TS68C000DESC03YAA概述

Microprocessor, 32-Bit, 12.5MHz, HCMOS, CDIP64, TIN DIPPED, SIDE BRAZED, CERAMIC, DIP-64

TS68C000DESC03YAA规格参数

参数名称	属性值
零件包装代码	DIP
包装说明	DIP,
针数	64
Reach Compliance Code	unknown
ECCN代码	3A001.A.2.C
地址总线宽度	24
位大小	32
边界扫描	NO
最大时钟频率	12.5 MHz
外部数据总线宽度	16
格式	FIXED POINT
集成缓存	NO
JESD-30 代码	R-CDIP-T64
长度	81.28 mm
低功率模式	NO
端子数量	64
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
认证状态	Not Qualified
座面最大高度	4.83 mm
速度	12.5 MHz
最大供电电压	5.5 V
最小供电电压	4.5 V
标称供电电压	5 V
表面贴装	NO
技术	HCMOS
温度等级	MILITARY
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
宽度	22.86 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR
Base Number Matches	1

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TS68C000

LOW POWER HCMOS 16/32 BIT MICROPROCESSOR

April 1999

1/38

TS68C000DESC03YAA相似产品对比

	TS68C000DESC03YAA	TS68C000ME8A	TS68C000DESC02YAA	TS68C000MR8A	TS68C000DESC01YAA	TS68C000DESC01UAA	TS68C000DESC03UAA	TS68C000DESC02UAA	TS68C000MC8A	TS68C000VE8A
描述	Microprocessor, 32-Bit, 12.5MHz, HCMOS, CDIP64, TIN DIPPED, SIDE BRAZED, CERAMIC, DIP-64	Microprocessor, 32-Bit, 8MHz, HCMOS, CQCC68, CERAMIC, LCC-68	Microprocessor, 32-Bit, 10MHz, HCMOS, CDIP64, TIN DIPPED, SIDE BRAZED, CERAMIC, DIP-64	Microprocessor, 32-Bit, 8MHz, HCMOS, CPGA68, PGA-68	Microprocessor, 32-Bit, 8MHz, HCMOS, CDIP64, TIN DIPPED, SIDE BRAZED, CERAMIC, DIP-64	Microprocessor, 32-Bit, 8MHz, HCMOS, CPGA68, TIN DIPPED, PGA-68	Microprocessor, 32-Bit, 12.5MHz, HCMOS, CPGA68, TIN DIPPED, PGA-68	Microprocessor, 32-Bit, 10MHz, HCMOS, CPGA68, TIN DIPPED, PGA-68	Microprocessor, 32-Bit, 8MHz, HCMOS, CDIP64, SIDE BRAZED, CERAMIC, DIP-64	Microprocessor, 32-Bit, 8MHz, HCMOS, CQCC68, CERAMIC, LCC-68
零件包装代码	DIP	LCC	DIP	PGA	DIP	PGA	PGA	PGA	DIP	LCC
包装说明	DIP,	QCCN, LCC68,.95SQ	DIP,	PGA, PGA68,10X10	DIP,	PGA,	PGA,	PGA,	DIP, DIP64,.9	QCCN, LCC68,.95SQ
针数	64	68	64	68	64	68	68	68	64	68
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
地址总线宽度	24	24	24	24	24	24	24	24	24	24
位大小	32	32	32	32	32	32	32	32	32	32
边界扫描	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
最大时钟频率	12.5 MHz	8 MHz	10 MHz	8 MHz	8 MHz	8 MHz	12.5 MHz	10 MHz	8 MHz	8 MHz
外部数据总线宽度	16	16	16	16	16	16	16	16	16	16
格式	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
集成缓存	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 代码	R-CDIP-T64	S-CQCC-N68	R-CDIP-T64	S-CPGA-P68	R-CDIP-T64	S-CPGA-P68	S-CPGA-P68	S-CPGA-P68	R-CDIP-T64	S-CQCC-N68
长度	81.28 mm	24.13 mm	81.28 mm	26.92 mm	81.28 mm	26.92 mm	26.92 mm	26.92 mm	81.28 mm	24.13 mm
低功率模式	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
端子数量	64	68	64	68	64	68	68	68	64	68
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	85 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-40 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	DIP	QCCN	DIP	PGA	DIP	PGA	PGA	PGA	DIP	QCCN
封装形状	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	SQUARE
封装形式	IN-LINE	CHIP CARRIER	IN-LINE	GRID ARRAY	IN-LINE	GRID ARRAY	GRID ARRAY	GRID ARRAY	IN-LINE	CHIP CARRIER
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
速度	12.5 MHz	8 MHz	10 MHz	8 MHz	8 MHz	8 MHz	12.5 MHz	10 MHz	8 MHz	8 MHz
最大供电电压	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	NO	NO	NO	NO	NO	NO	NO	YES
技术	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS	HCMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	INDUSTRIAL
端子形式	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	PIN/PEG	THROUGH-HOLE	PIN/PEG	PIN/PEG	PIN/PEG	THROUGH-HOLE	NO LEAD
端子节距	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm
端子位置	DUAL	QUAD	DUAL	PERPENDICULAR	DUAL	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	DUAL	QUAD
宽度	22.86 mm	24.13 mm	22.86 mm	26.92 mm	22.86 mm	26.92 mm	26.92 mm	26.92 mm	22.86 mm	24.13 mm
uPs/uCs/外围集成电路类型	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
ECCN代码	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	-
座面最大高度	4.83 mm	-	4.83 mm	4.184 mm	4.83 mm	4.184 mm	4.184 mm	4.184 mm	4.83 mm	-
Base Number Matches	1	1	1	1	1	1	-	-	-	-
厂商名称	-	-	-	Atmel (Microchip)	Atmel (Microchip)	-	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)

TS68C000DESC03YAA

TS68C000DESC03YAA概述

TS68C000DESC03YAA规格参数

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TS68C000DESC03YAA相似产品对比

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