44,.65SQ | DIP28,.6 |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 220 | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | +-5 V | +-5 V | +-5 V | +-5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 5.72 mm | 2.54 mm | 2.54 mm | 5.72 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 16.545 mm | 16.545 mm | 15.24 mm |
| 厂商名称 | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
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