IC,MICROCONTROLLER,8-BIT,UPD78K0 CPU,CMOS,SDIP,64PIN,PLASTIC
| 参数名称 | 属性值 |
| Reach Compliance Code | compliant |
| 位大小 | 8 |
| CPU系列 | UPD78K0 |
| JESD-30 代码 | R-PDIP-T64 |
| 端子数量 | 64 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SDIP |
| 封装等效代码 | SDIP64,.75 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH |
| 电源 | 2/5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 512 |
| ROM(单词) | 16384 |
| ROM可编程性 | MROM |
| 筛选级别 | AEC-Q100 |
| 速度 | 8.38 MHz |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.78 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| UPD780022CW(A)-XXX | UPD780022GC(A)-XXX-AB8 | UPD780023GC(A)-XXX-AB8 | UPD780024GC(A)-XXX-AB8 | UPD780024GK(A)-XXX8A8 | |
|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,8-BIT,UPD78K0 CPU,CMOS,SDIP,64PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,UPD78K0 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,UPD78K0 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,UPD78K0 CPU,CMOS,QFP,64PIN,PLASTIC | IC,MICROCONTROLLER,8-BIT,UPD78K0 CPU,CMOS,QFP,64PIN,PLASTIC |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 位大小 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | UPD78K0 | UPD78K0 | UPD78K0 | UPD78K0 | UPD78K0 |
| JESD-30 代码 | R-PDIP-T64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SDIP | QFP | QFP | QFP | QFP |
| 封装等效代码 | SDIP64,.75 | QFP64,.7SQ,32 | QFP64,.7SQ,32 | QFP64,.7SQ,32 | QFP64,.6SQ |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE, SHRINK PITCH | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 电源 | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 512 | 512 | 1024 | 1024 | 1024 |
| ROM(单词) | 16384 | 16384 | 24576 | 32768 | 32768 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM |
| 筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| 速度 | 8.38 MHz | 8.38 MHz | 8.38 MHz | 8.38 MHz | 8.38 MHz |
| 表面贴装 | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.78 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.635 mm |
| 端子位置 | DUAL | QUAD | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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