Standard SRAM, 256KX4, 17ns, CMOS, PDSO32
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | TSOP, TSOP32,.46 |
Reach Compliance Code | unknown |
最长访问时间 | 17 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G32 |
JESD-609代码 | e0 |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 4 |
湿度敏感等级 | 3 |
端子数量 | 32 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 256KX4 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP |
封装等效代码 | TSOP32,.46 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
认证状态 | Not Qualified |
最大待机电流 | 0.008 A |
最小待机电流 | 4.5 V |
最大压摆率 | 0.145 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
Base Number Matches | 1 |
KM641003ATI-17 | KM641003AJI-15 | KM641003ATI-15 | KM641003ATI-20 | KM641003AJI-12 | KM641003AJI-20 | KM641003ATI-12 | KM641003AJI-17 | |
---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 256KX4, 17ns, CMOS, PDSO32 | Standard SRAM, 256KX4, 15ns, CMOS, PDSO32 | Standard SRAM, 256KX4, 15ns, CMOS, PDSO32 | Standard SRAM, 256KX4, 20ns, CMOS, PDSO32 | Standard SRAM, 256KX4, 12ns, CMOS, PDSO32 | Standard SRAM, 256KX4, 20ns, CMOS, PDSO32 | Standard SRAM, 256KX4, 12ns, CMOS, PDSO32 | Standard SRAM, 256KX4, 17ns, CMOS, PDSO32 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | TSOP, TSOP32,.46 | SOJ, SOJ32,.44 | TSOP, TSOP32,.46 | TSOP, TSOP32,.46 | SOJ, SOJ32,.44 | SOJ, SOJ32,.44 | TSOP, TSOP32,.46 | SOJ, SOJ32,.44 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 17 ns | 15 ns | 15 ns | 20 ns | 12 ns | 20 ns | 12 ns | 17 ns |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-G32 | R-PDSO-J32 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP | SOJ | TSOP | TSOP | SOJ | SOJ | TSOP | SOJ |
封装等效代码 | TSOP32,.46 | SOJ32,.44 | TSOP32,.46 | TSOP32,.46 | SOJ32,.44 | SOJ32,.44 | TSOP32,.46 | SOJ32,.44 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大待机电流 | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
最大压摆率 | 0.145 mA | 0.145 mA | 0.145 mA | 0.14 mA | 0.15 mA | 0.14 mA | 0.15 mA | 0.145 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | J BEND | GULL WING | GULL WING | J BEND | J BEND | GULL WING | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
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