TSG8670IC概述

IC,FILTER,BAND PASS/LOW PASS,CMOS,DIP,18PIN,CERAMIC

TSG8670IC规格参数

参数名称	属性值
是否Rohs认证	不符合
零件包装代码	DIP
针数	18
Reach Compliance Code	not_compliant
有源滤波器类型	SWITCHED CAPACITOR FILTER
JESD-30 代码	R-XDIP-T18
JESD-609代码	e0
标称负供电电压 (Vsup)	-5 V
功能数量	2
端子数量	18
最高工作温度	85 °C
最低工作温度	-25 °C
阶次	8TH
封装主体材料	CERAMIC
封装代码	DIP
封装等效代码	DIP18,.3
封装形状	RECTANGULAR
封装形式	IN-LINE
电源	+-5 V
认证状态	Not Qualified
响应	LOWPASS/BANDPASS
最大供电电流 (Isup)	5 mA
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	OTHER
端子面层	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
传递特性	ELLIPTIC
Base Number Matches	1

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TSG8670IC相似产品对比

	TSG8670IC	TSG8670CC	TSG8670CP	TSG8670IP	TSG8670MC	TSG8670VC	TSG8670VP
描述	IC,FILTER,BAND PASS/LOW PASS,CMOS,DIP,18PIN,CERAMIC	IC,FILTER,BAND PASS/LOW PASS,CMOS,DIP,18PIN,CERAMIC	IC,FILTER,BAND PASS/LOW PASS,CMOS,DIP,18PIN,PLASTIC	IC,FILTER,BAND PASS/LOW PASS,CMOS,DIP,18PIN,PLASTIC	IC,FILTER,BAND PASS/LOW PASS,CMOS,DIP,18PIN,CERAMIC	IC,FILTER,BAND PASS/LOW PASS,CMOS,DIP,18PIN,CERAMIC	IC,FILTER,BAND PASS/LOW PASS,CMOS,DIP,18PIN,PLASTIC
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP
针数	18	18	18	18	18	18	18
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
有源滤波器类型	SWITCHED CAPACITOR FILTER	SWITCHED CAPACITOR FILTER	SWITCHED CAPACITOR FILTER	SWITCHED CAPACITOR FILTER	SWITCHED CAPACITOR FILTER	SWITCHED CAPACITOR FILTER	SWITCHED CAPACITOR FILTER
JESD-30 代码	R-XDIP-T18	R-XDIP-T18	R-PDIP-T18	R-PDIP-T18	R-XDIP-T18	R-XDIP-T18	R-PDIP-T18
JESD-609代码	e0	e0	e0	e0	e0	e0	e0
标称负供电电压 (Vsup)	-5 V	-5 V	-5 V	-5 V	-5 V	-5 V	-5 V
功能数量	2	2	2	2	2	2	2
端子数量	18	18	18	18	18	18	18
最高工作温度	85 °C	70 °C	70 °C	85 °C	125 °C	85 °C	85 °C
最低工作温度	-25 °C	-	-	-25 °C	-55 °C	-40 °C	-40 °C
阶次	8TH	8TH	8TH	8TH	8TH	8TH	8TH
封装主体材料	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY
封装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP
封装等效代码	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3	DIP18,.3
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
电源	+-5 V	+-5 V	+-5 V	+-5 V	+-5 V	+-5 V	+-5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
响应	LOWPASS/BANDPASS	LOWPASS/BANDPASS	LOWPASS/BANDPASS	LOWPASS/BANDPASS	LOWPASS/BANDPASS	LOWPASS/BANDPASS	LOWPASS/BANDPASS
最大供电电流 (Isup)	5 mA	5 mA	5 mA	5 mA	5 mA	5 mA	5 mA
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	COMMERCIAL	COMMERCIAL	OTHER	MILITARY	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
传递特性	ELLIPTIC	ELLIPTIC	ELLIPTIC	ELLIPTIC	ELLIPTIC	ELLIPTIC	ELLIPTIC
Base Number Matches	1	1	1	1	1	1	1

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