DDR DRAM Module, 32MX64, 0.45ns, CMOS, GREEN, DIMM-240
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
零件包装代码 | DIMM |
包装说明 | DIMM, DIMM240,40 |
针数 | 240 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | SINGLE BANK PAGE BURST |
最长访问时间 | 0.45 ns |
其他特性 | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 333 MHz |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDMA-N240 |
内存密度 | 2147483648 bit |
内存集成电路类型 | DDR DRAM MODULE |
内存宽度 | 64 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 240 |
字数 | 33554432 words |
字数代码 | 32000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 65 °C |
最低工作温度 | |
组织 | 32MX64 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装等效代码 | DIMM240,40 |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 1.8 V |
认证状态 | Not Qualified |
刷新周期 | 8192 |
自我刷新 | YES |
最大压摆率 | 0.91 mA |
最大供电电压 (Vsup) | 1.9 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | NO LEAD |
端子节距 | 1 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
Base Number Matches | 1 |
HYS64T32000HU-3S-A | HYS64T32900HU-3S-A | HYS64T64000HU-3.7-A | HYS72T64000HU-3.7-A | HYS64T128020HU-3.7-A | HYS64T32000HU-5-A | HYS72T64000HU-5-A | |
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描述 | DDR DRAM Module, 32MX64, 0.45ns, CMOS, GREEN, DIMM-240 | DDR DRAM Module, 32MX64, 0.45ns, CMOS, GREEN, DIMM-240 | DDR DRAM Module, 64MX64, 0.5ns, CMOS, GREEN, DIMM-240 | DDR DRAM Module, 64MX72, 0.5ns, CMOS, GREEN, DIMM-240 | DDR DRAM Module, 128MX64, 0.5ns, CMOS, GREEN, DIMM-240 | DDR DRAM Module, 32MX64, 0.6ns, CMOS, GREEN, DIMM-240 | DDR DRAM Module, 64MX72, 0.6ns, CMOS, GREEN, DIMM-240 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
包装说明 | DIMM, DIMM240,40 | DIMM, DIMM240,40 | DIMM, DIMM240,40 | DIMM, DIMM240,40 | DIMM, DIMM240,40 | DIMM, DIMM240,40 | DIMM, DIMM240,40 |
针数 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
最长访问时间 | 0.45 ns | 0.45 ns | 0.5 ns | 0.5 ns | 0.5 ns | 0.6 ns | 0.6 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
最大时钟频率 (fCLK) | 333 MHz | 333 MHz | 267 MHz | 267 MHz | 266 MHz | 200 MHz | 200 MHz |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 |
内存密度 | 2147483648 bit | 2147483648 bit | 4294967296 bit | 4831838208 bit | 8589934592 bit | 2147483648 bit | 4831838208 bit |
内存集成电路类型 | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
内存宽度 | 64 | 64 | 64 | 72 | 64 | 64 | 72 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
字数 | 33554432 words | 33554432 words | 67108864 words | 67108864 words | 134217728 words | 33554432 words | 67108864 words |
字数代码 | 32000000 | 32000000 | 64000000 | 64000000 | 128000000 | 32000000 | 64000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 65 °C | 65 °C | 65 °C | 65 °C | 65 °C | 65 °C | 65 °C |
组织 | 32MX64 | 32MX64 | 64MX64 | 64MX72 | 128MX64 | 32MX64 | 64MX72 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装等效代码 | DIMM240,40 | DIMM240,40 | DIMM240,40 | DIMM240,40 | DIMM240,40 | DIMM240,40 | DIMM240,40 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 | 8192 |
自我刷新 | YES | YES | YES | YES | YES | YES | YES |
最大压摆率 | 0.91 mA | 0.91 mA | 1.12 mA | 1.26 mA | 1.16 mA | 0.84 mA | 1.17 mA |
最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
最大待机电流 | - | - | 0.032 A | 0.036 A | 0.06 A | - | 0.036 A |
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