IDT49FCT806BT/CT
FAST CMOS BUFFER/CLOCK DRIVER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
FAST CMOS
BUFFER CLOCK/DRIVER
IDT49FCT806BT/CT
FEATURES:
−
−
−
−
−
−
−
−
−
−
−
−
0.5 MICRON CMOS Technology
Guaranteed low skew < 500ps (max.)
Very low duty cycle distortion < 600ps (max.)
Low CMOS power levels
TTL compatible inputs and outputs
TTL level output voltage swings
High drive: -32mA I
OH
, +48mA I
OL
Two independent output banks with 3-state control
1:5 fanout per bank
“Heartbeat” monitor output
ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
Available in the following packages:
•
Commercial: SOIC, SSOP, QSOP
•
Military: CERDIP, LCC, CERPACK
DESCRIPTION:
This buffer/clock driver is built using advanced dual metal CMOS
technology. The FCT806T is an inverting clock driver consisting of two
banks of drivers. Each bank drives five TTL output buffers from a standard
TTL compatible input. This part has extremely low output skew, pulse skew,
and package skew. The device has a “heart-beat” monitor for diagnostics
and PLL driving. The monitor output is identical to all other outputs and
complies with the output specifications in this document.
The FCT806T is designed for fast, clean edge rates to provide accurate
clock distribution in high speed systems.
FUNCTIONAL BLOCK DIAGRAM
OE
A
IN
A
5
OA
1
-OA
5
IN
B
5
OB
1
-OB
5
OE
B
MON
MILITARY AND COMMERCIAL TEMPERATURE RANGES
1
c
1999
Integrated Device Technology, Inc.
JULY 2000
DSC-4772
IDT49FCT806BT/CT
FAST CMOS BUFFER/CLOCK DRIVER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATION
V
CC
OA
2
OA
1
V
CC
OB
1
INDEX
V
CC
OA
1
OA
2
OA
3
GND
OA
4
OA
5
GND
(1)
1
2
3
4
5
6
7
8
9
10
SO20-2
SO20-7
SO20-8
E20-1
D20-1
20
19
18
17
16
15
14
13
12
11
V
CC
OB
1
3
2
1
20
19
18
17
OB
2
OB
3
GND
OB
4
OB
5
OB
2
OB
3
GND
OA
3
GND
OA
4
4
5
6
7
8
9
L20-2
16
15
14
OB
4
OA
5
OB
5
MON
OE
B
GND
(1)
10 11 12
13
OE
A
IN
A
IN
A
OE
A
OE
B
SOIC/ SSOP/ QSOP/ CERPACK/ CERDIP
TOP VIEW
NOTE:
1. Pin 8 is internally connected to GND. To insure compatibility with all
products, pin 8 should be connected to GND at board level.
LCC
TOP VIEW
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol
V
TERM
T
STG
I
OUT
Rating
Terminal Voltage with Respect to GND
Storage Temperature
DC Output Current
Max.
–0.5 to +7
–65 to +150
–65 to +120
Unit
V
°C
mA
PIN DESCRIPTION
Pin Names
OE
A
,
OE
B
IN
A
, IN
B
OAx, OBx
MON
Description
3-State Output Enable Inputs (Active LOW)
Clock Inputs
Clock Outputs
Monitor Output
NOTE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or
any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability. No
terminal voltage may exceed Vcc by +0.5V unless otherwise noted.
FUNCTION TABLE
(1)
Inputs
OE
A
, OE
B
L
L
H
H
IN
A
, IN
B
L
H
L
H
OAx, OBx
H
L
Z
Z
Outputs
MON
H
L
H
L
CAPACITANCE
(T
A
=
Symbol
C
IN
C
OUT
Parameter
(1)
Input Capacitance
Output Capacitance
+25
O
C,
f = 1.0MHz)
Typ.
4.5
5.5
Max.
6
8
Unit
pF
pF
Conditions
V
IN
= 0V
V
OUT
= 0V
NOTE:
1. H = HIGH Voltage Level
L = LOW Voltage Level
Z = High-Impedance
NOTE:
1. This parameter is measured at characterization but not tested.
2
MON
IN
B
IN
B
IDT49FCT806BT/CT
FAST CMOS BUFFER/CLOCK DRIVER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Commercial: T
A
= 0°C to +70°C, V
CC
= 5.0V ± 5%; Military: T
A
= -55°C to +125°C, V
CC
= 5.0V ± 10%:
Symbol
V
IH
V
IL
I
I H
I
I L
I
OZH
I
OZL
I
I
V
IK
I
OS
V
OH
Parameter
Input HIGH Level
Input LOW Level
Input HIGH Current
(5)
Input LOW Current
(5)
High Impedance Output Current
(3-State Output Pins)
Input HIGH Current
Clamp Diode Voltage
Short Circuit Current
Output HIGH Voltage
V
CC
= Max., V
I
= V
CC
(Max.)
V
CC
= Min., I
IN
= –18mA
V
CC
= Max.
(3)
, V
O
= GND
V
CC
= Min.
V
IN
= V
IH
or V
IL
I
OH
= –12mA MIL
I
OH
= –15mA COM’L
I
OH
= –24mA MIL
I
OH
= –32mA COM’L
(4)
I
OL
= 32mA MIL
I
OH
= 48mA COM’L
—
Test Conditions
(1)
Guaranteed Logic HIGH Level
Guaranteed Logic LOW Level
V
CC
= Max.
V
CC
= Max.
V
CC
= Max.
V
I
= 2.7V
V
I
= 0.5V
V
O
= 2.7V
V
O
= 0.5V
Min.
2
—
—
—
—
—
—
—
–60
2.4
2
—
—
—
—
Typ.
(2)
—
—
—
—
—
—
—
–0.7
–120
3.3
3
0.3
—
150
5
Max.
—
0.8
±1
±1
±1
±1
±1
–1.2
–225
—
—
0.55
±1
—
500
Unit
V
V
µA
µA
µA
µA
V
mA
V
V
V
µA
mV
µA
V
OL
I
OFF
V
H
I
CCL
I
CCH
I
CCZ
Output LOW Voltage
Input/Output Power Off Leakage
(5)
Input Hysteresis for all inputs
Quiescent Power Supply Current
V
CC
= Min.
V
IN
= V
IH
or V
IL
V
CC
= 0V, V
IN
or V
O
≤
4.5V
V
CC
= Max., V
IN
=
GND or
V
CC
NOTES:
1. For conditions shown as max. or min., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC
= 5.0V, +25°C ambient.
3. Not more than one output should be shorted at one time. Duration of the short circuit test should not exceed one second.
4. Duration of the condition should not exceed one second.
5. The test limit for thie parameter is ±5µA at T
A
= -55°C.
3
IDT49FCT806BT/CT
FAST CMOS BUFFER/CLOCK DRIVER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
POWER SUPPLY CHARACTERISTICS
Symbol
∆I
CC
I
CCD
Parameter
Quiescent Power Supply Current
TTL Inputs HIGH
Dynamic Power Supply Current
(4)
Test Conditions
(1)
V
CC
= Max.
V
IN
= 3.4V
(3)
V
CC
= Max.
Outputs Open
OE
A
=
OE
B
= GND
50% Duty Cycle
V
CC
= Max.
Outputs Open
fo = 25MHz
50% Duty Cycle
OE
A
=
OE
B
=V
CC
Mon. Output Toggling
V
CC
= Max.
Outputs Open
fo = 50MHz
50% Duty Cycle
OE
A
=
OE
B
= GND
Eleven Outputs Toggling
V
IN
= V
CC
V
IN
= GND
Min.
—
—
Typ.
(2)
0.5
60
Max.
2
100
Unit
mA
µA/
MHz/bit
I
C
Total Power Supply Current
(6)
V
IN
= V
CC
V
IN
= GND
V
IN
= 3.4V
V
IN
= GND
V
IN
= V
CC
V
IN
= GND
V
IN
= 3.4V
V
IN
= GND
—
1.5
3
mA
—
1.8
4
—
33
55.5
(5)
—
33.5
57.5
(5)
NOTES:
1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC
= 5.0V, +25°C ambient.
3. Per TTL driven input (V
IN
= 3.4V). All other inputs at V
CC
or GND.
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.
5. Values for these conditions are examples of the I
CC
formula. These limits are guaranteed but not tested.
6. I
C
= I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
I
C
= I
CC
+
∆I
CC
D
H
N
T
+ I
CCD
(f
O
N
O
)
I
CC
= Quiescent Current (I
CCL
, I
CCH
, and I
CCZ
)
∆I
CC
= Power Supply Current for a TTL High Input (V
IN
= 3.4V)
D
H
= Duty Cycle for TTL Inputs High
N
T
= Number of TTL Inputs at D
H
I
CCD
= Dynamic Current Caused by an Input Transition Pair (HLH or LHL)
f
O
= Output Frequency
N
O
= Number of Outputs at f
O
All currents are in milliamps and all frequencies are in megahertz.
4
IDT49FCT806BT/CT
FAST CMOS BUFFER/CLOCK DRIVER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
SWITCHING CHARACTERISTICS OVER OPERATING RANGE
(MILITARY)
(1, 2)
FCT806BT
Symbol
t
PLH
Propagation Delay
t
PHL
IN
A
to
OAx,
IN
B
to
OBx
t
R
Output Rise Time
t
F
t
SK
(o)
t
SK
(p)
t
SK
(pp)
t
PZL
t
PZH
t
PLZ
t
PHZ
Output Fall Time
Output skew: skew between outputs of all banks of same package (inputs
tied together)
Pulse skew: skew between opposite transitions of same output (|t
PHL
–t
PLH
|)
Part-to-part skew: skew between outputs of different packages at same
power supply voltage, temperature, package type and speed grade
Output Enable Time
OE
A
to
OAx, OE
B
to
OBx
Output Disable Time
OE
A
to
OAx, OE
B
to
OBx
Parameter
Condition
(3)
C
L
= 50pF
R
L
= 500Ω
Min
.(4)
1.5
—
—
—
—
—
1.5
1.5
Max
.
5.7
2
1.5
0.9
0.9
1.5
6.5
6.5
FCT806CT
Min
.(4)
1.5
—
—
—
—
—
1.5
1.5
Max
.
5.2
2
1.5
0.7
0.8
1.2
6
6
Unit
ns
ns
ns
ns
ns
ns
ns
ns
NOTES:
1. t
PLH
, t
PHL
, and t
SK
(pp) are production tested. All other parameters are guaranteed but not production tested.
2. Propagation delay range indicated by Min. and Max. limit is dues to Vcc, operating temperature, and process parameters. These propagation
delay limits do not imply skew.
3. See Test Circuits and Waveforms.
4. Minimum limits are guaranteed but not tested on Propagation Delays.
SWITCHING CHARACTERISTICS OVER OPERATING RANGE
(COMMERCIAL)
(1, 2)
FCT806BT
Symbol
t
PLH
Propagation Delay
t
PHL
IN
A
to
OAx,
IN
B
to
OBx
t
R
Output Rise Time
t
F
t
SK
(o)
t
SK
(p)
t
SK
(pp)
t
PZL
t
PZH
t
PLZ
t
PHZ
Output Fall Time
Output skew: skew between outputs of all banks of same package (inputs
tied together)
Pulse skew: skew between opposite transitions of same output (|t
PHL
–t
PLH
|)
Part-to-part skew: skew between outputs of different packages at same
power supply voltage, temperature, package type and speed grade
Output Enable Time
OE
A
to
OAx, OE
B
to
OBx
Output Disable Time
OE
A
to
OAx, OE
B
to
OBx
Parameter
Condition
(3)
C
L
= 50pF
R
L
= 500Ω
Min
.(4)
1.5
—
—
—
—
—
1.5
1.5
Max
.
5
1.5
1.5
0.7
0.7
1.2
6
6
FCT806CT
Min
.(4)
1.5
—
—
—
—
—
1.5
1.5
Max
.
4.5
1.5
1.5
0.5
0.6
1
5
5
Unit
ns
ns
ns
ns
ns
ns
ns
ns
NOTES:
1. t
PLH
, t
PHL
, and t
SK
(pp) are production tested. All other parameters are guaranteed but not production tested.
2. Propagation delay range indicated by Min. and Max. limit is dues to Vcc, operating temperature, and process parameters. These propagation
delay limits do not imply skew.
3. See Test Circuits and Waveforms.
4. Minimum limits are guaranteed but not tested on Propagation Delays.
5
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