To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
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Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
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contained therein.
Hitachi Single-Chip Microcomputer
H8S/2276 Series
H8S/2277F-ZTAT™
HD64F2277
Hardware Manual
ADE-602-224
Rev. 1.0
12/26/01
Hitachi Ltd.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
This LSI is a single-chip microcomputer made up of the H8S/2000 CPU with an internal 32-bit
architecture as its core, and the peripheral functions required to configure a system.
This LSI is equipped with ROM, RAM, a bus controller, data transfer controller (DTC), three
types of timers, a serial communication interface (SCI), an A/D converter, FLEX™*
1
decoder II,
and I/O ports as on-chip supporting modules. This LSI is suitable for use as an embedded
processor for high-level control systems. Its on-chip ROM is flash memory (F-ZTAT™*
2
) that
provides flexibility as it can be reprogrammed in no time to cope with all situations from the early
stages of mass production to full-scale mass production. This is particularly applicable to
application devices with specifications that will most probably change.
Note: *1 FLEX™ is a trademark of Motorola.
*2 F-ZTAT™ is a trademark of Hitachi, Ltd.
Target Users: This manual was written for users who will be using the H8S/2276 Series in the
design of application systems. Members of this audience are expected to understand
the fundamentals of electrical circuits, logical circuits, and microcomputers.
Objective:
This manual was written to explain the hardware functions and electrical
characteristics of the H8S/2276 Series to the above audience. Refer to the
H8S/2600 Series, H8S/2000 Series Programming Manual for a detailed description
of the instruction set.
Notes on reading this manual:
•
In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions and electrical characteristics.
•
In order to understand the details of the CPU's functions
Read the H8S/2600 Series, H8S/2000 Series Programming Manual.
•
In order to understand the details of a register when its name is known
The addresses, bits, and initial values of the registers are summarized in Appendix B, Internal
I/O Registers.
Example:
Bit order:
The MSB is on the left and the LSB is on the right.
Related Manuals:
The latest versions of all related manuals are available from our web site.
Please ensure you have the latest versions of all documents you require.
http://www.hitachisemiconductor.com/
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