To all our customers
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
H8/3502
HD6433502
Hardware Manual
3/13/03
Notice
When using this document, keep the following in mind:
1.
2.
3.
This document may, wholly or partially, be subject to change without notice.
All rights are reserved: No one is permitted to reproduce or duplicate, in any form,
the whole or part of this document without Hitachi’s permission.
Hitachi will not be held responsible for any damage to the user that may result from
accidents or any other reasons during operation of the user’s unit according to this
document.
Circuitry and other examples described herein are meant merely to indicate the
characteristics and performance of Hitachi’s semiconductor products. Hitachi
assumes no responsibility for any intellectual property claims or other problems that
may result from applications based on the examples described herein.
No license is granted by implication or otherwise under any patents or other rights of
any third party or Hitachi, Ltd.
MEDICAL APPLICATIONS: Hitachi’s products are not authorized for use in
MEDICAL APPLICATIONS without the written consent of the appropriate officer
of Hitachi’s sales company. Such use includes, but is not limited to, use in life
support systems. Buyers of Hitachi’s products are requested to notify the relevant
Hitachi sales offices when planning to use the products in MEDICAL
APPLICATIONS.
4.
5.
6.
Preface
The H8/3502 is a high-performance single-chip microcomputer ideally suited for embedded
control applications. The chip is built around a high-speed H8/300 CPU core. On-chip supporting
modules include 16-kbyte ROM, 512-byte RAM, three types of timers, a serial communication
interface, host interface, and I/O ports, for easy implementation of compact, high-performance
control systems.
Development tools that support the functionally higher-end H8/3217 Series should be used for
H8/3502 program development.
The H8/3502 is also available as a ZTAT™ (Zero Turn-Around Time) version of the functionally
higher-end H8/3214. This version enables the user to respond quickly and flexibly to changing
application system specifications and the demands of the transition from initial to full-fledged
volume production.
There are a number of differences between the H8/3502 and the functionally higher-end H8/3217
Series. In terms of functions, the H8/3502 is available in only one ROM/RAM configuration, has a
maximum operating frequency of 10 MHz, and does not offer a guaranteed current dissipation
figure in standby mode, one of its power-down states.
The H8/3502 single-chip microcomputer is intended for consumer applications. If the user
requires a ZTAT™ version, larger ROM/RAM capacity, processing at a maximum 16 MHz,
significant power reduction in standby mode for portable systems, etc., or the high reliability
essential for automotive or industrial applications, the H8/3217 Series should be used.
This manual describes the H8/3502 hardware. Refer to the
H8/300 Series Programming Manual
for a detailed description of the instruction set, and to the
H8/3217 Series Hardware Manual
for
details of higher-end products, including ZTAT™ versions.
Note: ZTAT is a trademark of Hitachi, Ltd.
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