HC/UH SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-20
参数名称 | 属性值 |
是否无铅 | 含铅 |
零件包装代码 | TSSOP |
包装说明 | HALOGEN FREE AND ROHS COMPLIANT, TSSOP-20 |
针数 | 20 |
Reach Compliance Code | unknown |
系列 | HC/UH |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e4 |
长度 | 6.5 mm |
逻辑集成电路类型 | BUS DRIVER |
湿度敏感等级 | NOT SPECIFIED |
位数 | 4 |
功能数量 | 2 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 135 ns |
认证状态 | COMMERCIAL |
座面最大高度 | 1.2 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 40 |
宽度 | 4.4 mm |
Base Number Matches | 1 |
MC74HC244ADTG | MC74HC244ADTR2G | MC74HC244ADWG | MC74HC244ANG | MC74HC244ADWR2G | |
---|---|---|---|---|---|
描述 | HC/UH SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-20 | HC/UH SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, HALOGEN FREE AND ROHS COMPLIANT, TSSOP-20 | HC/UH SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, HALOGEN FREE AND ROHS COMPLIANT, SOIC-20 | HC/UH SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDIP20, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-20 | HC/UH SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, HALOGEN FREE AND ROHS COMPLIANT, SOIC-20 |
是否无铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 |
零件包装代码 | TSSOP | TSSOP | SOIC | DIP | SOIC |
包装说明 | HALOGEN FREE AND ROHS COMPLIANT, TSSOP-20 | HALOGEN FREE AND ROHS COMPLIANT, TSSOP-20 | HALOGEN FREE AND ROHS COMPLIANT, SOIC-20 | HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-20 | HALOGEN FREE AND ROHS COMPLIANT, SOIC-20 |
针数 | 20 | 20 | 20 | 20 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 |
JESD-609代码 | e4 | e4 | e3 | e3 | e3 |
长度 | 6.5 mm | 6.5 mm | 12.8 mm | 26.415 mm | 12.8 mm |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
湿度敏感等级 | NOT SPECIFIED | NOT SPECIFIED | 3 | NOT SPECIFIED | 3 |
位数 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端口数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | SOP | DIP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | NOT SPECIFIED | 260 |
传播延迟(tpd) | 135 ns | 135 ns | 135 ns | 135 ns | 135 ns |
认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
座面最大高度 | 1.2 mm | 1.2 mm | 2.65 mm | 4.57 mm | 2.65 mm |
最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | MATTE TIN | MATTE TIN | MATTE TIN |
端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 40 | 40 | 40 | NOT SPECIFIED | 40 |
宽度 | 4.4 mm | 4.4 mm | 7.5 mm | 7.62 mm | 7.5 mm |
Base Number Matches | 1 | 1 | 1 | 1 | - |
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