*R
*RoHS
oH C
S OM
CO P
M LIA
PL N
IA T
NT
Features
■
0805 size
■
Available in E12 series
■
High Q up to 80 typ.
■
High operating temperature of 125 °C
■
Small size of only 2.0 mm
■
Lead Free
Applications
■
Mobil phones
■
Cellular phones
■
CTV, VCR, HIC, FDD
CW201212 Series - High Q Chip Inductors
Electrical Specifications
Bourns Part No.
nH
Inductance
Tol. %
Q
min.
Test Freq. MHz
L
Q
SRF min.
MHz
RDC
ohms
I rms
mA max.
CW201212-2N2J
CW201212-2N7J
CW201212-2N8J
CW201212-3N3J
CW201212-3N9J
CW201212-4N7J
CW201212-5N6J
CW201212-6N8J
CW201212-8N2J
CW201212-10NJ
CW201212-12NJ
CW201212-15NJ
CW201212-18NJ
CW201212-22NJ
CW201212-27NJ
CW201212-33NJ
CW201212-39NJ
CW201212-47NJ
CW201212-56NJ
CW201212-68NJ
CW201212-82NJ
CW201212-R10J
CW201212-R12J
CW201212-R15J
CW201212-R18J
CW201212-R22J
CW201212-R27J
CW201212-R33J
CW201212-R39J
CW201212-R47J
CW201212-R56J
CW201212-R68J
CW201212-R82J
CW201212-R91J
2.2
2.7
2.8
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
910
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
50
35
32
30
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
60
50
50
50
50
45
45
45
33
23
23
23
22
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
250
200
200
200
150
150
150
100
100
100
100
100
100
250
50
25
25
22
1000
1000
1000
1500
1000
1000
1000
1000
1000
500
500
500
500
500
500
500
500
500
500
500
500
500
250
250
250
250
250
250
250
100
50
50
50
50
6000
6000
6000
6000
6000
5800
5800
5800
5500
4800
4100
3600
3400
3300
2600
2400
2100
1700
1600
1450
1350
1200
1100
950
900
860
850
800
780
375
340
270
230
220
0.06
0.08
0.06
0.08
0.06
0.06
0.08
0.06
0.06
0.08
0.08
0.08
0.08
0.10
0.12
0.15
0.18
0.15
0.25
0.27
0.32
0.43
0.48
0.67
0.85
1.10
1.46
1.65
2.20
1.72
1.90
2.05
2.30
2.50
600
600
800
600
600
600
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
400
400
400
350
300
250
200
170
250
230
190
180
150
General Specifications
Temperature Rise
...................40 ˚C max. at rated current
Operating Temperature
..................................-40 °C to +125 °C
Storage Temperature..-40 °C to +125 °C
Reflow Soldering ...230 °C, 50 sec. max.
Resistance to Soldering Heat
.................................260 ˚C, 5 seconds
Materials
Core Material ........Alumina (1CC201211)
Wire ........Enamelled Copper (1W1E180)
Terminal............................Mo/Mn+Ni+Au
Packaging..................2,000 pcs. per reel
Product Dimensions
0.5
(.020)
1.3
±
0.2
(.051
±
.008)
2.1
±
0.2
(.083
±
.008)
1.5
±
0.2
(.059
±
.008)
0.5
(.020)
0.5
(.020)
Recommended Layout
REF.
1.02
(.040)
1.02
REF.
(.040)
Packaging Specifications
178.0
(7.00)
DIA.
2.0
±
0.5
(.079
±
.020)
12.5
(.492)
REF.
THICKNESS
0.10
(.004)
MAX.
EMBOSSED
CAVITY
50.0
(1.969)
0.76
(.030)
1.78
REF.
(.070)
21.0
±
0.8
(.827
±
.031)
13.0
±
0.5
(.512
±
.020)
DIA.
DIMENSIONS:
MM
(INCHES)
13.0
±
0.5
DIA.
(.512
±
.020)
EMBOSSED
CARRIER
10.0
(.393)
8.0
(.315)
REV. 10/08
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
NOTE: 2 % TOLERANCE AVAILABLE FOR INDUCTANCE
RANGES OF 12 NH AND UP. REPLACE “J” WITH “G”.
FPGA/CPLD
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