Passive Delay Line, 1-Func, 5-Tap, True Output, Hybrid,
| 参数名称 | 属性值 |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 其他特性 | MAX RISE TIME CAPTURED |
| JESD-30 代码 | R-XDIP-T8 |
| 逻辑集成电路类型 | PASSIVE DELAY LINE |
| 功能数量 | 1 |
| 抽头/阶步数 | 5 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出阻抗标称值（Z0） | 75 Ω |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 可编程延迟线 | NO |
| 认证状态 | Not Qualified |
| 座面最大高度 | 6.99 mm |
| 表面贴装 | NO |
| 技术 | HYBRID |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 总延迟标称（td） | 10 ns |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| TZA2-7 | TZA10-20 | TZA11-10 | TZA10-10 | TZA13-5 | TZA13-7 | |
|---|---|---|---|---|---|---|
| 描述 | Passive Delay Line, 1-Func, 5-Tap, True Output, Hybrid, | Passive Delay Line, 1-Func, 5-Tap, True Output, Hybrid, | Passive Delay Line, 1-Func, 5-Tap, True Output, Hybrid, | Passive Delay Line, 1-Func, 5-Tap, True Output, Hybrid, | Passive Delay Line, 1-Func, 5-Tap, True Output, Hybrid, | Passive Delay Line, 1-Func, 5-Tap, True Output, Hybrid, |
| 包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | MAX RISE TIME CAPTURED | MAX RISE TIME CAPTURED | MAX RISE TIME CAPTURED | MAX RISE TIME CAPTURED | MAX RISE TIME CAPTURED | MAX RISE TIME CAPTURED |
| JESD-30 代码 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 | R-XDIP-T8 |
| 逻辑集成电路类型 | PASSIVE DELAY LINE | PASSIVE DELAY LINE | PASSIVE DELAY LINE | PASSIVE DELAY LINE | PASSIVE DELAY LINE | PASSIVE DELAY LINE |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 抽头/阶步数 | 5 | 5 | 5 | 5 | 5 | 5 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出阻抗标称值（Z0） | 75 Ω | 200 Ω | 100 Ω | 100 Ω | 50 Ω | 75 Ω |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 可编程延迟线 | NO | NO | NO | NO | NO | NO |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 6.99 mm | 6.99 mm | 6.99 mm | 6.99 mm | 6.99 mm | 6.99 mm |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 总延迟标称（td） | 10 ns | 50 ns | 75 ns | 50 ns | 125 ns | 125 ns |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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嵌入式系统
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